This is only a preview of the April 2026 issue of Silicon Chip. You can view 36 of the 104 pages in the full issue, including the advertisments. For full access, purchase the issue for $10.00 or subscribe for access to the latest issues. Articles in this series:
Items relevant to "PicoSDR Shortwave Receiver":
Articles in this series:
Items relevant to "DCC/DC Stepper Motor Driver":
Items relevant to "Calliope Amplifier":
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Contents
Vol.39, No.04
April 2026
20 The History of Intel, Part 3
The final part in our series concentrates on Intel’s present and future. That
includes their most recent desktop processors (Meteor Lake) and their
current attempt at making dedicated GPUs with Intel Arc.
By Dr David Maddison, VK3DSM
Electronics feature
44 Power Electronics, Part 6
The History of
Intel
Part 3: page 20
Image source: Konstantin Lanzet
https://w.wiki/GVqx
In this series of articles, we explore the principles of power electronics.
This month, we cover DC-AC converters and, for a practical example, we
calculate the thermal losses in the switching elements of an IGBT bridge.
By Andrew Levido
Electronic design
56 Whole-house Thermal Logging
Designing a home with many energy-efficient aspects was a big goal for
me when building my own house. One way I did this was by incorporating
multiple sensors (temperature, humidity etc) in various locations.
By Julian Edgar
Home temperature logging
92 Tektronix 2465B Oscilloscope
The vintage 2465B is an analog oscilloscope with some problems that
come with old age. It actually has a lot of the features that you would
expect from a digital ‘scope, but without the sampling or aliasing concerns.
By Dr Hugo Holden
Vintage Electronics
35 PicoSDR Shortwave Receiver
Supporting AM, AM-Sync, LSB, USB, FM & CW, this software-defined
shortwave radio receiver has a tuning range from 3-30MHz. It does all this
using a Raspberry Pi Pico or Pico 2.
By Charles Kosina
Radio project
50 DCC/DC Stepper Motor Driver
This compact design drives stepper motors and can take its speed signal
from either a DC voltage, or a Digital Command Control (DCC) system in a
model railway. It supports bipolar stepper motors with adjustable speed.
Part 6 by Tim Blythman
Model train / motor control project
66 Calliope Amplifier
The Calliope is an updated version of our old Hummingbird amplifier from
2021. We have used newer parts that are readily available (along with
alternative parts) and made minor improvements to the design.
By Phil Prosser
Audio project
78 Micromite-based Music Player
Using little more than a Micromite LCD BackPack and a DFPlayer Mini
module, this project can play MP3 files from a microSD card. It is capable
of driving a 4Ω loudspeaker.
By Gianni Pallotti
Audio project
Page 56
Whole-House
Environmental Logging
Page 78
Micromite-based
MUSIC PLAYER
2
Editorial Viewpoint
4
Mailbag
16
Circuit Notebook
65
Subscriptions
77
Kits
84
Serviceman’s Log
90
Online Shop
101
Ask Silicon Chip
103
Market Centre
104
Advertising Index
104
Notes & Errata
1. Digital vehicle compass
2. 44-pin Micromite adaptor
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SILIC
CHIP
www.siliconchip.com.au
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2
Silicon Chip
Editorial Viewpoint
Intel’s new mobile chips look good
The concluding article in our series on Intel this
month covers both their relatively new discrete graphics products (Intel Arc/Xe) and their tile technology.
Since that article was written, Intel has released its Panther Lake laptop/notebook processors, derived from the
Meteor Lake designs described in our article.
Now that reviews are appearing, it’s good to see that
these new chips from Intel are quite competitive and
offer excellent integrated graphics. It seems Intel is putting the Xe architecture
to good use in this case.
Like Meteor Lake, Panther Lake uses tiles, allowing CPU and GPU dies to be
manufactured separately and then combined into a single package using Intel’s
Foveros packaging technology. This approach is a key part of what allows such
high performance from a single chip while maintaining good power efficiency.
The ‘flagship’ model Intel has released is the Core Ultra X9 388H. It has four
performance cores, eight efficiency cores and four low-power efficiency cores
for a total of 16 CPU cores. There’s 18MB of cache in total and the cores can
run at up to 5.1GHz.
The all-important integrated graphics is the Intel Arc B390, with 12 Xe3
cores, 12 ray-tracing units and 96 vector/XMX AI engines, all running at up to
about 2.5GHz. That gives performance comparable to a discrete NVIDIA RTX
3050 GPU. So it appears Intel may be staging something of a comeback, at least
in the laptop/notebook processor market.
Comparing Intel’s new offering with those from its main competitor, AMD,
is a little challenging. That’s partly because it’s difficult to decide whether it’s
most appropriate to compare Panther Lake with AMD’s Strix Point (AI 340-375)
or Strix Halo (AI Max+ 380-395) series of chips. Let’s look at Strix Point first.
These are broadly similar in that both chips are designed for relatively
thin and light portable computers. In this comparison, the Intel chips have
roughly 10% better single-core performance, while the AMD chips are about
50% faster in heavy multi-core workloads. This is largely because all 16 cores
in the AMD design are high-performance types, compared with just four of 16
in the Intel chip.
However, Intel’s integrated graphics is roughly twice as fast as the integrated
Radeon graphics in Strix Point processors. Intel’s chips also appear to offer
somewhat better overall power efficiency.
Things change a bit if Panther Lake is compared with AMD’s Strix Halo processors. In this case, CPU performance is broadly similar, but the Strix Halo
‘integrated’ graphics is much faster than Intel’s. The quotation marks are because
it’s closer to having a discrete GPU integrated into the same package as the CPU.
As a result, these chips tend to appear in larger and more powerful systems.
That is partly because Strix Halo uses a much wider memory interface, giving the GPU far more bandwidth than a typical integrated graphics system. So
Intel’s offering seems to sit in a useful middle ground: good CPU performance,
strong graphics capability and excellent power efficiency in a relatively compact package.
To round out the picture, Apple’s higher-end chips offer more graphics power
than Intel’s Panther Lake processors, although they are not quite as powerful
as AMD’s Strix Halo designs. Apple chips can also provide very strong CPU
performance for certain workloads, although AMD and Intel processors still
tend to perform better in heavy multi-core workloads and intense numerical
computation.
It’s great to see strong competition in the CPU market – it keeps everyone
on their toes.
by Nicholas Vinen
Cover background: https://unsplash.com/photos/an-abstract-blue-background-with-wavy-lines-VhG_oPx5CEY
Australia's electronics magazine
siliconchip.com.au
MAILBAG
your feedback
Letters and emails should contain complete name, address and daytime phone number. Letters to the Editor are submitted on the condition that
Silicon Chip Publications Pty Ltd has the right to edit, reproduce in electronic form, and communicate these letters. This also applies to submissions to “Ask Silicon Chip”, “Circuit Notebook” and “Serviceman’s Log”.
PicoMSA Logic Analyser Pico 2 upgrade
Tim Blythman’s article on updating projects that use the
original RP2040-based Pico board to the newer RP2350 Pico
2 board, in the March 2025 issue (siliconchip.au/Article/
17796), prompted me to test the Mixed-Signal Logic Analyser (September 2024; siliconchip.au/Article/16575) with
the updated processor board.
While the re-compiled firmware worked well with a Pico
2, the speed benefits were marginal as the original project
already overclocked the original Pico processor.
While testing the revised configuration, I came across
alternative firmware and software that, when coupled with
a Pico 2 microcontroller, allows it to operate at 400MHz in
‘blast mode’ (see photo below). The software was developed
by Augustin Bernad (aka El Dr Gusman). You can find it at
https://github.com/gusmanb/logicanalyzer
The firmware and software are fully compatible with the
Mixed-Signal Logic Analyser hardware, with the exceptions
that only 16 channels are supported and the new software
does not have any analog capture capability.
There is a substantial Wiki attached to the repository,
plus compiled firmware and software to download at https://
mega.nz/folder/SGxDHAZL#afLGgQbJAaqOYXjhJBwokQ
The software is available for Windows, Linux and macOS.
To benefit from the latest features and ‘blast mode’ capture, download version 6.5 of the software and the ‘turbo’
firmware. The Windows software I tested was in the file
4
Silicon Chip
“all-in-one_6.5.0.0-beta2-win-x64.zip”, with the firmware
in “logicanalyzer_6.5-beta2_BOARD_PICO_2_Turbo.zip”.
Richard Palmer, Murrumbeena, Vic.
More on synchronising LED Stars
I have finally tried the modification covered in Ask Silicon Chip, March 2026 (p100), under the heading “Synchron-
ising two RGB LED Stars”. The idea was for one ‘master’ Star
to drive several ‘slaves’. Sadly, it only worked for a while.
It was running on the bench and after about 20 minutes
I smelled something electrical that wasn’t right. Not quite
burning, but... I rushed over to switch them off, but too
late, the one driving them failed.
The problem was the microprocessor burning out. It
resembled a dodo – a fried one. Replacing that fixed it.
My guess is that the load on that one master processor
was too great. I have increased the four 330W resistors on
pin 11 to 1kW (still not really enough) and it seems to be
running OK. I have an additional 270W resistor in series
with the master Star. What I would say is that four running
together looks really great, as expected. So, I am going to
be ordering a replacement soon...
Also, regarding the Mains Power LED Indicator, are
you aware that mains-powered LEDs are available? I buy
them from LEDSales in Tasmania and find them a delight
to work with.
Brett Cupitt, Gympie, Qld.
Australia's electronics magazine
siliconchip.com.au
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Comment: The WS2812B LED data sheet doesn’t have an
input impedance figure (we assume it’s high) but it specifies an input capacitance of 15pF.
Simulating driving a 3.3V square-wave at 1MHz (higher
than the actual frequency) into a 330W resistor feeding a
15pF capacitor, the average current delivered is just 512μA.
The microcontroller’s I/O pin current rating is ±25mA, so
on that basis, you’d expect it to be able to drive roughly
50 Stars in parallel.
However, the peak current, when it is charging the 15pF
capacitor, is closer to 4.5mA. So we could reach the rating
with just five Stars. Extra stray capacitance, for example,
from wiring, would make the currents higher. The true limit
is likely somewhere between 5 and 50 Stars.
We wouldn’t expect four Stars to burn the chip out under
those conditions, but perhaps the stray capacitance from
the added wiring is much higher than estimated. If it’s
approaching several hundred picofarads, that could be
a problem.
Increasing the series resistance would reduce the peak
capacitor charging current, so we think your solution is
fine. Another option would be to use something like a hex
CMOS buffer IC to drive each Star so the load on the microcontroller doesn’t increase.
RGB Xmas Star and SMD soldering guides
Thank you for the RGB LED Christmas Star project in
the December 2025 issue (siliconchip.au/Article/19372).
It ended up working very well after my initial concerns
about soldering the SMDs to the board, including the 8-lead
AP5002 regulator chip.
I read your January 2026 editorial on “Myths about SMD
soldering” (siliconchip.au/Article/19550) and watched the
video you linked to. Like many hobbyists, I fear dealing
with SMDs, but the excellent YouTube video you linked to
demonstrates drag soldering using liquid flux.
I watched another video on SMD soldering using a flux
pen after that (https://youtu.be/PUFCDh9BxQU). It is a
great presentation and would reassure anyone reluctant
to attempt SMD soldering. It should give them the confidence to give it a try.
John Okey, Torquay, Qld.
Comment: flux gel makes it even easier since it doesn’t
vaporise so quickly (eg, Jaycar Cat NS3039 or Altronics Cat
H1650A). It stays around long enough to allow the solder
to reflow and form very smooth joints.
The most important thing about soldering SMDs is
to be gentle and patient. As long as you’re careful and
don’t damage the PCB or bend any pins, you can always
try again!
A fascinating circuit from the Apollo spacecraft
Vintage electronics is ever a popular subject for a great
many electronics enthusiasts, especially the ‘oddball’ topics
covered by authors like Dr Hugo Holden and Fred Lever.
During my regular wander through YouTube land, I came
across a fascinating yet totally obscure piece of ‘lost technology’ from the analog days.
As I had seen several of the producer’s other excellent
videos, I knew I wouldn’t be disappointed, and wow! What
a fascinating circuit! You can view the video here: https://
youtu.be/I6lNQU7pchM
Andre Rousseau, Auckland South, NZ.
6
Silicon Chip
Australia's electronics magazine
siliconchip.com.au
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Switching to Linux
I was reading R. C.’s letter in Mailbag January 2026 about
switching to Linux. My wife was using a Core i5 laptop
with 8GB of RAM with Windows 10. It would regularly
slow down and almost freeze; it was also constantly needing to restart for updates.
In addition, it had Wi-Fi network connecting issues (a
problem with Windows, not the hardware). I was getting
sick of having to troubleshoot these problems.
I decided to get my wife’s previous laptop, a Core i3 with
8GB of RAM with Windows 10 that she was using before,
swap out the hard drive and install Lubuntu Linux on it.
While there was a bit of a learning curve for my wife in
finding folders when saving documents, she says it’s going
well and it’s a lot faster than the Core i5 system running
Windows 10.
We also have another laptop with Lubuntu Linux, a
Core i5 and 8GB of RAM that we use in the lounge room
to connect to our TV, which is quite old. It has an analog
tuner that gets used with a PVR. The TV reception here is
hopeless, and a lot of the recordings are corrupted, so we
use the Linux laptop to watch catch-up TV.
I previously tried connecting Windows 7 and Windows
10 laptops to the TV via HDMI, but because the TV is so old,
they could not determine the correct resolution and couldn’t
be used. Lubuntu Linux connects straight up via HDMI, and
we have no problems with it finding the correct resolution.
For anyone who is sick and tired of Windows, there are
two Linux distros that I would recommend: Lubuntu and
Kubuntu. As the names imply, both are based on Ubuntu
and therefore have very good support and a huge range of
applications available, as R. C. mentioned.
I agree with your comment that Ubuntu is not very userfriendly for beginners, but Lubuntu and Kubuntu are very
similar to Windows XP and for anyone using Classic Shell
(start menu) on later versions of Windows. With the Classic
8
Silicon Chip
Shell start menu set like XP, they would be at home with
Lubuntu or Kubuntu. There’s also good online support for
anything that users may need help to do.
R. C. mentioned using the terminal occasionally. I often
use the terminal for updating and installing applications.
There are over a hundred different Linux distros that I know
of, and I have tried around 20 of them. According to the
AI, there are over 600 distros that are actively maintained.
I definitely recommend sticking with distros based on
Ubuntu, as they are a lot easier to set up and use than those
based on other distros like Arch.
The accompanying screenshot shows the menu open
and an update in progress in the terminal. Updates can
also be done graphically. It shows how much like Windows XP the menu is and how easy it is to use Lubuntu
compared to Ubuntu.
Bruce Pierson, Dundathu, Qld.
Comment: for the average person who just needs a web
browser, email, a word processor, spreadsheet etc Linux is
more than good enough and, as you say, it performs very
well, even on ‘outdated’ hardware. It’s also pretty easy to
install and set up these days.
Hifi Headphone Amp connector problem
Thanks for a great project and kit with the Compact Hifi
Headphone Amplifier (December 2024; siliconchip.au/
Series/432). I found the winding of the inductors and the
heatsinks on the transistors tricky, but otherwise it was a
straightforward build.
I managed to drill the holes sightly wonky on the case
and a bit oversized, but the case all snapped together. With
some high-quality headphones plugged into the 6.35mm
jack socket, the sound is magnificent.
I checked all the current draws and ripple voltages, performed the DC offset and bias adjustments, and it was all
correct and perfect. I powered it with 12V AC.
Australia's electronics magazine
siliconchip.com.au
I tested it by playing audio from a mobile phone and
from a laptop headphone output socket using an adaptor
to RCA plugs. There is no amplifier hiss; it goes very loud
and has very high-quality sound.
After I put together the case, out of curiosity, I tested the
3.5mm headphone socket. Using that socket, the sound
was all weird. With some songs, I could hear the piano
and guitars but no vocals. I figured out that CON4, the
jack socket on the PCB, was faulty. Logically, it could only
really have been the connector, as the amplifier was obviously working fine.
To verify that, I measured the resistance between the contacts on my headphone plug and got readings of around
30W for both the left and right channels. Then I plugged it
into the socket on the board and measured across the soldered pins. I got readings of nearly 1kW from the left and
right channels to ground. I must have damaged it pushing
it in or with heat soldering it.
I do reckon the 3.5mm socket is likely to fail. The 6.35mm
socket would be simpler inside I reckon, as well as being
bigger. Anyway, after replacing the 3.5mm socket, it sounds
great on both.
I compared the specifications of this design to commercially available headphone amplifiers. It seems your design
is quite high-fidelity and comparable to $300-800 products.
I live in a small house with my family; I never thought
about it before, but a headphone amplifier is good for serious
music listening if you have high-quality stereo headphones.
Edward Menzies, Kew, Vic.
Comment: 3.5mm jack connectors are famously weak
and can easily be damaged. That’s one reason we provided
the 6.35mm socket, which is favoured by musicians for its
robustness (although they still sometimes manage to break
them). It’s possible the part we received to make the kit
was already faulty, or perhaps it was damaged in transit.
This design was a conscious effort to make the simplest
possible headphone amplifier design that was still truly
hifi (although the second input was a bit of an indulgence,
albeit a useful one). We think the combination of low-noise
op amps and current-boosting output stages has worked
out very well and, as you say, the sound quality is excellent
given the relatively simple circuit and use of low-cost parts.
Improving the output stage in transistor radios
Reading Ian Batty’s article on the Columbia TR-1000
portable transistor radio (February 2026; siliconchip.au/
10
Silicon Chip
Article/19669) prompted me to provide the following tip.
One problem with old Class-B (or better put, Class-AB)
audio amplifier output stages was the shared emitter resistor for both the audio output transistors. It was a money-
saving thing.
If those transistors are not exactly matched in their static
gain (hfe) characteristics, the transistor with the higher
gain and thus emitter current tends to pull the other transistor with the lower gain & emitter current further out of
conduction, thereby aggravating the difference between
the two transistors.
So if one transistor has a higher current gain than the
other, the problem of asymmetry in the output waveform
is significantly magnified with a common emitter resistor.
For special vintage large-body transistors like this, it is
better to keep them for their historical significance. However, the output stage balance can be significantly improved
simply by using two separate emitter resistors (one for
each transistor). You can also tailor the values of each for
a near-perfect balance, even if the two output transistors
do not match each other in DC current gain.
