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Volume 54. No. 10
October 2025
ISSN 2632 573X
Editorial
Are surface-mount devices less reliable than through-hole?
This month, I became aware of the idea that some people think that
electronic devices populated with surface-mount devices (SMDs) are
somehow less reliable than those made with the older-style throughhole parts.
My first thought was to question why the packaging method of
a device affects its reliability. For example, the good old TO-92
package BC546 is available in an SOT-23 SMD package, as the
BC846. It has a lower dissipation rating of 310mW compared to
625mW, due to its smaller size, but the internals are identical. Other
than failing to take that lower dissipation rating into account (which
would be a design flaw, not a fault of the part), is there any reason to
believe that a BC846 should not last as long as a BC546?
In fact, SMDs were developed in the 1960s primarily for military
and aerospace applications specifically because they were more
reliable (and also more compact, which obviously helps when
you’re trying to fit electronics in a rocket or aircraft). That’s because
lead flex means that a component body on the end of leads will tend
to move around in response to vibration and shocks. That stresses
both the leads and the solder joints, risking eventual failure.
That doesn’t mean SMDs are always better; they are more sensitive
to board flex, for example. But in general, they are thought to be
more reliable, are cheaper to make, take up less space, offer better
RF performance due to the smaller size and so on. Of course, being
smaller means you need better eyesight to see and work with them
(unless you’re using a microscope), steadier hands and finer tools.
The myth of SMDs being unreliable likely persists because poorlyengineered budget devices use them – not because the parts
themselves are inherently inferior. When cheap gear fails, people
open it up and see SMDs inside, and assume a causal link.
When it comes to repairing devices, there are actually significant
advantages to SMDs. Yes, you need more skill to work on them,
but you can remove and reinstall them with access to just one
side of the board. It’s also possible to ruin multi-layer boards with
plated through-holes when removing through-hole parts (and it’s
frustratingly difficult, too).
Ultimately, the biggest obstacle to repair these days is lack of
documentation or replacement parts, not the difficulty of replacing
the failed components once you’ve identified them.
I understand why people might not like to work with small, fiddly
parts but they are not inherently any less reliable.
Nicholas Vinen, Electron Publishing (Australia)*
Publisher & Editor, Practical Electronics Magazine
* a division of Silicon Chip Publications Pty Ltd.
Practical Electronics | October | 2025
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