Dr Hugo Holden, Buddina, Qld.
A VHF airband radio design
On page 104 of the January 2026 issue (in Ask Silicon
Chip), you have a request for a circuit diagram for a VHF
Air Band radio. A suitable design was published in the
British magazine Radio & Electronics World, September &
October 1982. I was a regular buyer of that magazine, Electronics Australia etc.
Having said that, I doubt if the RF chips used are still
available. I built the radio some time ago. It sits in my
kitchen to this day and has rarely been off; I even take it
on holidays with me. It works exceptionally well.
It worked the first time; there were a couple of minor published corrections. I removed the 10.7MHz filter; it resulted
in too much signal loss. It is quite sensitive with a good
signal-to-noise ratio (SNR), although I never measured it.
Aircraft radios are audible 225nmi (>400km) from home.
I tried several VHF preamps from various magazines but
none improved the SNR, so I gave up on that.
There were a couple of component failures over the
years, each of which I diagnosed and fixed. There’s nothing like a failure to force a complete understanding of how
a circuit works!
SC
Warren McTackett, Maitland, NSW.
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CIRCUIT NOTEBOOK
Interesting circuit ideas which we have checked but not built and tested. Contributions will be paid for at
standard rates. All submissions should include full name, address & phone number.
Digital Vehicle Compass
This digital compass is based on
a design from the July 2024 issue
(siliconchip.au/Article/16330). Tim
used an HMC5883L compass board.
I couldn’t obtain that so I used a
QMC5883L board with a GY271 compass chip. Although similar to the
HMC5883L, it needs a different Arduino library.
This compass has been made for
vehicle dashboard mounting, with
the compass board mounted on an
Arduino Uno shield, along with
some other circuitry. An alternative
position for the compass board is in
a small Jiffy box mounted elsewhere
and connected to the main unit by a
Cat5 cable.
This may be necessary if unresolved
magnetic interference or distortion
is experienced with the Uno shieldmounted version.
Included in this design is a temperature and humidity module. This
can be mounted remotely, via a Cat5
cable if desired, similar to the optional
external compass module. The unit
includes a vehicle battery state monitor and automatically dims the LED
display when the vehicle lights are on.
To ensure accuracy and reduce
interference, place the compass unit
with the compass board in situ, as far
from known magnetic sources (meters,
motors, current-carrying wires, metal
objects etc) as possible. The compass
module used should be mounted horizontally, with the x,y label in line with
the vehicle’s fore/aft axis.
The battery state monitor measures
the incoming 12V supply and indicates it on the LED display at startup
and any time the reset (red) button
is pressed. The display first gives the
battery voltage, then the estimated
charge percentage remaining (for
either an SLA or FLA 12V battery,
chosen in the Arduino sketch). If the
engine is running, it will show the
charging voltage.
The temperature and humidity monitor uses an FHT20 sensor, which can
be placed at any convenient position
16
Silicon Chip
in the vehicle if connected via a Cat5
cable.
The black and green buttons adjust
the LED display brightness at any time
the unit is powered, while the blue
button switches between degrees and
a cardinal (compass) point readout. If
the vehicle lights are on, the brightness
is reduced to a minimum value preset
in the Arduino sketch. The current
brightness level is saved in EEPROM
and recovered at power-up.
The compass starts when the auxiliary vehicle supply is switched on. It
shows, in sequence, the battery voltage, battery % remaining, temperature
and humidity. Pressing the red reset
button will give these values any time
they are required.
If the battery voltage drops below
20%, the display will cycle through
the voltage and the vehicle heading
readings. If the battery charge remaining is 10% or below, the display will
flash FLAT.
Calibration
The compass board as delivered is
unlikely to give accurate readings. Two
types of magnetic distortion influence
compass accuracy: hard iron and soft
iron. Hard iron distortion is caused
by magnetic fields from devices like
motors and speakers. This distortion will calibrate out provided it is
constant and minimised by compass
placement.
Soft-iron distortion is caused by the
presence of high-permeability materials that distort the Earth’s magnetic
field. This distortion is hard to counteract.
Distortion caused by vehicle wiring
such as lights, starter motors etc that
are used intermittently cannot be calibrated out.
Calibration is normally done in all
three axes (x, y & z). With this vehicle
compass, for simplicity, calibration is
only done in the x and y axes. Therefore, vehicle rocking and pitching may
produce temporary errors.
To re-calibrate the compass, remove
Australia's electronics magazine
the declination by setting it to 0°. Press
and hold the blue button and momentarily press the red reset button. When
CAL appears on the display, release
the blue button and move the vehicle around covering all bearings until
CAL goes away (maybe a few minutes).
Now ‘swing’ the compass by driving slowly around a full circle, observing the vehicle heading compared to a
compass held away from the vehicle
(do this in a quiet parking lot or paddock, not on a public road!). If a mobile
phone compass is used here with the
local declination set in, set the vehicle compass declination to the local
value first.
When I tested the Compass on the
dashboard of my hybrid car, calibration could not be achieved. A survey
of the vehicle showed large magnetic
deflections, so be warned. In this case,
an external compass module would
likely be required.
After fitting the compass assembly (compass board in situ) in the
dashboard of a four-wheel drive offroad vehicle, calibration was not
good enough. The compass module
was then fitted to the centre console
between the front seats of the vehicle,
and a very acceptable calibration was
achieved (no more that a 5° error in a
four-point check).
Declination
The Earth’s magnetic field is not
lined up with geographic (true) north
and varies around the globe. For this
reason, the declination (horizontal
magnetic angle away from true north)
needs to ‘wound out’. For example, in
Auckland, it is 20°E.
Use Google to establish local declination. To alter the declination, press
and hold the black button and use
the green and blue buttons to set the
local declination. The setting will be
saved after releasing the black button.
In time, the declination may change,
so a reset to a different value may be
necessary.
Small errors in calibration in one
siliconchip.com.au
direction (clockwise or anti-clockwise) can be taken out by adjusting
the declination.
Offset
The compass board can be orientated in one of four 90° positions relative to the fore and aft axis of the vehicle. To set the offset, press and hold
the black button, then momentarily
press reset (the red button), wait for
the desired offset to show on the display and release the black button. The
offset setting will be saved.
Power supply
The vehicle’s 12V supply will contain significant transients and noise.
The 10W series resistor and TVS1 will
help to suppress the worst of them.
TVS1 conducts at about 18V. D2 is
a reverse-polarity protection diode.
siliconchip.com.au
The buck regulator module efficiently
derives the required 5V to run the rest
of the circuit, while ZD2 protects the
downstream components from overvoltage.
Two resistive dividers allow the
Arduino to monitor the battery voltage (A0) and lights on/off (A1) via software. ZD1 protects the Arduino from
overvoltage on the A0 pin. The Arduino uses a 1.2V reference provided by
REF1 for making accurate analog voltage measurements.
When the headlamps are on, the A1
input rises to about 1V and the LED
display is dimmed.
Software
There are some settings available in the sketch (siliconchip.au/
Shop/6/3611) to optimise the compass
performance. In particular, the range
Australia's electronics magazine
can be set to 2G (0.2mT) or 8G (0.8mT).
The range is set to 8G because initial
road tests showed that the Arduino
registers could overflow otherwise. If
desired, this setting can be changed
in the sketch.
Murray Tricker,
Auckland, NZ ($120).
Circuit Ideas Wanted
Got an interesting original circuit
that you have cleverly devised? We
will pay good money to feature it in
Circuit Notebook. We can pay you
by electronic funds transfer, credit
or direct to your PayPal account. Or
you can use the funds to purchase
anything from the Silicon Chip
Online Store. Email your circuit
and descriptive text to editor<at>
siliconchip.com.au
April 2026 17
Jury-rigged 44-pin Micromite
I needed a 44-pin Micromite module (August 2014; siliconchip.au/
Article/7960) but didn’t have a PCB
handy. Instead, I built an equivalent
device using a 44-pin QFP (0.8mm
pitch) adaptor board I had, along with
a USB/serial module.
Because of the narrowness of this
adaptor board, it doesn’t have throughholes for all the pins. However, it does
have SMD pads on the underside for
all 44 pins. My solution was to solder
two right-angle headers to the underside of the adaptor board, spaced
apart correctly to fit into a breadboard
with a 0.7-inch (17.78mm) or 1.1-inch
(27.94mm) separation.
Once the SMD microcontroller has
been soldered, you can add the 47μF
SMA tantalum capacitor between pins
6 & 7 (striped [positive] end to pin 7)
and a 10kW M2012/0805 SMD resistor
between pins 17 & 18.
Next, solder the two 22-pin right-
angle headers on the underside of
the adaptor module, as shown in the
photo. To keep them the correct distance apart, use two female headers
and insert the pins either 7 or 11 rows
apart until a few pins
have been fully soldered onto the adaptor
module.
Next, just solder a few
thin wires on the underside of the module: red
wires joining pins 17, 28 &
40 and grey/black wires joining pins
6, 16, 29 & 39.
Attach the USB-to-serial module
using double-sided adhesive tape,
by placing it on the lower end of the
adaptor board inline with pins 22-23.
Then join its terminals to the pins on
the modules, as shown in the accompanying diagram.
If the chip has not already been
programmed, you can download the
Micromite Mk2 firmware (siliconchip.
au/Shop/6/2907) and load it onto the
chip using a PIC32 programmer by
soldering wires to pins 18 (MCLR), 21
(PGC), 22 (PGC) plus +3.3V and GND.
A Snap, PICkit or the Microbridge
(May 2017; siliconchip.au/Article/
10648) programmer can be used.
Gianni Pallotti,
North Rocks, NSW. ($70)
The finished
Micromite
is shown
above, with
the CP2102
mounted using
double-sided
tape. The photo
on the right
shows the
soldering jig
that I used
to align the
right-angled
headers.
Editor’s note: it’s a good idea to
solder 100nF 50V M2012/0805 SMD
X7R ceramic capacitors between pin
pairs 16/17, 28/29 & 39/40 for local
bypassing.
The circuit and overlay diagram for
the modified 44-pin Micromite. Note
the 47μF capacitor soldered between
pins 6 & 7, and the 10kW resistor
between pins 17 & 18.
18
Silicon Chip
Australia's electronics magazine
siliconchip.com.au
Image source: https://pixabay.com/photos/intel-8008-cpu-old-processor-3259173/
T
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s
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intel
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rt 3
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V
,
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Over the last two issues, we have traced Intel’s history from its beginnings in
1968 until recently. That included a lot of information on the primary product
that Intel is known for: computer CPUs. Now that we’ve caught up to the
present, we’ll investigate their current and future technologies.
W
e finished part two last month
with information on Intel’s
hybrid CPUs with high-performance
P-cores and high-efficiency E-cores.
They were introduced in their mainstream products starting with the 12th
generation Core CPUs launched in
2021, but those cores were still part
of a single, monolithic die.
That’s in stark contrast to their direct
competitor, AMD, which launched
its Ryzen 2 series processors in 2019.
They used a different approach, combining multiple silicon die “tiles” (or
“chiplets”) to form a complete CPU.
Intel started doing something similar
in 2023, although with some important differences.
New interconnection
techniques
Microprocessors and AI chips
are now so complex and contain so
many components that the silicon
area required exceeds that which can
be produced by a single lithography
reticle field. That is, the area that a
design can be projected onto, currently
20
Silicon Chip
around 858mm2 or a rectangle of about
26 × 33mm. This means that multiple
chips are required to fulfil the latest
designs.
Also, even if it’s possible to make
a 26 × 33mm chip, yield (ie, the percentage of chips that are usable) drops
with increasing die size, so it’s more
economical to make multiple smaller
dies than one large one.
These smaller chips are called
(generically) chiplets, and processor
designs may comprise a variety of
different chiplets such as CPU, GPU,
AI accelerators, memory, I/O etc, as
described last month for Meteor Lake
(siliconchip.au/Article/19823).
Intel’s preferred name for the generic
chiplet is “tile”; this describes their
specific implementation of the chiplet
approach, but in their literature and in
industry, both terms are used.
The chiplet approach was popularised by AMD with its Ryzen 2
and EPYC processors, the first high-
volume products to use this approach.
AMD chiplets are mounted side-byside (with some exceptions, eg, 3D
V-Cache), while Intel’s tile approach
using Foveros technology can vertically stack tiles, allowing for higher
overall chip density – see Table 6.
Each chiplet or tile is specialised
and optimised, and can be “mixed
and matched”, including (critically)
using different process nodes in the
one package. The chiplets are connected by a variety of 2D (side-by-side)
and 3D (stacked) methods as part of a
modular design.
Meteor Lake
Meteor Lake, released in late 2023,
was Intel’s first consumer CPU to adopt
Feature size measurements
1 micron or 1µm: 0.001mm, 0.000001m (1 × 10-6m)
1 nanometre or 1nm: 0.000001mm, 0.000000001m (1 × 10-9m)
1 ångström or 1Å: 0.1nm, 0.0000001mm, 0.0000000001m (1 × 10-10m)
Australia's electronics magazine
siliconchip.com.au
Fig.41: a die shot of the compute tile of Meteor Lake, one of the four active tiles (see Fig.42). This version contains two
P-cores and eight E-cores. Source: https://x.com/Locuza_/status/1524465856167792640/photo/1
Fig.42: the function of the four tiles in a Meteor Lake processor’s base tile. Source: Intel – siliconchip.au/link/ac9v
siliconchip.com.au
the NPU (Neural Processing Unit) for
AI workloads.
Importantly, it also contains a separate cluster of low-power Crestmont
“LP E-cores”. These ultra-efficient
cores form a ‘low-power island’ capable of handling light background and
OS tasks while the compute tile is
powered down, significantly improving idle and low-load power consumption. This is why the SoC tile
occupies such a large proportion of
the total area.
● I/O tile: provides high-speed I/O
such as PCIe, USB4/Thunderbolt, display PHYs (physical layers) and memory PHYs. It is built on a mature TSMC
process (N6), well suited to mixed-
signal and I/O circuitry.
Underneath all these is the base
tile, which mechanically supports
the active tiles and provides the high-
density interconnect between them.
Intel uses technologies described
overleaf, such as Foveros 3D stacking, EMIB (Embedded Multi-Die Interconnect Bridge) and TSVs (Through-
Silicon Vias) to bond the tiles together.
Australia's electronics magazine
Graphics Tile
SOC Tile
IOE Tile
a tile (chiplet) architecture (Figs.41 &
42). Instead of a single monolithic die,
the processor is built from multiple
specialised tiles, each manufactured
on the most appropriate process node
for its function. The design includes
four active tiles plus a passive base tile:
● Compute tile: contains the
high-performance Redwood Cove
P-cores, the main cluster of Crestmont
E-cores, their associated L2/L3 caches,
and the core interconnect fabric.
This tile is manufactured on Intel
4, Intel’s first EUV-enabled (extreme
ultraviolet) process, chosen because
the CPU cores benefit most from cutting-edge lithography. As a result, it
isn’t the largest tile on the chip.
● Graphics tile: includes the Intel
Arc integrated GPU, based on Xe-LPG
architecture. It is manufactured by
TSMC (N5/N6 process).
● SoC (System-on-Chip) tile: the
largest tile, made using Intel 6 process.
It contains a wide range of system-level
functions: the media engine, display
engine, power management, memory
fabric, connectivity controllers and
Compute Tile
April 2026 21
Fig.43: a better look at the die, and tile structure, of Meteor Lake. Compare it to Fig.42. Source: https://wccftech.com/intelcore-ultra-meteor-lake-cpu-die-shots-closer-look-at-various-cpu-gpu-io-chiplets/
Fig.43 provides further information on Meteor Lake die, illustrating
the arrangement of tiles and interconnect structures. Meteor Lake’s modular design allows Intel to update or
replace tiles independently, mix process nodes, and reduce wafer costs
while improving yields.
It also represents a major architectural shift: by moving media, display,
AI acceleration and low-power processing to the SoC tile, the compute tile
can power down completely, delivering better efficiency than previous
Intel laptop processors.
Foveros Direct 3D
Foveros Direct 3D is an Intel chiplet (tile) connection technology for the
direct attachment of a tile to an active
base die. The second generation of this
technology uses copper vias in the tiles
with a pitch of 3 microns (3μm).
Attachment can be by thermocompression bonding, using heat and
pressure to join individual tiles to
the underlying die. Foveros replaces
the earlier solder-based microbumps
and provides a much higher (10100×) interconnect density, plus better power and thermal performance
– see Fig.44.
EMIB
Intel Embedded Multi-die Interconnect Bridge is a silicon ‘bridge’ embedded in a substrate to connect between
tiles – see Fig.46.
Intel Foundry FCBGA 2D+
Intel’s Flip Chip Ball Grid Array
2D+ is a type of processor packaging
used in laptops, which replaces traditional pin grid arrays. A grid of solder
balls on the bottom mates with corresponding lands on the motherboard;
the chip is heated to solder it in place
– see Fig.45.
The processors are not removable,
replaceable or upgradeable except by
replacement of the motherboard. Processors designed for desktop platforms
use traditional LGA (land grid array)
pins and are removable.
PowerVia
In Intel’s earlier technology, all
external connections, for both power
delivery and signal I/O, were made to
the top layer of the chip. There was no
connection beneath the chip, which
provided only structural support and
heat transfer.
From the 18A process node, Intel
decoupled the connections for power
and signals, calling the method Power
Via. Thus, power is provided from
beneath the die, and signal connections are made on the top side – see
Fig.47.
This means that the power and signal
connections and routing can be independently optimised, giving 90% more
efficient area utilisation, lower power
consumption and lower voltage drop
Figs.44 & 45: the tiles (labelled “die”) are connected to an active base die using Foveros Direct 3D (left). Intel’s FCBGA 2D+
method for mounting processors on motherboards in laptops (right). Source: www.intel.com/content/dam/www/centrallibraries/us/en/documents/2024-02/intel-tech-clearwater-wp.pdf
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siliconchip.com.au
Table 6 – Intel vs AMD chiplet technology
Foveros 3D stacking of tiles
Chiplets mounted
and EMIB for connection
horizontally on an
between tiles. An active or
organic substrate.
passive base die or “interposer”
allows vertical stacking. The
interposer contains TSVs
(through-silicon vias).
Interconnects
High-bandwidth, low-latency
links between tiles; no need for
a full bus as they collectively
act like a single chip.
Infinity Fabric serial
bus for inter-chiplet
communications.
Simpler, but can
increase latency.
Scalability
Optimised for low power
consumption (eg, laptops).
Tiles can be swapped for
different applications.
Optimised for desktops
and servers with large
numbers of cores, eg,
128+ in EPYC.
Complexity and
cost
Complex and expensive to
assemble. Variants require new
base dies.
Simpler and cheaper.
Power efficiency
Almost no power overhead.
A small amount of extra
power is consumed by
interconnects.
RibbonFET
With Intel’s present 18A process
node, adverse quantum mechanical
and other effects are a significant concern. Hence, Intel developed the gateall-around (GAA) transistor architecture known as RibbonFET (Fig.49) to
mitigate effects like electron tunnelling, leakage currents and to provide
improved electrostatic control compared to the earlier FinFET (Fig.48).
While Samsung and AMD also have
GAA technology, Intel’s nanosheets
are engineered to be extremely uniform and scalable for their PowerVia
backside power delivery. Intel intends
RibbonFET + PowerVia to be a tightly
integrated technology pair.
Moore’s Law is over
From the 1960s until roughly 2016,
Intel largely followed, and was driven
by, Moore’s Law, doubling transistor
density every couple of years. But
physical and practical limits have
now been reached: quantum effects,
heat dissipation and lithography challenges mean that simple geometric
scaling is no longer providing the historical gains. Clock speeds have also
plateaued.
To improve performance, the industry has shifted focus. Instead of shrinking transistors indefinitely, manufacturers now rely on advanced packaging
technologies: stacking multiple chips
vertically (3D packaging, such as that
seen in AMD’s X3D series of CPUs),
using chiplets or tiles placed side-byside, and high-bandwidth interconnects such as EMIB to combine multiple dies in a single package.
New transistor architectures, like
Intel’s RibbonFET gate-all-around
design, increase performance and efficiency even when further shrinking is
impractical.
Power
Packaging
technology
(a 30% reduction) as well as an overall
6% performance improvement.
AMD chiplet
Signal
Intel tile
Power & Signal
Feature
Transistors
Fig.47: the old die connection
technology (left) compared to the
new PowerVia technology (right).
Source: www.intel.com/content/
dam/www/central-libraries/us/
en/documents/2024-02/intel-techclearwater-wp.pdf
Software and algorithms are also
evolving. Specialised architectures
– particularly GPUs and AI accelerators, which contain many parallel processing units – enable significant performance gains despite the
slowdown in raw transistor density
improvements.
Artificial Intelligence (AI)
Intel and its chips have a long history of involvement in AI. In the 1980s,
Intel collaborated in the development
of the Connection Machine, a massive
supercomputer built for AI research,
which influenced early neural computing. It was said to have provided
i860 RISC processors and custom
chips for the project.
In 1997, they launched the MMX
instruction set, which accelerated
multimedia and early machine learning tasks like image processing.
In 2013, Intel acquired Indisys,
a Spanish company specialising in
Fig.46: an
illustration of
various Intel
interconnect
technologies
for tiles.
Figs.48 & 49: the older
FinFET technology (left) and the
new RibbonFET technology (right).
Source: same as Fig.47
siliconchip.com.au
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April 2026 23
natural language processing and AI.
In the same year, they acquired Israeli
company Omek Interactive, which had
technology that enabled users to interact with devices via hand and body
gestures with 3D cameras.
RealSense makes 3D cameras, vision
processors and AI vision systems. It
was ‘incubated’ by Intel internally
from 2014 and spun off in 2025 as an
independent company.
In 2016, the AVX-512 x86 instruction set extension was released. It can
accelerate AI workloads by processing
in parallel using wide 512-bit registers,
speeding up machine learning, image
and speech processing and large language models (LLM).
In 2017, Intel acquired US company
Nervana Systems for its expertise in
deep learning software, which was
later integrated into Intel processors as
the Nervana Neural Processor (NNP).
However, that was discontinued, to be
replaced with Habana Labs’ technology, an Israeli company Intel acquired
in 2019 for their Gaudi2 and Gaudi3
AI accelerator technology.
In 2016, Intel purchased Movidius
for its vision processing chips. Also in
2016, Intel established the Nervana AI
Academy to train AI developers.
In 2017, Intel purchased Mobileye,
which specialised in autonomous
driving and related technologies.
In 2019, Intel released the oneAPI
suite of tools, libraries and a programming model for developing and
optimising AI applications across all
Intel hardware such as CPUs, GPUs
and FPGAs.
During 2019-2024, Intel produced
the Ponte Vecchio AI accelerator with
over 100 billion transistors and 47
tiles (chiplets) using five different
process nodes. It is to be replaced by
Gaudi2/3.
In 2022, Intel released the Gaudi2 AI
accelerator. The Gaudi3 was released
in 2023. It is claimed to be capable of
50% faster training than the NVIDIA
H100 at half the cost. Also in 2023, the
Meteor Lake series of processors was
released with integrated NPUs (Neural Processing Units) for on-device AI.
In mid-2026, Intel plans to release
the Jaguar Shores AI accelerator
designed for data centres. It will use
the 18A process node.
Graphics Processing Units
Intel has included integrated graphics in its CPUs since the mid-2000s
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Fig.50: an Intel Arc A770 graphics
processing unit. Source:
https://w.wiki/GdyA
and considering this, by
unit volume, has long been the
world’s largest GPU (Graphics Processing Units) vendor.
However, these integrated solutions were designed mainly for desktop display output and light graphics use. Intel left the performance
GPU market to AMD and NVIDIA
for decades.
The rise of AI changed that. GPUs,
originally designed for massively
parallel graphics workloads, proved
far better suited to machine-learning
tasks than traditional CPUs. Recognising that GPUs would become strategically important across consumer,
workstation and data centre markets,
Intel entered the discrete GPU space
in 2022 with the launch of the Intel
Arc family.
Arc is based on the Xe architecture,
which scales from integrated laptop
GPUs through to high-performance
compute accelerators. The first generation (Arc A-series, “Alchemist”)
included six desktop cards (from the
A310 4GB to the A770 16GB) and
seven mobile variants (A350M to
A770M – see Fig.50).
A second generation of Arc products (B-series, “Battlemage”) began
arriving in late 2024/early 2025 with
models such as the B570 10GB, B580
16GB and B50 24GB – see Figs.51
& 52.
Although Intel lacks a competitor
for ultra-high-end GPUs like AMD’s
Radeon RX 7900 XTX or NVIDIA’s
RTX 5090, Arc performs well in the
low to midrange when compared at
similar price points. Arc also offers
industry-leading AV1 video encoding
and strong efficiency, making it attractive for media, gaming and general-
purpose GPU workloads.
Driver maturity was initially a
weakness, but Intel has significantly
improved support, especially for older
DirectX 9, 10 & 11 games.
Intel’s long-term commitment has
occasionally been questioned, but
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multiple factors suggest Arc is
here to stay. Intel has already
announced future generations (“Celestial” and “Druid”), and its Xe graphics
architecture is now embedded in its
laptop CPUs, data-centre accelerators
and AI platforms.
With AMD and NVIDIA struggling
to meet global AI-related demand, a
third major competitor is beneficial
for the industry and consumers. It
therefore seems likely that Intel will
continue to refine Arc, with “C-series”
products expected to arrive sometime
in 2026, quite possibly in the first
half of the year if development stays
on track.
More details on Intel’s CEOs
Last month we provided a list of
Intel CEOs but with only a very brief
description of each person. Here is
some more detailed information on
some of the key figures who became
CEOs at Intel and their major contributions to the company.
Robert Noyce, 1968-1975
Visionary founder, and inventor of
the first monolithic IC.
Gordon Moore, 1975-1987
He defined Moore’s Law, which
gave Intel an objective to strive for:
increased chip density and performance each year.
Fig.53:
Andrew
Grove,
Robert Noyce
& Gordon
Moore in
1978; from
part one.
Source:
www.flickr.
com/photos/
8267616249
siliconchip.com.au
Figs.51 & 52: a render showing the parts breakdown for an Intel Arc B580 card and the die. Source:
https://newsroom.intel.com/client-computing/intel-launches-arc-b-series-graphics-cards
Andrew Grove, 1987-1998
A strict management disciplinarian,
driven by results, and the author of the
book “Only the Paranoid Survive”.
Craig Barrett, 1998-2005
He was a materials scientist and
focused on high-volume, reliable fabrication of microprocessors and the
“Copy Exactly” system, which standardised equipment, processes and
even minor details like the colours
each fabrication plant was to be
painted.
This approach was responsible for
the explosive growth of Intel during
the 1980s and 1990s. As CEO, he
brought the company through the dotcom boom and bust.
Paul Otellini, 2005-2013
He was the first non-engineer CEO
at Intel, bringing a sales and marketing
mindset to a company built by technical visionaries. In 1993, he oversaw
the rollout of the Pentium processor
and the “Intel Inside” campaign. As
CEO, he generated more revenue in
2012 (US$53 billion) than Intel had
seen in its entire prior history.
On the downside, he admitted to
missing the shift to mobile computing
and turned down a deal for the ARM
processor for the iPhone.
Brian Krzanich, 2013-2018
Brian Krzanich came from the manufacturing side of Intel, with experience in semiconductor process engineering and supply-chain operations.
As CEO, he pushed Intel to diversify beyond the declining PC market
toward what he called data-centric
computing.
This strategy included major acquisitions such as Nervana Systems (AI
accelerators) and Mobileye (autonomous driving technology).
He also promoted internal cultural
and workplace reforms, some of which
were praised and some criticised, particularly around restructuring and
workforce reductions.
By 2018, Krzanich’s strategy had
succeeded in changing Intel’s revenue mix: approximately half of Intel’s
revenue now came from data-centric
businesses rather than PCs, which was
a significant shift.
However, his tenure is strongly
associated with the 10nm process
delay, arguably the most damaging
manufacturing slip in Intel’s history.
Under his leadership, Intel attempted
to make too many major process innovations simultaneously. This opened
the door for TSMC and Samsung to
establish leadership in advanced process nodes and allowed AMD to regain
CPU market share.
Krzanich resigned in 2018 due to a
personal misconduct policy violation
unrelated to business performance.
Robert Holmes Swan, 2019-2021
He was a finance executive and an
external appointment from outside
Intel, and was Intel’s shortest tenure CEO. He contributed financial
stewardship, “cultural overhaul” and
“organisational unity” to the company.
Like Krzanich, he was also criticised
for delays related to the 10nm process node.
Patrick Gelsinger, 2021-2024
He was Intel’s chief technology officer (CTO) from 2001 to 2009. He managed the development of USB, WiFi
integration and was the architect of the
80486 processor, oversaw the development of the Pentium 4, Core, Xeon
and 64-bit computing.
Figs.54-59 (left-to-right): Craig Barrett, Paul Otellini, Brian Krzanich, Robert Swan, Patrick Gelsinger & Lip-Bu Tan.
Source: Craig Barrett’s photo – https://w.wiki/GkEz; all the other photos are from Intel Corporation
siliconchip.com.au
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April 2026 25
Table 7 – major Intel fabs
Years active
Location
Wafer size and process node
Notes
1968-1983
Mountain View,
California
2-inch (50.8mm), 10µm from
1972.
Mainly for research and to produce the
4004.
1984-1990s
Santa Clara, California,
3-inch (76.2mm), 8µm from 1974,
6µm from 1976.
Fabs 1-5. Produced the 8080.
1980-present
Chandler, Arizona
4-inch (101.6mm), 3µm from
1982, 0.13µm from 2001.
Produced 300mm wafers from
2000. Switched to 65nm in 2006,
45nm in 2008, 22nm in 2012, Intel
3 and 20A (cancelled) in 2024.
Fabs 12, 22, 32, 42, 52, & 62. Produced
the 80386. Core 2, 1st Gen. Core i7 and
4th Gen Core. Fab 62 will start Intel 18A
production in 2026.
1996-present
Hillsboro, Oregon
200mm, 0.25µm in 1998. 300mm,
130nm, in 2002. Supports Intel 4
and 3 as of 2023.
Fabs D1A-D & D1X. Mainly for research
and development (R&D).
1996-present
Kirygat, Israel
300mm, 45nm in 1996, 22nm in
2011,
Fab 28, Intel 7 in 2023.
2002-present
Leixlip, Ireland
300mm, 130nm in 2004, Intel 4 in
2023, Intel 18A in 2026.
Fabs 10, 14, 24 & 34.
2030-2032?
Licking County, Ohio
Intel 14A.
Fab 27, expected production dates
2030-2032.
He became CEO with a vision to
reclaim Intel’s manufacturing and
technology leadership and “bet”
US$100 billion plus on “IDM 2.0”
(Integrated Device Manufacturer)
to make Intel the world’s leading
foundry, and restore American chip
making dominance. He wanted Intel to
be a foundry that designs, makes and
sells chips both for itself and others.
Despite his bold strategy, he was
“ousted” by the board that lost confidence in him due to failure to reduce
process nodes fast enough, poor financial performance, and poor response
to the market such as missing the AI
boom that needed (NVIDIA) GPUs,
which Intel had failed to adequately
develop. During this time, Intel lost
market share to AMD.
Lip-Bu Tan, 2025-present
Ex-CEO of Cadence, a company that
provides software to design integrated
circuits (ICs) and PCBs (one of the ‘big
three’ EDA vendors that dominate the
global semiconductor design tooling
industry). He has BS in Physics, Master’s in Nuclear Engineering and Master of Business Administration.
He is attempting a turnaround of
Intel by slashing bureaucracy, doing
foundry deals and becoming more
customer-focused.
Intel’s development models
Until 2006, Intel had no formally
named development model, but
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improvements were a continuing
cycle of:
1. develop a new microarchitecture;
2. release it;
3. shrink the process size once or
more with incremental improvements
(eg, the P6 microarchitecture of the
Pentium Pro was shrunk three times);
4. repeat at irregular intervals as
technological improvements allowed.
After problems with the NetBurst
microarchitecture of the Pentium
4, Intel management decided they
wanted a more formal and disciplined
development model.
The process-architecture-optimisation (PAO) model was introduced in
2016 and remained in use until 2021
to address the limitations of the ticktock model (see our panel on p24 last
month). It operated on a three-year
cycle comprising three stages:
1. Process: a die shrink to the next
manufacturing node to give a higher
density of transistors, but typically
using an existing microarchitecture.
2. Architecture: a major redesign of
the microarchitecture for improved
performance.
3. Optimisation: iterative improvements to the architecture.
This model allowed Intel to introduce new processor generations every
12-18 months while spreading the risk
and cost of new process nodes over a
range of products.
Intel phased out the PAO model
around 2021-2023 as it was becoming
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increasingly difficult to develop new
process nodes on a three-year schedule. That’s similar to how the tick-tock
model was abandoned when further
feature shrinkage was no longer economically feasible.
The “process leadership” roadmap
was adopted around 2023 to emphasise node advancements such as Intel 3,
20A, 18A with less emphasis on strict
two- and three-year cycles, but with
a focus on “five nodes in four years”.
Note that the 20A process was cancelled in 2024, and they skipped from
Intel 3 straight to 18A. Taiwan Semiconductors was instead contracted to
make parts planned for the 20A node,
such as Arrow Lake.
Intel’s fabrication facilities
Some significant Intel past, present
and future fabrication facilities (fabs)
include those shown in Table 7.
Other Intel developments and
inventions
Apart from CPUs, GPUs, the x86
instruction set, memory chips and
related chipsets, Intel has also been
involved in inventing, innovating or
contributing in the following areas:
3D XPoint
This was a form of non-volatile
storage media technology developed
jointly between Intel and Micron. It
was introduced to the market in 2017
and discontinued 2022.
siliconchip.com.au
It was designed to fit in the speed
gap between faster traditional non-
volatile NAND flash and slower volatile DRAM.
It was marketed under the brand
name Optane (see Figs.60 & 61), Intel’s
commercial implementation of 3D
XPoint memory. Optane could act as
extremely fast cache storage for hard
drives, improving performance, but
its more significant role was in early
high-performance SSDs and in the
persistent-memory DIMMs designed
for data centres.
Optane was not made obsolete
by normal SSDs; rather, Intel discontinued the product line in 20222023 after its manufacturing partner
Micron exited 3D XPoint production
and demand failed to meet expectations.
Technically, Optane was exceptional: it offered dramatically lower
latency than NAND SSDs and
extremely high endurance. Because
of this, some users still prefer Optane
drives for specialised workloads.
XPoint was not based on traditional
charge storage in cells, but on a change
in some other physical property, generally thought to be a material phase
change, although Intel never confirmed this.
The structure of the memory chip
had multiple layers in a 3D stack. The
first generation of XPoint had two layers, and the second generation four
layers, allowing up to 256GB per die
– see Fig.62.
Accelerated Graphics Port (AGP)
The Accelerated Graphics Port was
introduced in 1996. It was a dedicated
graphics port intended as an improvement in speed over the PCI slots used
for other accessory cards.
It provided faster data transfer rates
with a dedicated connection to the
CPU, and dedicated memory bandwidth, which was necessary because
of the development of 3D graphics
and gaming.
AGP cards had their own memory
and could also access system RAM.
The first chipset to support AGP was
Intel’s legendary Celeron 440 series of
CPUs from 1997/1998.
In 1998, Intel also introduced the
i740 dedicated AGP graphics chip to
help promote AGP as a standard (see
Fig.63). AGP was superseded by the
PCI Express (PCIe) standard introduced in 2003.
siliconchip.com.au
Fig.60: Optane storage in an SSD (M.2) format. Source:
https://hothardware.com/photo-gallery/
article/2720?image=big_intel-optane800p-pair.jpg
Fig.61: Optane
is non-volatile
but fast enough to use like
system RAM! Source: www.forbes.
com/sites/tomcoughlin/2022/08/08/gifts-fromintels-optane-memory (from Intel)
Memory cell
Wire
Positive charge
Selector
Negative charge
Voltage affects selector, causing it to read/write the memory cell
Fig.62: the 3D XPoint technology used in Optane memory. The memory cells
are light grey and green, and the address lines (bit lines and word lines) are a
darker grey. Source: www.bbc.com/news/technology-33675734
Fig.63: the Intel i740 was their first AGP-slot graphics card. It was one of Intel’s
ealiest ventures into the dedicated GPU market. It wasn’t very successful,
compared to the NVIDIA GeForce 256 or 3dfx Banshee, which used a PCI slot.
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April 2026 27
One of the people at Intel who
worked on AGP was Ajay Bhatt – this
won’t be the last you hear of him.
ATX power supplies
These widely used PC power supplies and their compatible motherboards conform to a standard developed by Intel and released in 1995.
It replaced the AT form factor, which
originated with the IBM PC in 1981.
Flash memory
Intel introduced the first commercial NOR flash chip in 1988, marking a
major advance in non-volatile memory
technology. Intel later co-developed
3D NAND flash, with the first generation announced in 2015. By 2020,
Intel’s 3D NAND products had reached
144 layers and triple-level cell (TLC)
technology (three bits per cell).
In late 2020, Intel sold its entire
NAND and 3D NAND flash business,
including its Dalian fab, to SK Hynix
(now operating as Solidigm).
Ethernet
Ethernet was originally developed
at Xerox PARC (Palo Alto Research
Center) in the early 1970s by Robert
Metcalfe and colleagues.
In 1980, Xerox partnered with DEC
and Intel to create the DIX Ethernet
specification (also called Ethernet
v1.0 and later 2.0). This work formed
the basis for the IEEE 802.3 standard,
published in 1983.
Integrated graphics (iGPU) on
motherboards
This was introduced by Intel in
1982, in the form of the 82720 Graphics Display Controller. In 2010, Intel
integrated a graphics chip into the
CPU itself.
Nowadays, most Intel desktop and
laptop CPUs include an integrated
GPU, the exceptions being those with
an “F” or “KF” suffix. In those cases,
the onboard graphics circuitry is disabled. As always, for niche or OEMonly variants, it pays to check the specification sheet rather than rely solely
on naming.
Even if the CPU has onboard graphics, dedicated graphics cards can still
be added. In fact, it is usually possible
to use both simultaneously. An external card will generally have better 3D
performance.
Movidius Vision Processing Units
VPUs are specialised chips designed
specifically for accelerating computer
vision and related AI tasks. They allow
the processing to be offloaded from
the CPU and GPU, and can be used in
applications such as drones, robots,
smart security systems (to recognise
targets), real-time AI powered video
processing, machine vision, virtual
reality, augmented reality headsets
and smart cameras.
Such chips include dedicated hardware for deep learning, such as a Neural Compute Engine in the Myriad X
chip. They are designed for energy
efficiency. Intel acquired Movidius
in 2016.
The DJI Phantom 4 (see Fig.64),
released in 2016, was the world’s first
consumer drone with autonomous
flight capabilities thanks to a Movidius Myriad 2 VPU chip with functions
such as forward-facing obstacle avoidance and subject tracking. It can also
hover at a fixed location using object
tracking alone, without the need for
satellite navigation signals.
PCI
Peripheral Component Interconnect
was introduced by Intel in 1992 as a
modern, processor-agnostic expansion bus to replace ISA and EISA. It
quickly became the industry standard
throughout the 1990s and early 2000s
– see Fig.65. Ajay Bhatt – whom readers may recognise from several other
entries – played a key role in its design.
PCI Express
The PCI Express expansion standard
that’s widely used today was invented
by a consortium of companies including Dell, IBM and HP, although Intel
was the dominant player. It was introduced in 2003. Ajay Bhatt made a
major contribution to the development
of the specification.
Platform power management
PPM was co-invented by Ajay Bhatt
at Intel. It is a series of technologies
that dynamically adjust the CPU clock
speed and voltage to reduce power
consumption dependent upon processor load.
PresentMon
PresentMon is software used to track
performance primarily for games. It’s
mostly maintained by Intel (https://
game.intel.com/us/intel-presentmon),
and is useful for benchmarking.
Fig.64: the DJI Phantom 4 drone uses the Movidius Myrid 2 vision processing
unit (VPU). Movidius was acquired by Intel in 2016, although they haven’t
released any new products in the last few years. Source: www.pexels.com/
photo/a-drone-camera-across-the-blue-sky-4355183/
Thunderbolt
Thunderbolt is a high-speed interface developed by Intel in collaboration with Apple. It allows data, video
and power to be transferred through a
single cable, supporting devices such
as monitors, external storage, docks
and high-performance peripherals. A
Thunderbolt-supported USB-C port is
typically marked with a lightning-bolt
icon (see Fig.66).
Thunderbolt 5 is the latest standard, offering up to 120Gbps of
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bi-directional bandwidth using its
“Bandwidth Boost” mode when driving high-resolution displays, with a
base bandwidth of 80Gbps.
Although Thunderbolt was once
most strongly associated with Apple
systems, it is now widely available
across Windows laptops and desktops. Modern versions of Thunderbolt
use the USB-C connector, meaning the
same physical port may support USB,
Thunderbolt, DisplayPort and power
delivery.
In recent years, many Thunderbolt
capabilities have been incorporated
into the USB standard, particularly
with USB4 and USB4 v2, which are
based on Intel’s Thunderbolt 3 specification, contributed to the USB-IF
(USB Implementer’s Form).
USB
The USB interface was invented by
Intel’s Ajay Bhatt (him again!). He and
his team at Intel developed the first
USB standard, which was released
in 1996.
Wi-Fi
Intel has been a major force behind
Wi-Fi adoption since the early 2000s.
Their Centrino platform (2003) effectively made Wi-Fi standard in laptops,
pushing the entire PC industry toward
wireless networking.
Intel played significant roles in
the IEEE committees for 802.11n,
802.11ac, Wi-Fi 6 (802.11ax), and
Wi-Fi 7 (802.11be), contributing reference designs, test silicon, and architectural proposals. Today, Intel is
one of the largest suppliers of Wi-Fi
chipsets for PCs, and its engineering
teams continue to help shape future
Wi-Fi standards.
Fig.65: Intel developed both PCI (lower) and the more modern and faster PCI
Express (upper) expansion slots. PCI Express slots come in different lengths,
from a single lane to 16 lanes, and in different generations, from Gen1 to Gen6.
Source: https://w.wiki/GdyB (CC BY-SA 2.0)
Fig.66: while Thunderbolt 1 & 2 used
unique connectors, Thunderbolt 3, 4 &
5 use USB-C connectors. That means
the same ports can be compatible
with USB and Thunderbolt. Source:
https://w.wiki/GdyC (CC BY-SA 4.0)
Figs.67 & 68: Intel’s quantum
computer chip; bare die (above)
and in packaging (below). Source:
https://newsroom.intel.com/newtechnologies/quantum-computingchip-to-advance-research
Quantum computing
Intel is developing Tunnel Falls
(see Figs.67 & 68), an experimental
12-qubit quantum computer chip,
which is being made available to
researchers at universities and the US
military. A qubit is a basic element of
quantum information. Whereas a transistor can have two bit states, a 0 or 1,
a qubit can be a 0, a 1 or both simultaneously. It has an infinite amount of
superposition states, but when measured, it will still be a 0 or 1.
This ability can enable it to solve
many types of problems that are
insoluble or very slow to solve on
conventional computers, including
siliconchip.com.au
Australia's electronics magazine
April 2026 29
decryption. Intel’s silicon spin qubits
are up to 1 million times smaller than
other qubit types, and the Tunnel Falls
qubit chip is highly scalable.
Intel aims to sell both the computing hardware and software as a complete solution.
Past Intel failures
Intel, like any company, has had its
fair share of failures:
● The NetBurst architecture used
for the Pentium 4 was supposed to be
the way of the future, but it was a dead
end, never reaching the clock speeds
they were aiming for.
● Delays in the 10nm process node,
at least partly due to the failure to
adopt new technology such as EUV
lithography.
● Defects in large numbers of 13th& 14th-generation processors, leading
to an extended warranty and a large
number of warranty replacements.
● A failure to develop discrete
GPUs at the appropriate time.
● A failure to recognise the mobile
market.
● Turning down an offer from Apple
to make chips for the iPhone, along
with no longer supplying Intel CPUs
for Apple computers.
● The acquisition of McAfee, which
had little to do with Intel’s core business.
● Intel declined to invest in OpenAI
in 2017.
● Losing its dominant position in
the CPU market to AMD after spending many years making minimal gains.
Intel processor model differentiation
Intel produces or recently produced the Core, Xeon, Pentium, Celeron and “Intel
Processor” models of microprocessors. They are differentiated as follows:
Core: Intel’s main CPU product line
Xeon: The enterprise and workstation product line
Pentium: Once the mainline product, later becoming the entry-level
processor line. Retired in 2023.
Celeron: The even more entry-level processor line. Retired in 2023.
Intel Processor: the replacement for the Pentium and Celeron models.
▪
▪
▪
▪
▪
From left-to-right: the original Pentium logo from 1993, the Celeron logo used
during 2008, and the current Xeon and Core logos.
● Failure to take the lead in providing hardware for AI.
● In 1972, they purchased the
Microma watch company to produce
complete digital watches, but struggled in the market and sold the company in 1977.
● Intel purchased Basic Science in
2014 to enter the fitness tracker market, but the product was discontinued
after Intel acquired it.
Intel also had a series of CEOs
that stifled innovation and even got
involved in social politics and moved
the focus away from its core mission
of being a chip company. There were
also inappropriate share sales by a
CEO before bad news was announced
Fig.69: Intel’s Gaudi3 chip costs about US$16,000, has 128GB of HBM (highbandwidth memory), and is meant for AI applications. Source: https://
newsroom.intel.com/artificial-intelligence/next-generation-ai-solutions-xeon-6gaudi-3
30
Silicon Chip
Australia's electronics magazine
regarding the discovery of a chip security vulnerability.
Conclusion
In this series, we have covered the
founding of Intel and how it “accidentally” became a microprocessor
company after being asked to produce
a calculator chipset. We examined
Intel’s early focus on memory chips, its
loss of the DRAM market to Japanese
competitors, and its subsequent shift
to becoming an almost exclusively
microprocessor-focused company.
We then detailed the 8008’s adoption by hobbyists, the selection of the
8088 for the IBM PC and how that decision fuelled the explosive growth of
personal computing. From there, we
followed Intel’s development of the
80286, 80386 and 80486, and later the
Pentium and Core series, charting how
Intel maintained a leadership position
for decades.
Intel made a big mistake around
2005/2006 when it declined a request
from Apple to make iPhone chips and
was mind-bogglingly overambitious
when it came to the NetBurst design.
From the 2010s, Intel further stumbled, failing to develop the 10nm node
in a timely manner (again, because of
overambition) and failing to recognise
many market opportunities, including the mobile market, which allowed
competitors to take hold.
It is now trying to remake itself with
new, better processors, new foundries, new management, job cuts and a
commitment to re-establish itself as a
SC
market leader.
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PicoSDR
Shortwave Receiver by Charles Kosina, VK3BAR
My SSB Shortwave Receiver, published in June & July last year, is a classic
superheterodyne receiver (siliconchip.au/Series/441). This one is quite different – it
uses a Raspberry Pi Pico to implement a software-defined radio (SDR). This is the first
standalone SDR published in Silicon Chip.
Tuning range: 3-30MHz
Minimum tuning step: 10Hz
Modulation support: AM, AM-Sync, LSB, USB, FM, CW
AGC: adjustable speed & gain
Power supply: 7-9V DC from plugpack or internal battery
SNR/sensitivity: 10dB for 1μV input over 3-10MHz; 5μV <at> 30MHz
Display: OLED with optional external TFT LCD screen
T
here is nothing wrong with the
classic superhet design, but
with advances in digital technology, you won’t find too many radio
receivers built that way anymore. The
various analog circuits have been
largely displaced by programs running on high-speed processors. As a
result, this receiver is quite a bit simpler and easier to build while being
more capable.
About three years ago, I bought a
couple of Raspberry Pi Pico modules
with the intention of doing ‘something’
with them. After some half-hearted
siliconchip.com.au
Bandwidth: adjustable
Audio output: internal speaker or headphones
Squelch: optional & adjustable
attempts at designing something
with them, I put them back in their
box. Recently, though, I came across
a GitHub project using the Pico as the
basis of an SDR (siliconchip.au/link/
ac9m).
This was the first of what turned out
to be a four-part series written by Jon
Dawson. To quote Jon:
The receiver covers frequencies
up to 30MHz, including commercial
broadcasts on Longwave, Medium
Wave, Shortwave, and the HF amateur radio bands. What’s great about
this design is that it’s completely
Australia's electronics magazine
Antenna connector: BNC
standalone—it doesn’t need a PC or
sound card and can run for hours on
just three AAA batteries.
I decided to design a receiver based
on his articles, but with some enhancements. I recommend that you read
all the articles as the design is quite
complex. The mathematics written
to decode all the modes is extremely
advanced.
Jon does describe everything in the
articles, but to fully understand what
he’s doing, you need a good knowledge of communications theory at
an advanced tertiary level, and C++
April 2026 35
programming. My electronics engineering degree was of some help, but
goes back many years and predated
many of the current techniques.
I will not attempt to reproduce
the mathematics in those articles; it
makes for interesting reading, but a
full understanding is not required to
build this Receiver.
The starting point of SDR designs
is producing the in-phase (I) and
quadrature (Q) signals from the input
signal. This is achieved by multiplying the signal by local oscillators 90°
out of phase. It is important that the
amplitudes and phases of the signals
are accurate.
The traditional way in the past was
to use double-balanced diode mixers,
like the circuit shown in Fig.2. However, this requires close matching of
all components and is an expensive
way of doing things.
Dan Tayloe published a paper titled
“Quadrature Sampling Detector”,
where the same multiplication is performed with an analog switch: www.
norcalqrp.org/files/Tayloe_mixer_
x3a.pdf
The incoming signal is mixed with
a two-phase local oscillator, with 90°
phase shift between them. We get
36
Silicon Chip
four outputs, each containing the sum
and difference between the input frequency and the local oscillator, but
with phase differences of 0°, 90°, 180°
and 270°. We are only interested in the
difference frequency; a simple RC lowpass filter eliminates the sum.
If the local oscillator and input frequencies are the same, we recover the
two baseband signals with different
phase shifts. Following the quadrature
detector, we have two low-noise, highgain op amps that give us the amplified I and Q signals, 90° out of phase.
As it is described below, the local
oscillator signal does not have to be
at the same frequency as the incoming signal; instead, it is offset to give
an intermediate frequency (IF) output.
Now that we have the I and Q signals, digital processing takes over.
They are sampled with analog-to-
digital converters (ADC) at a very high
sampling rate. The Nyquist criterion
means the sampling rate needs to be at
least double the required bandwidth.
Two-phase local oscillator
In many designs, the two-phase
local oscillator is generated using the
Silicon Labs Si5351A clock-generator
chip. This is extremely cheap and
Australia's electronics magazine
is ubiquitous in lots of commercial
radios, signal generators and spectrum analysers. But the RP2040 chip
on the Pico module is extremely powerful and fast, so it is possible to use
it to generate the quadrature signals.
It has a somewhat novel feature: a
programmable state machine that can
offload IO functions from the software
and generate the quadrature outputs
on two I/O pins (I write “somewhat”
because some newer PICs have similar hardware). Once this is configured,
it runs autonomously without software intervention. But it isn’t quite
that simple.
Because this is a digital oscillator
that’s timed using the chip’s global
phase-locked loop (PLL), the output
resolution is not nearly enough, and
as the frequency increases, so does
the step size. The step size is as large
as 8kHz.
To achieve a step size of 1Hz, the
software implements a second, very
high-resolution numerically controlled oscillator (NCO) that shifts
our IF to baseband. The IF is typically
4.5kHz, but it is varied slightly in conjunction with the NCO and gives a
theoretical resolution of 0.0001Hz, far
more than required for a 1Hz step size.
siliconchip.com.au
Fig.1: the RF
board for this
radio bears some
similarity to the
SSB Shortwave
Receiver
published last
year, but it’s
considerably
simpler since
most of the
processing after
the tuning and
RF gain stage
is performed
digitally. IC2
is a digitally
controlled analog
multiplexer chip
that, under the
Pico’s control,
mixes the RF
signal with a
local oscillator and produces the I/Q
signals to feed back to the Pico for
audio extraction.
If this sounds complicated, that’s
because it is, and requires very clever
coding to generate our local oscillator.
Processing the I and Q signals
Processing of the signals to decode
amplitude modulation (AM), frequency modulation (FM) and single
sideband (SSB) is beyond the scope
of this article. If you’re interested in
how it works, I recommend you read
the articles written by Jon Dawson at
the link above.
Choosing a Pico module
The Pico 2 module using the
RP2350A processor is considerably
more powerful than the original Pico
module that uses the RP2040 chip. The
RP2350A also fixed a bug in the analog-
to-digital converter (ADC) module
within the chip, although the amount
of averaging applied and noise present in this circuit means that bug does
not currently affect its performance.
So both modules can be used in
this radio, with no real difference in
the user experience. The advantage of
using the Pico 2, which costs a couple
of dollars more, is future-proofing it.
While the Pico can handle the processing load at the moment, features may
siliconchip.com.au
be added in the future that require the
Pico 2 to work, or at least to work well.
So, we suggest you spend the extra
couple of dollars and get the Pico 2
module, but there will be no immediate benefit. You need to load the right
firmware – there are separate files for
the Pico and Pico 2.
For more details on this subject, see
siliconchip.au/link/ac9n
We recommend that you purchase a
genuine, original Pico or Pico 2. There
are clones in existence, and they work,
but our testing shows that they are not
directly compatible and will not work
in this project without significant modifications to the board. So stick with
the original.
RF board circuit
Like my SSB Receiver design, this
receiver uses two circuit boards, a control board and an RF board. The circuit of the RF board is shown in Fig.1.
The left-hand side is very similar to
the July/August 2025 SSB Shortwave
Receiver front-end (siliconchip.au/
Series/441), but it has some improvements incorporated.
Two schottky diodes on the antenna
input limit the input voltage to a safe
level.
Australia's electronics magazine
Fig.2: an old-fashioned doublebalanced mixer uses two
transformers and four diodes
as shown here to mix the local
oscillator (LO) and tuned antenna
(RF) signals. The signal at the IF
OUT terminal includes several
new signals, one of which is the
desired intermediate frequency
(IF) signal.
To control the tuning, there are three
digital lines from the Pico: BAND0,
BAND1 and BAND2. They go to a
three-to-eight decoder IC (IC1) that
selects filters on the antenna input.
They could be fixed bandpass filters,
but that would require numerous components. I opted for a similar technique to my SSB receiver and used
two high-Q toroidal inductors.
The 74HC238 chip selects different-
value capacitors to roughly tune the
radio to the centre of eight different
bands. A BB201 dual varicap diode is
then used to make the antenna circuit
resonate at the input frequency; only
half of it is used. This has a capacitance of 118pF at 0.5V and 27pF at 8V.
The minimum capacitance, including stray/parasitic capacitance, is
about 35pF. This requires an inductor
value of 0.8µH at 30MHz. At 10MHz,
we need 7µH. See Table 1 overleaf for
the frequencies of the eight different
ranges.
These are chosen so that they are
within range of the varicap tuning and
the fixed capacitors across the input
inductors. The changeover between
the two toroids is 10.2-10.3MHz; you
will hear the relay click on this transition. There are no capacitors switched
in for Band 8, so there is no setting.
Seven NPN transistors are used to
select the capacitors (not eight, as the
highest frequency uses just the varicap). These are BFR92P devices chosen for their very low collector-to-base
and emitter capacitances. The relay
is switched by the BAND2 signal,
buffered by two N-Channel Mosfets,
April 2026 37
The top and bottom of the Control Board for the PicoSDR Receiver.
Q8 and Q9. A diode across the relay
absorbs the switch-off transient.
The BF998 dual-gate Mosfet (Q10)
gives about 20dB of RF gain and also
improves the noise figure. The gain
is varied by a front-panel potentiometer that adjusts the gate 2 voltage,
avoiding overload on strong signals. A
wide-bandwidth Coilcraft transformer
(T3) is used in the drain circuit. This
has a 4:1 turns ratio, which gives a 16:1
impedance ratio.
One problem with receiver design is
the rejection of strong signals at other
frequencies that may overload the
front end. There is no easy solution
to this, and various filters are used to
reduce such interference.
The Tayloe mixer uses half of a
74CBTLV3253 dual 4-way analog multiplexer chip. The input is DC-biased
half the supply voltage of 3.3V, which
gives midpoint bias to the following
op amps. The requirements for the op
amps are low noise, wide bandwidth
and rail-to-rail operation with a 3.3V
supply.
The combination of this multiplexer
(mux), the two op amps and the way
the mux is controlled via the LOI
and LOQ digital lines results in the
extraction of the I/Q signals (RXI &
RXQ) from the tuned RF signal. These
are fed to the control board via CON2
for processing.
Table 1 – tuning bands
Toroid
Band Centre frequency
Low
1
3625kHz
Low
2
4375kHz
Low
3
5625kHz
Low
4
10250kHz
High
5
10625kHz
High
6
11250kHz
High
7
14500kHz
38
Silicon Chip
The MCP6022 op amp is recommended for IC3, having a gain-bandwidth (GBW) of 10MHz and 8.7nV/√Hz
of noise while running from 2.5-5.5V.
With the resistor values used, the voltage gain is 683 times (57dB), giving a
-3dB bandwidth of 14.6kHz (10MHz
÷ 683). A two-pole low-pass filter is
provided using 56nF capacitors on the
output of the ‘3253 and 220pF capacitors across the 56kW resistors.
Control board circuit
The control board sits behind the
front panel. Its circuit is shown in
Fig.3; it is based around a Raspberry
Pi Pico or Pico 2 module (MOD1).
There is not much connected to the
Pico. A standard rotary shaft encoder
is used for tuning and selecting items
in the menu, with two extra pushbutton switches for display options
and choosing menu items. The OLED
screen is a standard SSD1306 module,
with a resolution of 128×64 pixels.
The Pico handles RF signal demodulation and produces an audio output
generated by filtering a pulse-width
modulated (PWM) signal from digital
output pin GP16. The 100W/470nF
low-pass filter removes most of the
high-frequency switching components
of the signal, and potentiometer VR1
provides volume control.
The menu system does include
a digital volume control, but this
requires several pushbutton presses
and encoder rotations, which is not
very convenient.
The original design fed headphones
and could, in a pinch, drive a small
speaker. In the final version, I have
included an LM386 audio amplifier.
The external 8W loudspeaker is connected via a headphone jack, so it is
automatically disconnected when the
‘phones are plugged in. A resistor in
series with the headphone connection
Australia's electronics magazine
limits the power to a safe level.
The two-phase local oscillator
required by the RF board is produced
at the GP0 and GP1 pins of the Pico.
The I & Q signals coming back from
the RF board go to the GP26 and GP27
pins via anti-aliasing low-pass filters
made of 5.6kW resistors and 2.2nF
capacitors. It is from these signals that
the modulated audio is recovered by
software in MOD1.
There are three connectors on the
control board; CON4 & CON6 connect
to the RF board, while CON8 goes to
an external socket for an optional TFT
LCD screen. A 16-pin connector is
used for an IDC cable to the RF board,
siliconchip.com.au
On the left
side of the
RF board are
the antenna
tuning
components:
two
transformers,
the relay
and a series
of tuning
capacitors.
The mux is in
the centre and
dual op amp
on the right.
plus a 4-pin connector for selecting the
input tuning and a 6-pin connector for
the optional LCD screen.
Power comes from a 9V DC source
to CON9, which can be a plugpack. At
least 8V is required to give sufficient
range for the varicap fine-tuning.
While a plugpack can be used, the
best performance is with a battery supply, so that is what I’ve shown. Two
lithium-ion rechargeable cells connected in series provide up to 8.4V
when fully charged. A two-cell AA
holder is adequate, but I opted for a
three-AA battery holder and added a
1.2V NiMH rechargeable cell, which
has a capacity of 1500mAh and results
in a total supply voltage of up to 9.6V.
14500 (AA-size) Li-ion cells have
a capacity of about 1200mAh, and
with a total current drain of 100mA,
will last up to 12 hours. Make sure to
buy good-quality cells as cheap Li-ion
cells carry a fire risk (see Mailbag, January 2026).
The Pico requires a supply voltage of
about 5V, so an LM1117 low-dropout
regulator is used. The Pico module has
an on-chip 3.3V supply, available on
one of its pins, which is used by the
RF board.
The 3.3V supply could also be used
to power the OLED screen, but it is
an I2C device and there is switching
noise when it is being accessed. Coupling of this noise into the main supply is reduced by running it off the
5V supply instead, through a diode
and using a 100µF filter capacitor. The
series diode is not strictly necessary,
but is included as a precaution and
helps to isolate its supply from the
other components.
Construction
Start by assembling the control
board, which is coded CSE251101 and
measures 96.5 × 53.5mm. Begin by soldering all the SMD components – refer
to the overlay diagram, Fig.4. There
are no fine-pitch devices on the board,
and only one SOIC-8 chip, the LM386.
Next, solder the connectors on the
back of the board, including the two
20-pin socket strips for the Pico module. This module is plugged in rather
than soldered; otherwise, replacing
a faulty Pico module would be very
difficult. Make sure that the 16-pin
box header has its notch orientated
correctly.
There is provision for an Si5351A
module socket on the back of the
board. This was added as it is supported by the firmware as an option.
You may experiment with it if you
Fig.3: the control board is built
around MOD1, a Raspberry Pi Pico
or Pico 2. It produces the local
oscillator signal, performs audio
demodulation, controls the tuning
circuitry, updates the screen(s) and
feeds the audio signal to amplifier
chip IC4. The user controls are
volume (VR1), RF gain (VR2),
fine tuning (VR3) plus the rotary
encoder and three pushbuttons to
drive the menu system.
siliconchip.com.au
Australia's electronics magazine
April 2026 39
Fig.4: the
control
board has
the Pico and
connectors
on the back
(plus the
electrolytic
capacitor)
and the user
controls and
other parts
on the front.
The Pico is
plugged into
a pair of
header strips
so it can be
removed if
necessary.
When
finished,
D1 and
the 100μF
capacitor
are hidden
under
the OLED
screen.
wish, but it is not required. The male
header should be installed with the
pins pointing up from the top side.
If you are not using that module, you
don’t need to fit JP1 or JP2.
The front side of the board has the
on/off toggle switch, three potentiometers, the rotary shaft encoder, two
pushbutton switches and the socket
for the OLED screen. To ensure that
the components are aligned correctly,
slip the front panel over the controls
before soldering.
Don’t forget the two components that
will be hidden under the OLED screen
(D1 & the 100μF ceramic capacitor).
Once all the components are mounted
on the front, flip the board over and add
the five connectors on the back (CON4CON6, CON8 & CON9), orientated as
shown, plus the two 20-way header
sockets for the Pico module.
Finally, add the electrolytic capacitor, with its longer + lead towards the
closest edge of the board.
Once the board has been cleaned,
inspect it for any short circuits or dry
joints. Use an ohmmeter (eg, a DMM)
to check that the 5V and 3.3V lines are
not shorted to ground. Before plugging
in the Pico module, connect the power
supply and measure the voltage on the
output of the voltage regulator (REG1)
to ensure that it is close to +5V.
40
Silicon Chip
At this stage, it is worthwhile programming the Pico and checking the
operation of the program. Programming is very simple – use a USB cable
to connect to a PC. Hold the BOOTSEL
button down when plugging the cable
in. It will then appear as a removable
disk drive.
For the original Pico, the file to be
programmed is “picorx.uf2”, or for
the Pico 2, it is “pico2rx.uf2” (you can
download both from siliconchip.au/
Shop/6/3579). Just transfer this file to
the Pico’s “drive” and it will be written
to its flash memory. Do not press the
button again. Unplug the Pico module
from your computer and connect it to
the control board, with the USB connector at the top.
Connect your power supply or battery and switch it on. You should
immediately see a PicoRX splash
screen followed by a picture on the
OLED, which is a schematic of a crystal
set! This stays up for a couple of seconds. This is followed by a complex
menu system, to be described later.
RF board construction
The RF board is coded CSE251102
and measures 82.5 × 53mm; its overlay
diagram is shown in Fig.5. All the components on this board mount on the
same side. There are three integrated
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circuits, which you should solder first.
All three must be orientated with the
pin 1 locator placed as shown in the
diagram.
The 16-pin 74CBTLV3253 comes in
a fine-pitch package and needs great
care. Position it very carefully so that
it is accurately on all the pads, then
apply a small blob of solder on opposite corners. Run some flux paste on
both sides and, using a fine-tip soldering iron, move it slowly across
the pins.
Editor’s note: I prefer a medium conical or chisel tip for better heat transfer; when using good flux paste, you
don’t need a very fine tip.
You may end up with shorted
(bridged) pins, in which case the
excess solder can be removed with
some copper braid. It may take a couple of attempts with extra flux to get
clean joints with no shorts between
them. Note that the 74HC238 is
mounted in the opposite orientation
to the other chips. This was done to
make the layout easier.
Make sure orientation is correct; the
circuit will definitely not work if any
IC is reversed. While fixing them after
soldering is possible, it is a real pain,
especially if you don’t have a hot air
rework station!
All the transistors except the BF998
have SOT-23 footprints (the BF998 is
in a similar package but with an extra,
wider pin, which must be placed as
shown). This also applies to the BB201
dual varicap diode, so ensure you
don’t confuse it for a transistor.
The wideband Coilcraft RF transformer (T3) is also fitted ‘upside
down’, in the same orientation as the
74HC328.
The remaining resistors and capacitors can be fitted now. They are all
in M2012/0805 SMD packages (2.0
× 1.2mm) and are not polarised. The
resistors will be marked with codes
indicating their values, but the capacitors won’t, so solder them in place as
soon as you remove them from their
packaging to avoid confusion.
Winding toroidal transformers can
be tedious, but take your time and
keep them neat and wound in the correct direction so they correspond to
the termination pads on the PCB. The
low-band toroid (T1) requires 37 turns
of 0.3mm diameter enamelled copper wire, closely spaced (connected
between points C & D on the PCB).
This leaves enough room for the
siliconchip.com.au
four-turn primary winding, also using
0.3mm diameter wire, connected
between points A & B.
The high-band toroid (T2) uses 13
turns of 0.6mm diameter wire, which
should be spread out around the toroid
to connect between points G & H, again
leaving room for the two-turn primary
(also using 0.6mm diameter wire), connected between points E & F.
There are only a few through-hole
components remaining to be mounted:
the relay (RLY1) and connectors
CON1-CON3. Make sure the notch
on the 16-pin box header is aligned
as shown in Fig.5.
Fig.5: the RF board
is considerably
smaller and easier
to build than the
one for the SSB
Shortwave Receiver
thanks to the digital
processing. The only
tricky part to solder
if IC2, as it is a finepitch IC, but it isn’t
too difficult if you
have decent light,
good flux paste and a
magnifier.
Preparing the cables
The main connection between the
control and RF boards is a 16-wire flat
ribbon cable with 16-way IDC connectors at either end. Cut a piece about
80mm long and use a vice or IDC
crimping tool to clamp the cable on
the connectors. Make sure the cable is
exactly square onto the connector and
that the pin 1 notches are facing the
same way at each end before clamping them.
The other cable required is 120mm
long with four wires. Crimp pins on
each end for the four-way polarised
connectors and push them into the
blocks, ensuring that the wire order is
the same at each end. You could strip
out a length of 4-wire ribbon cable
to make this, or use individual wires
twisted together or held within tubing
for neatness.
If you want to use the optional external TFT LCD screen, this requires a
6-way shielded cable. The ground wire
and shield wire should be crimped
onto the same pin. A round 6-pin connector on the back panel is used to
connect this screen, as per Fig.6. The
shield is needed to reduce RF radiation that would induce noise into the
RF board. Keep this cable away from
the RF section.
Even with the best arrangement,
there will still be a pulsating noise at
low signal levels. The external screen
can be switched off in the HW Config
→ TFT Settings menu to remove this
source of noise.
Two-way connectors are used for
the input DC power and speaker connections. As there is no room for the
headphone socket on the front panel,
it is on the back panel. Wire it in such
a way that the speaker is disconnected
with headphones plugged in (if in
siliconchip.com.au
The wiring is straightforward, as shown here. Ensure pin 1 on both connections
between the boards are the same at each end.
doubt, refer to Fig.3). A 100W ¼W
resistor mounted on the headphone
socket (also shown in that diagram)
limits the headphone power to avoid
hearing damage.
Case assembly
Attach the 50mm speaker to the
front panel using four 10mm-long M3
machine screws, washers and nuts.
The control board is attached to the
front panel by M2.5 × 16mm threaded
spacers and M2.5 × 6mm screws. I used
black screws on the front panel for the
best appearance.
The RF board should be mounted on
the bottom plate to line up the 16-pin
headers. Use the board as a template
for the holes in the base. The RF board
is attached by four M2.5 × 10mm
threaded spacers and eight M2.5 ×
6mm screws.
Next, mount the connectors on the
back panel. The antenna connector is
a 15cm-long coax cable with an SMA
plug on one end and a panel-mounting
BNC socket on the other. This is a
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ready-made item available from AliExpress (see the parts list).
If an external DC supply is used,
include a suitable connector (eg, a
chassis-mounting barrel type). As
mentioned above, the headphone jack
socket is also on the back panel. See
the photos for a suggested layout.
The two pushbuttons pass through
3mm holes on the front panel. If you
have access to a 3D printer, their
appearance and ease of use can be
improved by making caps to fit over the
buttons. The caps are a push-fit on the
switch. This will require drilling out
Fig.6: if using the optional larger
external LCD screen, wire it up to the
circular plug like this.
April 2026 41
Parts List – PicoSDR Reciever
1 assembled control board (see below)
1 assembled RF board (see below)
1 black front panel PCB coded CSE251103, 159 x 64.5mm
1 170 × 75 × 130mm vented metal enclosure
[AliExpress 1005007496723103]
1 50mm 4W or 8W 10W loudspeaker
[AliExpress 1005006957225238]
1 100mm length of 16-way flat ribbon cable
2 16-way IDC line sockets [Jaycar PS0985]
1 3.5mm jack socket, 5-pin type (CON7)
[AliExpress 1005006501723152]
1 6-pin circular connector with matching plug (optional; for
external TFT LCD screen) [AliExpress 1005004645761532]
1 150mm-long SMA male to panel-mount BNC female coaxial
cable [AliExpress 1005001385620859]
1 2-cell or 3-cell AA battery holder with flying leads (see text)
2 AA-size (14500) Li-ion rechargeable cells
1 AA-size (14500) NiMH rechargeable cell (optional; see text)
4 M3 × 16mm black panhead machine screws
4 M3 flat washers
4 M3 hex nuts
16 M2.5 × 6mm black panhead or countersunk head machine
screws
4 M2.5 × 16mm tapped spacers
4 M2.5 × 10mm tapped spacers
Control Board
1 double-sided PCB coded CSE251101, 96.5 × 53.5mm
1 Raspberry Pi Pico or Pico 2 module (MOD1)
1 128×64-pixel 0.96in 4-pin OLED screen with SSD1306
controller (OLED1) [Silicon Chip SC6176]
1 3.5in LCD module with ILI9488 controller (optional)
[Silicon Chip SC5062]
1 SPDT solder tag toggle switch (S1)
2 PCB-mounting 4-pin tactile pushbuttons with 15mm-long
actuators (18mm total height) (S2, S3)
[AliExpress 1005001629305461]
1 rotary encoder with integrated pushbutton and 20mm-long
D-shaped shaft (RE1) [AliExpress 1005006690469571]
1 10kW 9mm logarithmic taper vertical potentiometer with
20mm-long D-shaped shaft (VR1)
[AliExpress 1005008648801832]
2 10kW 9mm linear taper vertical potentiometers with 20mmlong D-shaped shafts (VR2-VR3)
[AliExpress 1005006029199652]
1 medium/large knob to suit RE1
3 small knobs to suit VR1-VR3 [AliExpress 1005006637211404]
1 4-pin vertical polarised header (CON4)
2 2-pin vertical polarised headers (CON5, CON9)
1 2×8-pin keyed box header (CON6)
1 6-pin vertical polarised header (CON8)
2 20-pin header strips (for mounting MOD1)
2 20-pin female headers (for mounting MOD1)
1 4-pin female header (for mounting OLED1)
2 11mm-long untapped (or tapped) spacers, 2.5mm inner
diameter (for mounting OLED1)
2 M2 × 16mm panhead machine screws (for mounting OLED1)
2 M2 hex nuts (for mounting OLED1)
42
Silicon Chip
Semiconductors
1 LM386M audio amplifier IC, SOIC-8 (IC4)
1 LM1117(I)MP(X)-5.0 5V LDO linear regulator, SOT-223 (REG1)
1 LL4148 100V 200mA signal diode, SOD-80 (D1)
Capacitors (all SMD M2012/0805 size 50V X7R unless noted)
1 470μF 16V electrolytic
1 100μF M3216/1206 size 10V X7R
6 10μF 16V
1 470nF
1 100nF
1 47nF
2 2.2nF
Resistors (all SMD M2012/0805 1% unless noted)
1 6.8kW
1 220W
1 100W ¼W axial resistor
2 5.6kW
1 100W
1 47W
1 680W
RF Board
1 double-sided PCB coded CSE251102, 82.5 × 53mm
1 vertical PCB-mounting female SMA connector (CON1)
1 2×8-pin keyed box header (CON2)
1 4-pin vertical polarised header (CON3)
1 HFD4-5 DPDT 5V DC coil telecom relay (RLY1)
2 Micrometals T50-6 Carbonyl toroidal cores,
12.8 × 7.5 × 4.95mm (T1, T2) [www.minikits.com.au/T50-6]
1 200mm length of 0.3mm diameter enamelled copper wire (T1)
1 50mm length of 0.6mm diameter enamelled copper wire (T2)
1 Coilcraft PWB-16-ALC 80MHz 1:16 SMD signal transformer
(T3) [Mouser 994-PWB-16-ALC]
Semiconductors
1 74HC238D/74HC238M 3-to-8 decoder IC, narrow SOIC-16
(IC1)
1 74CBTLV3253PW dual 4-way analog multiplexer, TSSOP-16
(IC2)
1 MCP6022(T)-I/SN or MCP6022(T)-E/SN dual 2.7V low-noise
10MHz op amp, SOIC-8 (IC3)
7 BFR92P low-noise 15V 5GHz NPN transistors, SOT-23 (Q1-Q7)
2 2N7002 60V 115mA N-channel logic-level Mosfets, SOT-23
(Q8, Q9)
1 BF998 12V 1GHz dual-gate Mosfet, SOT-143 (Q10)
1 BB201 dual varicap diode, SOT-23 (VD1)
1 LL4148 100V 200mA signal diode, SOD-80 (D2)
2 1N5711 70V 15mA axial schottky diodes (D3, D4)
Capacitors (all SMD M2012/0805 size 50V X7R unless noted)
2 10μF 16V
9 100nF
4 56nF
1 1nF
1 330pF NP0/C0G
3 220pF NP0/C0G
2 180pF NP0/C0G
1 100pF NP0/C0G
1 68pF NP0/C0G
1 4.7pF NP0/C0G
Resistors (all SMD M2012/0805 1%)
1 470kW
8 12kW
1 220W
1 100kW
2 10kW
4 82W
2 56kW
1 1kW
Australia's electronics magazine
siliconchip.com.au
the front panel holes to 5mm. The file
for this is “button_caps_V02_CK.stl”.
Thanks to Andrew Woodfield for the
design of these caps.
Initial setup
The menu system is quite overwhelming, and it reminds me somewhat of menus in digital cameras. It
has a branching tree system to adjust
many different parameters and settings. The menu items are chosen
using the two pushbutton switches,
plus the rotary encoder with its integrated pushbutton switch.
As with digital cameras, some of
the settings are of little importance
and are best left alone. But there are
some initial setup parameters that are
important. The first of these is Encoder
Direction.
Press the ▲ button and the display
will show Menu on the top line and
Frequency on the second line. Rotate
the encoder knob one click right or left
and, depending on the shaft encoder
direction, it will show HW Config. If
HW Config comes up with a clockwise
rotation, you need to change the direction of the tuning knob.
With HW Config on the second line,
Press the ▲ button and the display
will show HW Config on the top line
and Tuning Options below. Rotate the
encoder knob to navigate to Reverse
Encoder. Press the ▲ button and the
display will show Reverse on the top
line and Encoder on the second line.
Rotate the encoder knob to select On.
Finally, press the ▲ button and the display will go back to Menu on the top
line and Frequency on the second line.
Press the ▲ button to return to the
opening screen, then press the ▼ button
several times to select Viewing Option.
There are about 25 different parameters that can be set by first pressing the
▲ button and then rotating the knob to
select different options. One of them is
Volume, which can be adjusted from
0 to 9. This is why I have added the
volume control on the front panel, to
avoid going through several steps to
get to such a basic control. The following are some of the more important parameters:
• Mode: AM, AM-Sync, LSB, USB,
FM, CW
• AGC: Manual, Fast, Normal, Slow,
Very Slow
• AGC Gain: with maximum gain,
the background noise is high. Changing
this to 30dB reduces it significantly,
siliconchip.com.au
An external
display can
be added
to the
PicoSDR if
you need a
bigger screen
with more
information.
without affecting the sensitivity.
• Squelch: this silences the receiver
until a signal is strong enough. I found
that S5 will completely silence it, but
a 1μV signal will open up the receiver
on most frequencies. Experiment with
this setting to find the optimum value.
• Bandwidth: Normal, Wide, Very
Wide, Very Narrow, Narrow
• Freq Step: 10Hz, 50Hz, 100Hz,
500Hz, 1kHz, 5kHz, 6.25kHz, 9kHz,
10kHz, 12.5kHz, 25kHz, 50kHz or
100kHz.
In the HW Config menu, there are
22 different hardware parameters that
can be adjusted! Many of them can be
safely ignored. I won’t go through all
the possible menu settings; you can
look through them if you want to.
The ▼ button selects what appears
on the OLED. The photos show some
of the possible displays.
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As with all receivers, there are some
spurious signals and ‘birdies’ due to
harmonic mixing. If they happen to
be on a frequency that you are tuned
to, there is a simple way of removing
them. Navigate to IF Frequency and
change it from the nominal 4.5kHz
slightly. The received frequency is
identical, but the birdie has moved.
Conclusion
This receiver is an example of what
can be done with a software approach
to design. Jon Dawson has done an
incredible job in writing the highly
complex code to make it possible. It
could not be classed as a first-class
‘communications receiver’, but it does
have creditable performance.
There are regular updates to the
software on his site, so it’s worthwhile
SC
looking at it from time to time.
April 2026 43
By Andrew Levido
Power
Electronics
Part 6: DC-to-AC Converters
Having covered DC-DC and AC-DC converters in earlier articles in this series, we will
now move on to DC-AC converters. They have been around for a long time, but their
usage has become widespread over the last couple of decades.
T
here was a time when the applications
for DC-to-AC converters were limited
to industrial motor drives and
commercial UPS systems. However,
the widespread adoption of domestic solar power systems and electric/
hybrid vehicles means that DC-AC
converters have become extremely
common.
As has become the custom for this
series, we will start by analysing the
simplest possible converter and build
from there. Fig.1 shows four switches
arranged in a H-bridge, fed from a DC
voltage source. If we close S1 and S4
for a period equal to a half-cycle of the
desired output frequency and S2 and
S3 for the other half cycle, we can synthesise a square wave with amplitude
Vsrc and frequency ω, shown in red.
Recall that ω (omega) is just a frequency expressed in radians per second; 2π radians is one cycle, so 2π
radians per second is the same as 1Hz.
There are a couple of important
things to note about this circuit. First,
energy passes from the DC side to the
AC side, so this is an inverter; in a
rectifier, it goes the other way. Secondly, the switches create an AC voltage source at the output terminals,
so this is a voltage-source inverter.
The need for these seemingly obvious observations will become apparent soon.
The RMS value of the output voltage
is just Vsrc, so the only way to change
vload, or the power delivered to the
load, is to adjust Vsrc.
We can change this by introducing a third switching state into the
cycle, one where all switches are off
and the output is zero, as shown in
the blue trace. Here, the switches are
off for a phase angle of δ (delta) at the
beginning and end of each half-cycle.
We can now use δ to adjust the RMS
output voltage, and hence the power
delivered to the load, according to the
expression vload(rms) = Vsrc √1–2δ ÷ π.
This kind of inverter is sometimes
known as a tri-state inverter because
each output terminal can be connected
to +Vsrc, –Vsrc or zero (another term
you might see referring to similar systems is ‘modified sinewave inverter’).
Fig.1: the simplest single-phase voltage-source DC-AC converter uses four
switches to create a square wave output. By leaving all switches open for a
phase angle of δ at the beginning and end of each half-cycle, we can control
the output voltage and power.
44
Silicon Chip
Australia's electronics magazine
Most of the interesting loads we
want to drive are not purely resistive,
so we should see what happens if we
add an inductor to the load (Fig.2).
We will assume that the L/R time constant is large compared to the output
frequency so that the AC current can
be approximated by its fundamental
component.
There is a phase shift between the
voltage and current of Ø radians, as we
would expect with an inductive load.
This angle is fixed by the relationship
between the load inductance and resistance, so it does not help us to change
the power delivered to the load.
Things are different if the load
includes an AC voltage source, as
shown in Fig.3. This scenario is pretty
common; for example, in a solar
inverter feeding the power grid or an
inverter driving a synchronous motor
with its sinusoidal back-EMF.
This circuit gives us another variable to play with, as we can control
the phase angle between vload and vac.
With this circuit, you can even dictate
the direction of power flow – from
source to load (inversion) or load to
source (rectification).
We effectively have two AC sources:
the inverter output vload, and the AC
source, vac, with an inductor between
them. The inductor acts as a ‘buffer’
between the two, absorbing the instantaneous voltage difference. The greater
this difference is, and the longer it has
to be sustained, the larger the inductor required.
Still, a large inductor reduces the
power factor, limiting the real power
that can be transferred.
The solution is to move the inductor
to the DC side of the H-bridge, where
it won’t impact the power factor, no
matter how large it is. This arrangement (Fig.4) means that the output of
the H-bridge is an AC current, so this
is now a current-source inverter. The
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DC voltage source and inductor are
equivalent to the current source Isrc.
We can’t use the same switching
strategy to achieve the ‘zero-state’ output as we did in the voltage-source
inverter. If we turned all the switches
off, the source current would have
nowhere to go and the voltage across
the H-bridge would rise uncontrollably. Instead, we achieve the zero state
by turning both S1 and S2 or S3 and
S4 on at the same time, diverting the
current away from the load.
I have shown the current-source
inverter switching pattern in the figure.
This ‘shoot-through’ would be catastrophic in a voltage-sourced inverter,
as would a short on the output, because
the source would be short-circuited
and the resulting current uncontrolled. Current-source inverters are
inherently current-limited, making
them very robust compared to their
voltage-source counterparts, which
require additional circuitry to protect
against short circuits.
I won’t go through the maths, but
it is possible to show that the power
delivered to the load by this current-
source converter is given by the equation P = (2vac Isrc ÷ π)cos(δ)cos(Ø).
We can control the power flowing to
or from the load by changing either δ
(the time spent in the zero state) or Ø
(the phase angle between the inverter
output and vac), or both.
These are dictated by switch timing,
so they can be nicely varied by a microcontroller-based implementation.
Full control of Ø requires true bidirectional switches – switches that
can conduct or block in both directions. This is somewhat difficult to
implement, since Mosfets and IGBTs
both normally have an anti-parallel
diode that means they can never block
reverse current.
In the case of Mosfets, this is the
inherent body diode, and in the case
of IGBTs, it is usually a separate diode
integrated into the package. Typical
applications therefore tend to leave Ø
at or very near zero and manipulate δ
to control power.
We have used single-phase DC-AC
converters so far, but everything we
have covered is equally applicable to
three-phase converters. Fig.5 shows
that these are just a single-phase converter with an extra pair of switches.
Each phase-to-phase voltage is created
by manipulating the switches just like
siliconchip.com.au
Fig.2: with an inductive load, there will be a phase
angle difference between the voltage output and load
current that is determined by the load inductance and resistance.
Fig.3: if there is an AC voltage source associated with the
load, such as a photovoltaic inverter feeding the grid, we
can control the phase angle between it and the inverter
output, allowing us to control the power flow in either direction.
Fig.4: if the inductor in Fig.3 is moved to the DC side, it results in a currentsource inverter. The zero-state output occurs when switches S1 and S2 or S3
and S4 are on.
Fig.5: a three-phase DC-AC converter is just like its single-phase counterpart
with an extra pair of switches. The phase shift between switching is 2π/3
radians (120°) instead of the π radians (180°) in the single-phase case.
Australia's electronics magazine
April 2026 45
the single-phase example, but shifted
by 2π/3 radians (120°) instead of π
radians (180°) in the single-phase case.
You could, in theory, build an
n-phase converter with n switch pairs
(or two pairs for single-phase) with a
phase shift of 2π ÷ n between them.
However, diminishing returns means
we rarely deal with more than three
phases in reality.
The exception is primarily in aircraft and ship motor drive systems,
plus some large-scale mining equipment, where more phases (eg, six or
12) can result in lower torque ripple,
a lower current per phase, reduced
harmonics and EMI, plus better fault
tolerance.
Pulse-width modulation
The examples we have seen so far
have all produced more-or-less squarewave outputs, which we know have
a terrible power factor, so are not
very efficient at transferring power.
Practical DC-AC converters therefore
employ some kind of modulation
scheme to reduce the level of harmonics in the output, or at least push them
up to high frequencies where they are
easier to filter.
One common method used for small
to medium power converters (up to a
few hundred kilowatts) is sinusoidal
pulse-width modulation. The switch
drive is modulated at a carrier frequency (fpwm) much higher than the
desired output frequency.
The on-time in each modulation
period is proportional to the instantaneous amplitude of the desired sinusoidal output waveform, as in Fig.6(a).
I have shown only one half-cycle
for clarity; the other is identical but
reflected in the horizontal axis.
In that diagram, the carrier frequency is an integral multiple of the
output frequency, but this does not
have to be the case if the carrier frequency is high enough – say a couple
of hundred times higher than the maximum output frequency. This means
the carrier frequency can be fixed,
making synthesis a lot simpler.
Textbooks generally show the
switching signals derived from analog
circuits that compare a triangle-shaped
carrier wave to a sinusoidal reference,
but in reality these days, they will
almost certainly be produced by software running in a microcontroller.
Pre-computed sine values are typically stored in a lookup table, and
each carrier period, the appropriate
one is extracted, multiplied by a scaling factor (the modulation depth) to
set the amplitude, and loaded into a
timer configured as a PWM generator.
In the case of three-phase inverters,
you have to add some third harmonic
to the reference sinusoid or the output
amplitude will be limited. For a fuller
explanation, see the “Variable Speed
Drive for Induction Motors” article we
published in the November 2024 issue
(siliconchip.au/Series/430). It provides a good overview of how this type
of modulation can be implemented in
a microcontroller.
Current control
In the case of current-source converters, such as in photovoltaic systems, it is preferable to control the
inverter’s output current rather than its
voltage. There are a couple of ways to
do this, both shown in Figs.6(c) & (d).
Both of these assume there is a current
transducer measuring iload.
The compensator-based current
Fig.6: this figure shows four different
modulation schemes for DC-AC
converters. (a) & (b) are suitable for
voltage-source converters, while (c) &
(d) are for current-source converters.
46
Silicon Chip
Australia's electronics magazine
controller shown in Fig.6(c) uses
a PWM modulator identical to the
one discussed above, except that the
reference input is not a fixed sinusoid. Instead, the PWM modulator is
‘wrapped’ in a current control loop
that compares the load current to a
sinusoidal reference and drives the
modulator via a loop compensator to
reduce the current error to zero.
This control method has the advantage of a fixed switching frequency,
but the current ripple can vary widely.
You can also use hysteretic modulation, like in Fig.6(d), analogous to
current-mode control in DC-DC converters. The switches are controlled
in such a way that the load current
always remains within a hysteresis
band ±ih around the reference. This
control method provides fixed current
ripple and built-in current limiting,
but it does mean that the switching
frequency is variable.
This might not be a problem for solar
inverters, for example, which operate
over a very narrow range of output
frequencies.
Harmonic elimination
Really large (multi-megawatt) or
high-voltage DC-AC converters generally don’t use Mosfet or IGBT switches.
Instead, they use gate-turnoff (GTO)
thyristors, which come with voltage
ratings up to 4.5kV and can handle
currents up to 4kA or more.
Their switching frequency is limited
to something less than 1kHz, so pulsewidth modulation is not generally
practical. Instead, a technique known
as harmonic elimination is used.
The ‘tri-state’ waveform shown in
blue in Fig.1, like all of the waveforms
we have seen, is ‘half-wave symmetric’.
This just means that the second halfwave looks like the first reflected in the
horizontal axis. This type of waveform
only has odd harmonics, so the largest
amplitude harmonic after the fundamental is the third. Its amplitude will
be vload(3) = (4Vsrc ÷ 3π)cos(3δ).
If we set δ to π/6, the amplitude of
the third harmonic drops to zero. In
fact, all multiple-of-three harmonics
(n = 3, 9, 15...) become zero. Furthermore, you can add additional zerostate pairs of specific length at specific
angles to eliminate other harmonics
and their multiples.
With three such sets of zero-state
‘notches’ in the right places, you can
eliminate the 3rd, 5th, 7th and 9th
siliconchip.com.au
Fig.7: space vector
modulation maps
a set of three-phase
sinusoidal waveforms to
a single rotating vector
in the αβ plane. You
can synthesise a threephase voltage set by
determining how much
time to spend in each
state.
harmonics with a switching frequency
just five times the fundamental. The
largest harmonic present in the output
will be the 11th. This is shown graphically for one half-cycle in Fig.6(b).
We already know that in a balanced
three-phase system, the 3rd harmonic
and its multiples are already zero,
making the 5th harmonic the highest
one present in the waveforms shown
in Fig.5. In this case, the first harmonic
elimination zero-state pair is therefore
placed to eliminate the 5th harmonic
and its multiples.
Three pairs of zero-state notches can
eliminate all harmonics below the 13th
in three-phase systems.
The main downside of harmonic
elimination is that by fixing the zerostate angles, you can’t use δ to control the output voltage. Converters
in the multi-megawatt range are normally driven from a dedicated transformer and use tap changers to regulate voltage.
Space vector modulation
The science-fiction sounding space
vector modulation (SVM) is a modulation technique used in balanced threephase inverters, especially in motor
drives. It takes advantage of the symmetry in these systems to simplify the
calculations necessary to synthesise a
desired set of sinusoidal waveforms.
While it may simplify the modulator, understanding it can be a bit of a
mind-bender, so we are going to need
some background.
It is possible to represent any set
of three variables, like three-phase
voltages at some instant in time, as
a point in 3D space. Each of the variables defines a length along one of
the three orthogonal axes. This set of
three values is called a vector because
it describes a point in 3D space that is
some specific direction and distance
from the origin.
For physical space, we usually label
siliconchip.com.au
the coordinates x, y and z, but for our
three-phase system, we will name
the axes a, b and c, representing each
phase. Three values (va, vb, vc) define
a vector vabc that represents all threephase voltages at any instant in time.
We use a bolded v to indicate that this
is a vector.
In the case of balanced three-phase
systems, we have a further constraint.
At any moment in time, the sum of
the phase voltages must be zero. This
severely limits the range of values that
the vector describing those variables
can take. In fact, vabc must lie on a plane
passing through the origin and tilted
such that its normal vector (a vector
standing perpendicular to the plane)
passes through the point (1, 1, 1).
Don’t worry if this is hard to picture; we are about to simplify matters.
With quantities confined to this
plane, it is natural to assign a new pair
of orthogonal axes as if ‘looking down’
the normal vector. These axes are traditionally labelled α and β, and the plane
is unsurprisingly called the alpha-beta
plane. On this plane, we can describe
a three-value three-phase vector as a
point with coordinates (xα, xβ).
The transformation between the two
systems is known as a Clarke transform. This is named for its inventor,
Edith Clarke, who among her many
distinctions was the first female American professor of electrical engineering when she joined the University of
Texas in 1947.
If we take a set of three-phase sinusoids and map them to the αβ plane,
they correspond to a point rotating in a
circle around the origin. The speed of
rotation is related to the frequency, and
the radius is related to the amplitude.
We now have all the tools we need to
explore space-vector modulation.
A three-phase inverter like that
shown in Fig.7(a) can produce eight
possible switch states, which produce
the three-phase voltages shown in the
Australia's electronics magazine
adjacent table. The phase voltages are
referenced to an imaginary ‘Neutral’
point at half of the source voltage and
shown in the table normalised to Vsrc.
The last two columns in the table
show how each of these switch states
maps onto the αβ plane using the
Clarke transformation. Don’t worry
too much about the weird √6 values.
What is important is that if you plot
these points on the αβ plane, you get
the result shown in Fig.7(b).
Each non-zero state maps to a vertex
of a hexagon, and the two zero states
map to the origin.
Any point inside the hexagon represents a set of balanced phase voltages that we could synthesise. Fig.7(c)
shows how, using an example from the
triangle with vertices x1, x2 and x0x7.
To synthesise the voltage represented by the red vector, we need to
be in each of these three states for an
April 2026 47
appropriate proportion of time, so the
result ‘averages out’ to the desired
voltage set.
The length of the blue vector relative
to x1 defines the proportion of time we
need to spend in state x1, while the
length of the green vector relative to x2
defines it for the x2 state. The remaining time is spent in one or the other
of the zero-states. In the example, the
fraction of x1 is around 0.3 and the
fraction in x2 is around 0.4, leaving
0.3 of the time spent in the zero states.
If we want to synthesise a set of
three-phase sinusoidal voltages, we
just rotate the vector around the origin, tracing out the red circle/arc. Over
each switching period (Tsw), the red
vector advances by some angle proportional to the output frequency. Typical
implementations start and end each
switching period in a zero-state to
minimise output harmonics.
There will therefore be three transitions per switching period: zero to
state A, state A to state B and state B
to zero. Each transition only requires
one switch to be changed if you select
the right zero-states.
The sequence of states is always
the same as you rotate around the
circle, so it can be programmed in
advance. Only the time spent in each
state has to be calculated (or looked
up in a table) in real-time. This is
more efficient code-wise than threephase sinusoidal PWM, although the
speed and capability of today’s microprocessors makes this advantage less
important than it once was.
Like every modulation technique,
space vector modulation has plenty
of variations and options. It’s a pretty
deep rabbit-hole if you want to go
exploring.
Getting practical
I thought it would be interesting to
dig into the design of a real DC-AC converter by looking at an aspect of converter design that is often overlooked:
calculating the thermal losses in the
switching elements. This is far from
simple in the case of DC-AC converters with pulse-width modulation and
inductive loads, as you will see.
I will use the IGBT bridge from
the Variable Speed Drive Induction
Motors article mentioned earlier as
an example.
This three-phase converter uses
DGTD65T15H2TF 650V 30A IGBTs
with integral freewheeling diodes,
switching at 15.625kHz. There are
two kinds of losses that we have to
consider: conduction losses that occur
when the IGBT or diode is on, and
switching losses that occur in the IGBT
as it switches on and off.
Conduction losses are the product
of the current through, and the voltage across, the IGBT and diode when
turned on. The manufacturer provides
graphs to show how these quantities
are related, reproduced in Fig.8. These
characteristics are not linear, and in
the case of the IGBT, vary with gate
drive voltage.
Conduction losses get worse with
higher temperature, so I have assumed
the maximum 175°C junction temperature to be safe.
Superimposed on the charts is a dotted piecewise linear approximation
that we will use to calculate conduction losses. We will assume that the
IGBTs’ Vce is a combination of a fixed
drop, Vto, plus a voltage that increases
linearly with current – effectively an
on-resistance, Rce. This converter uses
a 15V gate drive, so I have set this resistance to match the appropriate curve.
In this case, we can read off Vto ≈
1V and Rce ≈ 90mW. We can do a similar thing with the diode characteristic, giving Vfo ≈ 1.2V and Rak ≈ 40mW.
If the current through the IGBT and
diode is ic, the instantaneous conduction losses will be Pi(cond) = Vto ic +
Rce ic2 and Pd(cond) = Vfo if + Rak if 2.
The current is an AC quantity, so we
have to find the average power over
one cycle. This requires us to integrate
these expressions over one cycle and
divide by 2π.
Since the switching frequency is
high and the load is inductive, the
inverter current will be sinusoidal,
given by the equation i = Ipk cos(θ – Ø),
where Ø is the phase angle between
voltage and current. This current will
flow in the IGBT when the switch is on,
and in the diode when the switch is off.
The proportion flowing in the IGBT
is determined by the duty cycle,
which is in turn defined by the phase
angle and the modulation depth m,
Fig.8: calculating the conduction losses in an inverter bridge is not a simple undertaking. It starts with a piece-wise
linear approximation of the forward characteristics and ends with the expressions below the graphs.
48
Silicon Chip
Australia's electronics magazine
siliconchip.com.au
according to the expression D = ½(1
+ mcos[θ]). The proportion flowing
in the diode is determined by 1 – D.
Plugging all this together makes for a
pretty nasty integral, but I have shown
the results below the graphs in Fig.8.
The total conduction loss for one
IGBT/diode is the sum of these two
equations. The terms involving the
modulation depth m and load power
factor cos(Ø) are interesting. Both can
vary from zero to one, and the effect
of reducing either of them is to move
losses between the IGBT and the diode,
while the total stays roughly constant.
This makes intuitive sense because
in each case, there is less IGBT on-time
and more diode freewheeling time
Switching losses are (thankfully)
a little easier to calculate. Switching
loss depends mainly on capacitance,
so the energy expended each transition
is related to the square of the voltage.
The data sheet provides the switching
energies for each transition, helpfully
at 175°C, and at 400V, a little above the
maximum we can expect, so comfortably conservative.
These energies are Eon = 342µJ and
Eoff = 288µJ. With sinusoidal PWM,
you can show the switching losses will
be Pi(sw) = (Eon + Eoff) fsw ÷ π.
Using values from the variable speed
drive in single-phase mode (Ipk = 10A,
PF = 0.95, m = 1, fsw = 15.625kHz) gives
conduction losses of 4.8W for the IGBT
and 0.6W for the diode, and switching
losses of 3.1W, for a total worst-case
loss of 8.5W per device.
There are four active devices, so
the total is 34W. For the three-phase
case (Ipk = 6A, PF = 0.85, m = 1, fsw
= 15.625kHz), the power dissipation
works out to be 5.8W per device and,
coincidentally, 34W for the six active
devices. That’s close to 98% efficiency
for the DC-AC converter part (there
are additional losses in the rectifier).
You will notice that the IGBT
switching losses are approaching
the conduction losses in magnitude
at a switching frequency of just over
15kHz. In many applications, we want
switching frequencies much higher
than this, so switching losses can
become a huge concern in high-power
converters.
The next instalment
RP2350B
Computer
A Fully-assembled general-use computer
The RP2350B Computer runs BASIC and is excellent for creating your own
programs, games, tinkering with external circuits and more. And we are
selling it pre-assembled, with little to no soldering required to have it up
and running. It supports a keyboard, mouse or even a SNES controller.
Video output: DVI via an HDMI connector <at> 640 × 480, 720 × 400, 800 × 600, 848 × 480,
1280 × 720 or 1024 × 768 pixels
Removable file storage: microSD Card, FAT16/FAT32, up to 32GiB
Clock Speed: 252-375MHz
Non-volatile program memory: 184kiB
General usage RAM: 220kiB (expandable
to over 6MiB)
Internal File Storage: 14MiB
Audio formats: single-frequency
tones, stereo WAV, FLAC, MP3 & MOD
USB ports: four Type-A for peripherals,
one Type-C for power/console and one
micro Type-B for firmware loading
Clock: battery-backed real-time clock
& calendar
External console: serial over USB <at>
115,200 baud via the USB Type-C socket
External I/O connector: 30 pins with
22 GPIOs, including 7 with analog input
ability, plus ground, 3.3V and 5V outputs
Power supply: 5V <at> 220mA
RP2350B Computer Assembled Module
[ SC7531 | $90.00 + post ]
fully-assembled PCB, except for the optional components (instrument case, mounting
screws, 3-pin header for serial wire debugging and APS6404L PSRAM IC [SC7530 | $5])
Front & Rear Panels
[ SC7532 | $7.50 + postage ]
pre-cut panels, white silkscreen and black solder mask; not included with the kit above
In part seven, we will take a look at
resonant or soft-switching converters,
which can minimise or even eliminate
SC
switching losses.
For all the details on how to build it, check out the article in the November
2025 issue of Silicon Chip (siliconchip.au/Article/19220).
siliconchip.com.au
Australia's electronics magazine
April 2026 49
By Tim Blythman
Remote Controller
DCC Booster
Stepper Motor Driver
μDCC Decoder
Stepper Motor Driver
and Decoder
Stepper motors are capable of remarkably precise movement but are
more difficult to control than a brushed DC motor. This compact board
drives stepper motors with ease and can be configured to work with
different control inputs, including direct current and Digital Command
Control (DCC).
Image source: https://unsplash.com/photos/miniature-train-set-with-detailed-landscape-rNOwodoejTc
Y
ou might have seen that tiny stepper
motors are available quite cheaply
from online marketplaces like
eBay and AliExpress. A typical example is the assembly used to move the
laser head on a DVD drive (see the
photo below). This one is fitted with
a helical shaft for linear control of the
head assembly position.
I have been curious about whether it
would be possible to use such a motor
to drive a model locomotive. Tiny DC
motors are available, but are known
for high speed and low torque, which
is not a good match for the wheels on
a model locomotive.
Compact coreless DC motors
are often
used in
This stepper motor
is 15mm in diameter
and works well with our
Driver. The assembly is
similar to the type used in
CD/DVD/Blu-ray drives to
position the laser head.
50
Silicon Chip
quadcopters, where they only operate
at high speed.
Adding a gearbox can provide
appropriate speed and torque, but also
adds complexity and uses up valuable
space. Many stepper motors can be
driven slowly and still provide useful
torque directly from their output shaft.
Stepper motors require different
control circuitry; they typically have
two or more windings that are energised in sequence to control the speed
and direction of the motor. It’s not
possible to apply a DC voltage as can
be done for a simple brushed motor.
In this context, DC means a relatively
steady voltage of either polarity, or
perhaps a PWM (pulse-width modulated) voltage.
We’ve published articles about
stepper motors and the hardware
needed to drive them by Jim Rowe in
the past. The Quick Primer on Stepper
Motors (January 2019; siliconchip.au/
Article/11370) is a good place to start
if you aren’t familiar with how stepper motors work.
He also wrote about some stepper
motor driver modules in Part 22 of
the Cheap Modules series (February
2019; siliconchip.au/Article/11405).
This type of module makes it easy to
control a stepper motor using a microcontroller, but I thought it would be
handy to drive a stepper by applying a
DC voltage in the same way you might
power a brushed motor.
I realised that our recent DCC
Decoder (December 2025; siliconchip.
au/Article/19377) already has most of
This tiny board (shown at actual size in the lead
image and on the right) can run a small stepper
motor as though it were a DC motor. It can also
operate in DCC mode (with some parts left
off), using a stepper motor to power a model
locomotive. Some of the stepper motors and
assemblies that we were able to control with the
Driver are also shown in the lead; the largest is
15mm in diameter. The smaller two motors are only about
5mm in diameter and ran quite hot, so we recommend using
a lower current limit if driving such motors.
siliconchip.com.au
Features & Specifications
🛤 Four motor connections to suit bipolar
stepper motors
🛤 Two additional current-limited opendrain Mosfet outputs
🛤 Adjustable speed response
🛤 Selectable drive current limit
🛤 Can be configured for DC or DCC
operation
🛤 Maximum peak input voltage: 17V
🛤 Motor drive current: up to 500mA
🛤 Accessory outputs: up to 100mA
🛤 Module size: 24 × 13 × 4mm
the components needed for driving
a stepper motor. The firmware that
provides the DCC decoding function
would just need to be adapted to drive
a stepper motor instead of a DC motor.
So this Stepper Motor Driver and
Decoder (we’ll call it the Driver for
short) has two operating modes. It can
accept a DC voltage and generate a
waveform to drive a stepper motor as if
it were a DC motor. In other words, the
polarity of the applied voltage determines the direction of rotation, and
the magnitude determines the speed.
The other mode is to behave as a
DCC decoder. Instead of a brushed DC
motor, it has outputs that can be used
to drive a small stepper motor. Since it
has much in common with the earlier
Decoder design, we recommend that
you read the DCC Decoder article if
you have not already done so.
The Driver also has two open-drain
outputs that can sink current. In DCC
mode, these work in the usual fashion
as DCC function outputs (for lights or
similar accessories). In DC mode, one
switches on for one input polarity
and the other for the reverse polarity,
providing a similar directional lighting function.
DCC PROJECT KITS
DCC Decoder, December 2025 (SC7524, $25)
includes everything in the parts list
DCC Base Station, January 2026 (SC7539, $90)
includes everything in the parts list, except for the case, power supply, glue
and the CON4 & CON5 headers
DCC Remote Controller, February 2026 (SC7552, $35)
includes all required parts, except for the UB5 case and wire/cable
DCC Booster, March 2026 (SC7579, $45)
includes all required parts, except for the Jiffy box, OLED screen, power
supply and front panel. The OLED screen (SC7484, $7.50) and front panel
(SC7578, $5.00) are available separately.
DCC Stepper Motor Driver & Decoder, April 2026 (SC7601, $30)
includes all required parts for DC or DCC mode.
A with a positive voltage, then coil B
with a positive voltage. The next phase
is to drive coil A with a negative voltage, followed by coil B with a negative
voltage. The cycle then repeats. These
four phases correspond to the four
steps of the stepper motor’s rotation.
To drive the motor in reverse, the
sequence is reversed. Note that reversing the polarity of one coil will have the
same effect as reversing the sequence.
Most stepper motor drivers employ
micro-stepping, which effectively
interpolates the output between each
phase to create more, smaller steps.
Our Driver implements 256 microsteps, where the four phases noted
above correspond to microsteps 0,
64, 128 and 192. We use PWM (pulsewidth modulation) to interpolate
between the steps.
Scope 1 (with filtering applied for
clarity) shows the voltage at the four
stepper motor connections as the
Driver progresses through its cycle.
A+
6V
B+
A−
For example, microstep 32 (between
microstep 0 and microstep 64) drives
both coils A & B with a 50% duty cycle
in the positive direction.
Internally, the microcontroller has
a counter that dictates the current
microstep. Having 256 microsteps
means it is simple to loop around
when the counter overflows; we can
just ignore all but the lowest eight bits
of the counter.
The counter is incremented every
200μs (at 5kHz) and the increment
determines the rate at which the cycle
advances and thus how fast the motor
turns. Applying a negative increment
reverses the cycle and thus the direction of the motor.
It isn’t expected that the motor will
be precisely positioned to within 1/64th
of a step, but the choice of that many
divisions allows the speed to be set
with a reasonable resolution while
keeping the arithmetic simple for the
8-bit processor.
B−
A+
4V
Driving a stepper motor
The distinguishing feature of the
Stepper Motor Driver and Decoder is
that it can drive a stepper motor, so
let’s look at how that works in the firmware. The two H-bridge outputs are
intended to connect to the two coils
of the stepper motor, which are often
denoted as A and B. The outputs are
driven in a specific sequence to rotate
the motor’s shaft.
A typical waveform might drive coil
siliconchip.com.au
2V
0V
Microstep 0
Microstep 64 Microstep 128 Microstep 192
-2V
0.0ms
20.0ms
40.0ms
60.0ms
80.0ms
Scope 1: this shows a typical waveform for driving a stepper motor from the
unit. The shape of the waveforms means that the power draw is quite steady,
regardless of the current motor drive phase.
Australia's electronics magazine
April 2026 51
The PWM is applied in a complementary fashion, so that at any instant,
exactly one output is being driven,
which keeps the load relatively constant. This also ensures that the current
limit is applied uniformly at all times.
Circuit details
Fig.1 shows the circuit diagram for
the Stepper Motor Driver and Decoder;
it has a striking similarity to the DCC
Decoder noted earlier. The main difference is that this circuit boasts two
motor driver ICs to provide the fourwire connection needed by bipolar
stepper motors. Since it is so similar
to the Decoder, we’ll focus mainly on
the differences.
The incoming power supply connects to bridge rectifier BR1, which
provides a voltage that we’ve labelled
as a nominal 12V. In practice, the
incoming supply can vary from 0V
up to around 17V. The 17V limit is set
by REG1’s maximum input voltage of
16V (allowing for a 1V drop across the
bridge). REG1 provides a 3.3V rail –
both rails have 10μF bypass capacitors.
IC1 is a 14-pin, 8-bit PIC16F18124
(or -5 or -6) microcontroller that is
powered from 3.3V, while IC2 and
IC3 are DRV8231 motor driver ICs that
are powered from the 12V rail. Their
four outputs (available as motor connections A and B) require four control
signals from the microcontroller.
The keep-alive circuitry comprises
diode D1, a 100W resistor and an
optional capacitor. IC1 has a 100nF
bypass capacitor and a 10kW resistor
on its MCLR pin. This is exactly the
same as the corresponding circuitry on
the DCC Decoder. Similarly, the ICSP
connections to pins 1, 4, 12, 13 and 14
allow IC1 to be programmed if needed.
The two Mosfets, Q1 & Q2, are
driven from a further two digital outputs of IC1. In the Decoder article,
we described the current-limiting
circuitry on the Mosfets (enforced by
the 100W source resistors) and how
the 0.68W resistors on the ISEN pins
of the DRV8231 ICs set a 500mA limit
on their outputs.
The connections to sense the incoming voltage are different from the
Decoder, since we need to measure the
amplitude of that voltage. 100kW/10kW
dividers bring both voltages down to
a safe range for IC1’s ADC (analog-todigital converter) to measure, while the
10μF capacitor between the middle of
the dividers low-pass filters the signal.
This filter means that it is possible
to apply a PWM drive signal to the
inputs, and the filter will provide the
average input voltage to the microcontroller for measurement.
This chip has a differential ADC,
so we can directly measure the difference between the two voltages, giving
us the polarity and amplitude of the
applied voltage. When configured for
DCC operation, the low-side resistors
and the 10μF capacitor are left off, providing the same sensing configuration
as used in the Decoder circuit.
The 10kW/10kW divider across the
+3.3V rail, connected to pin 8 of IC1
(CONFIG) is used to configure the
adjustable speed response, as mentioned earlier. Using different values here will provide different speed
responses. Leaving the upper resistor
off will force CONFIG to 0V, and the
Stepper Motor Driver and Decoder
will then operate as a DCC decoder
instead of responding to the applied
DC voltage.
Firmware
In DC mode, we can expect a varying input (supply) voltage. Below 5V
Fig.1: the circuit of the Driver is similar to that of the DCC Decoder published previously. Since we need to control four
motor outputs, there are only enough spare I/O pins to provide two open-drain function outputs.
52
Silicon Chip
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siliconchip.com.au
at the bridge rectifier inputs, there is
about 3.5V on the input to the regulator, and it is barely able to maintain
its 3.3V output. When it starts up, the
microcontroller samples the voltage on
its pin 8 input (the “CONFIG” signal),
to set its speed and mode.
The microcontroller repeatedly
measures the input voltage, but does
not drive any of the outputs. With less
than 4.5V on their supply pins, IC2
and IC3 stay in under-voltage lockout. Above 5V at the input, the micro
enables Q1 or Q2, depending on the
supply polarity. In a model railway
application, these would be used to
drive directional lights, with current
sourced from the 12V rail.
At 6V, IC2 and IC3 are now receiving
4.5V and will enable their outputs if
commanded to do so. The micro subtracts 6V from the input voltage and
uses that value, combined with the
speed setting and input polarity, to
generate an output waveform to drive
the stepper motor.
The 6V offset means that it is possible to easily achieve low-speed control. It also means that, for example,
applying 12V to the input will drive
the motor at double the speed compared to a 9V input.
The analog reading of the CONFIG
input is transformed into a ratio that
reflects the ratio of the resistors used
to set the voltage. Using ratios makes
it easier to calculate the values needed
to achieve a specific speed.
For example, if the default 10kW:
10kW divider gives a certain speed,
then changing it to a 20kW:10kW
divider will give double that. The
upper ratio limit is 10:1 (ten times
the default speed), while the lower
limit is about 1:100 (1% of the default
speed). If the upper resistor is a very
high value or left off (giving a lower
ratio than 1:100), the Driver starts up
in DCC mode instead.
In DCC mode, the Driver operates
like a DCC Decoder described in the
earlier article, except that its motor
outputs are arranged to drive a stepper motor. Since a DCC Decoder has
configuration variables (CVs) for setting the speed response, we don’t need
the CONFIG divider for this purpose.
Notes
In DC mode, the default speed (with
the 10kW:10kW divider fitted) at 7V (1V
above the 6V threshold) is 30 steps per
second, or 7.5 full cycles of the output
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waveform per second. This becomes
300 steps per second at 16V (10V above
the 6V threshold). Of course, you can
change this by changing the divider.
In DCC mode, CV5 is used to set
the speed ratio. CV2 and CV6 are not
implemented, since the low-speed
behaviour of stepper motors does not
require the compensation that these
CVs offer. The default value of CV5
is 64, implying that the speed can be
increased approximately fourfold by
setting CV5 to 255.
A value of 64 for CV5 corresponds
to 155 steps per second at speed step
127. This also means that a value of
52 for CV5 gives 127 steps per second
at speed step 127; this value might be
easier to use as a base for calculations.
There is a very wide variety of
stepper motors available, with different numbers of steps per revolution,
winding resistances, output torque
and shaft arrangements. So we recommend doing your research before
connecting a stepper motor to ensure
it works as best it can and doesn’t burn
out or get damaged.
We tested various stepper motors,
ranging from a tiny unit measuring just
4mm across up to a so-called NEMA-8
unit. The NEMA-8 stepper motor looks
similar to the NEMA-17 motors used
in 3D printers, but is about half the
diameter.
The smallest motors worked well
enough but got quite hot. So we recommend changing the 0.68W resistors to a
higher value to reduce the current limit
with such motors. The current limiting is based on a 0.33V threshold, so
the formula is 0.33V ÷ I, where I is the
target current in amps. For example, a
limit of 100mA (0.1A) would require
the 0.68W resistors to be replaced with
3.3W resistors.
Don’t go any lower than 0.68W for
the current sensing resistors, since
that could result in the bridge rectifier
exceeding its 1A limit.
The NEMA-8 motor struggled to
generate torque and would stall easily. These have a very low winding
resistance and normally operate with
a much higher current than the 500mA
that is available from the Driver.
Motors in between these sizes,
around 8mm to 15mm in diameter,
seemed to work quite well and typically had coil resistances of around
20-30W. The motor shown at the bottom of page 50 has a 15mm diameter.
Motors with gearboxes will generally
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provide more torque; we found that
even the cheap and common 28BYJ-48
type motors worked well. These have
five wires, since they are arranged for
unipolar operation, but if the common (typically red) wire is left disconnected, the Driver can power them.
There are many varieties of stepper
motor around, and we cannot characterise all of them. Still, the above
should give you some idea about what
motors will work best and how to
adjust the Driver for the best operation.
You should also check the stepping
rate that your motor can support and
ensure that you are operating within
that range. Operating above the maximum stepping rate will cause the
stepper motor to lose torque and possibly stall.
Like the Decoder, connections to the
board are made by soldering directly to
surface-mount (holeless) pads. During
our testing, we soldered headers to
the various pads to easily try out different connections. Most connections
are close to 0.1in pitch (2.54mm), so
standard headers and sockets should
work if you want to experiment.
The firmware has been compiled
to fit in the smaller flash memory of
the PIC16F18124 (7kiB), but since
the register maps are the same, the
firmware should work without issue
on the PIC16F18125 (14kiB) and
PIC16F18126 (28kiB).
Construction
Being effectively set by a resistor,
the firmware operating mode is fixed
once construction is complete. To set
the Driver to work in DC mode, all the
parts listed should be fitted to the PCB.
This is seen in the overlay diagrams,
Figs.2 & 3. The resistors in the green
The DCC version of the
Driver leaves off three resistors and
one capacitor to allow the firmware to
switch to DCC mode and to properly
sense the incoming DCC signal.
April 2026 53
box are the CONFIG divider that can
be used to alter the motor speed.
To work in DCC mode, the high-side
resistor (10kW) of the CONFIG divider
is left off, as are the lower (10kW) resistors of the sense divider and the 10μF
capacitor that provides filtering on
the sense lines. These are labelled in
red in Figs.2 & 3. If these were left on,
they would interfere with sensing the
DCC signal.
We’ll describe fitting all the parts,
so be mindful of which parts to leave
off, depending on your intended use.
Like other SMD projects, we recommend that you have flux paste, solder
wicking braid, a magnifier, tweezers
and some sort of fume extraction on
hand. Working outside can help with
avoiding smoke and fumes if you don’t
have an extraction fan.
Start assembly with the side shown
in Fig.2, including REG1. Apply flux
to all the pads on that side. Start with
REG1, being careful not to mix it up
with the similarly packaged Q1 and
Q2. Rest it in place with the tweezers,
tack one lead and adjust as needed.
Then, solder the remaining leads.
Install the two 0.68W resistors (or
your other chosen value). These will
be tricky to get to if they are soldered
after IC2 and IC3. Next, fit the bridge
rectifier, observing its polarity, and
follow with the two 10μF capacitors
on this side.
Next solder IC2 and IC3, being sure
to locate their pins 1 correctly. When
the board is orientated as in Fig.2,
the chip markings are upright, with
the pin 1 dot at lower left. Then solder D1, making sure that its cathode
stripe faces to the left, towards the
bridge rectifier.
Complete this side with the three
resistors near D1. Note that it is only
the 10kW resistor below the SC marking that is omitted for DCC operation
on this side. Turn the board over and
apply flux to the pads on this side of
the board. Following Fig.3, solder IC1,
noting that its pin 1 dot is at top right.
Follow with the two SOT-23 transistors at upper right.
That just leaves the passives. The
CONFIG resistors are at upper left on
this side, with the high-side resistor
in the divider being the one closest to
IC1; this is left off for DCC operation.
The other two parts to be left off for
DCC are at lower left, below IC1. Take
care with the values of the remaining
passives and note that the sole 100nF
capacitor sits to the right of IC1.
Clean the board using an appropriate flux cleaner and allow the board to
dry. Inspect it for bridges and poor solder joints; repair any before attempting
to power up the Driver.
Testing and programming
A weak power source, such as a 9V
battery or current-limited supply set
to around 12V and 100mA, can be
applied to the T connections shown in
Fig.2. You should see regulated 3.3V
(3.2V to 3.4V) between the 3.3V and
GND pins on the ICSP header. If that
Figs.2 & 3: pay close attention to the components in the overlay diagrams and be
sure to leave off the components marked in red if you are building the version
for DCC. At a minimum, you should make connections to the T, A and B pad
pairs to drive a motor; the other connections are not mandatory.
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Silicon Chip
Australia's electronics magazine
The DC version is populated
with all the components. The CONFIG
divider has been set to its default of
two 10kW resistors; these values can
be changed to alter the speed response
of the Driver.
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is not right, or your power supply goes
into current limiting, check your construction again.
Further testing will require the chip
to be programmed. If you have bought
a programmed chip or kit from the Silicon Chip Shop, then this should not
be required. Otherwise, solder a fiveway pin header to the ICSP header and
connect it to a programmer such as a
Snap, PICkit 4, PICkit 5 or PICkit Basic.
The power supply noted above
should be adequate if your programmer cannot supply power. Program the
0911124S.HEX file and check that the
programming and verification complete successfully.
Connections
Figs.2 & 3 also show the connections that can be made. Note that the
two pads marked A must connect to
opposite ends of the same winding
on the stepper motor, while the pads
marked B connect to the two ends of
the other winding. The easiest way to
check the windings is to test for continuity, although this may not apply
to five-wire motors.
Just like the DCC Decoder, you can
connect a capacitor to the + and –
keep-alive connections to store and
later provide energy if the supply is
intermittent. While this was intended
to handle dirty tracks in a model railway, it can also be helpful if you are
trying to power the Driver with a PWM
power source.
The pad marked 12V is simply rectified DC from the bridge, so could vary
over a wide range, especially if the
Driver is being used in the DC configuration. If you want to use the Q1 and
Q2 outputs with a varying supply, you
Table 1 – supported configuration variables
CV# Notes
Default value
1
7-bit short address
3
3
Acceleration rate
0
4
Deceleration rate
0
5
Speed scaling: the default value of 64 results in 155 steps per second
at speed step 127. Other values scale proportionally; for example, a
value of 52 gives 127 steps per second at speed step 127.
64
7
Manufacturer version number (read-only)
0x5D
8
Manufacturer identification number (read-only)
13
11
Packet timeout
0
17
Most significant bits of long address
192
18
Least significant bits of long address
0
19
Consist address and direction
0
29
Configuration
2
33
Function mapping
1
34
Function mapping
2
35
Function mapping
0
36
Function mapping
0
37
Function mapping
0
49
Function effect bitmap for forward light output
255
50
Function effect bitmap for reverse light output
255
could use a constant current-circuit
instead of the resistors shown in Fig.3.
An alternative would be to feed the
LEDs from 3.3V on the ICSP header,
although this will offer much less
headroom. You shouldn’t draw more
than about 10mA from the 3.3V supply due to dissipation in REG1.
DC use
If you have a stepper motor connected, you can test out the Driver by
applying a voltage at the T input to the
bridge rectifier. We used a 9V battery
for much of our testing; it went flat
fairly quickly, but it was able to rotate
Parts List – DC/DCC Stepper Motor Driver
1 double-sided 13 × 24mm PCB coded 09111242, 0.8mm thick
1 PIC16F18124-I/SL (or 18125 or 18126) 8-bit microcontroller programmed
with 0911124S.HEX, SOIC-14 (IC1)
2 DRV8231DDAR motor driver ICs, SOIC-8 (IC2, IC3)
1 MCP1703A-3302E/CB 3.3V low-dropout linear regulator, SOT-23 (REG1)
2 2N7002 SOT-23 N-channel Mosfets (Q1, Q2)
1 1A SMD bridge rectifier (BR1) [MBS4 or CD-MMBL110S]
1 1N5819WS SOD-323 schottky diode (D1)
1 3cm length of 20mm diam. heatshrink tubing (to protect & insulate Driver)
Capacitors (all SMD M2012/0805 size MLCC)
3 2 10μF 25V X5R
1 100nF 50V X7R
Resistors (all SMD 1%, M2012/0805 size, ⅛W unless noted)
2 100kW
7 4 10kW
1 100W
2 10W
2 0.68W ¼W
n values are to suit DCC mode. The values of two of the 10kW resistors can
also be adjusted to change the speed response in DC mode.
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all the stepper motors that we tested.
DCC operation
You will need a DCC signal to test
out the Driver in DCC mode. The earlier parts of this series (siliconchip.au/
Series/455) describe a few options for
Base Station Hardware. Table 1 lists
the configuration variables (CVs) that
are implemented on the Driver when
it is operating in DCC mode.
Apart from CV5, the other CVs will
work in much the same fashion as
those described in the Decoder article
(December 2025). Thus, the remaining CVs have only brief descriptions
of their characteristics.
Note that we have used a different
version ID (CV7) so that you can tell
these Decoders apart. Otherwise, the
DCC code is much the same, and the
Driver should operate much like the
earlier Decoder in all other respects.
Conclusion
We don’t expect that all stepper
motor types will work well with this
Driver. It is something of an experimental device; it originally began as
a DCC Decoder that could be used to
drive stepper motors. Still, we think
that the ability to accept a DC voltage
for power and control will be adopted
for cases where basic operation of a
SC
stepper motor is needed.
April 2026 55
Whole-House
Environmental Logging
By Julian Edgar
In the March 2026 issue, Julian Edgar gave some tips about wiring up a newly built home.
Now we look at the electronic logging and display system he has built to oversee the
thermal behaviour of his house.
Image: the active/passive solar house uses largely conventional current Australian construction. Here it’s shown with AI-added landscaping
– the landscaping won’t be finished for several years. But the house and rainbow are real!
M
any Australian houses are constructed with insufficient regard
to the climate, especially in the use
of low-cost passive solar design
approaches such as orientation, shading and use of internal thermal mass.
After over 45 years of being interested in passive solar house design,
I could finally incorporate as many
energy-efficient aspects as my wife and
I could think of, get planning permission for, and afford!
In addition to obvious aspects such
as insulation in the walls and ceilings and double-glazed thermally broken windows, the house uses a thick,
steel-reinforced concrete slab floor
supported on deep concrete pillars
into the earth.
Don’t many houses have concrete
slab floors? Well, in our case, that floor
acts as an earth-bonded heat stabiliser,
keeping the house cooler in summer (it
acts as a heatsink) and warmer in winter (it acts as a heat source). In passive
solar house design, this temperature-
stabilising function is often called
‘thermal mass’.
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Silicon Chip
To enhance its winter performance,
the house faces north and has extensive window area on this face. Winter
sunshine falls on the slab, warming
it during the daytime and so providing heat at night. To prevent warming
of the slab in summer, the width of
the northern eaves has been carefully
calculated to block the summer sun,
which is higher in the sky, from entering the house.
But it gets a little more complicated
than that, especially in summer.
On a hot summer day, the house is
closed up, with the slab keeping the
interior cool as it acts as a heatsink.
Inevitably, the slab temperature will
rise as heat passes from the house
interior into the slab, so we need a
way of getting rid of that heat. This
is typically done when the temperature drops at night, at which time the
house windows and doors are opened
for cooling breezes.
But what if the night is still – there’s
no wind? That happens occasionally
here, about 100km north of Canberra.
In that case, another aspect of the
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house comes into operation. A large
(600mm diameter) roof ventilator
can be powered by its brushless DC
motor, drawing air out of the roof
space. Connecting the house interior
to this roof space are ceiling vents,
opened by electric actuators. Aided by
the convectional flow (hot air rises),
the house and the slab are cooled by
this airflow.
In winter, there’s another twist.
Software modelling of the house
design showed that, especially during
a cloudy week in winter, the slab
would get too cold to adequately warm
the house. To cater for that, we have
a modern wood stove. In this rural
area, firewood is free, and the stove
has low particulate emissions and
high efficiency.
However, the wood stove is in the
lounge room and so would heat only
that room. To circulate the heat more
widely, a duct connects the lounge to
the other end of the house, with an
automatically controlled fan moving
warm air through the duct. I described
that system, with its custom controller,
siliconchip.com.au
in the August & September 2025 issues
(siliconchip.au/Series/446).
Now, I am sure you’re thinking,
that’s all very nice – but what does
it have to do with electronic logging
and display?
If you think about it, the occupants
must control this scheme. We need to
know when to close the windows and
doors, and when to open them. We
need to know when to open the ceiling vents, and when conventional and
wind-induced airflow through the roof
ventilator is insufficient and the ventilator should be powered up.
Because it is automatic, we don’t
need to know when it would be beneficial to switch on the ducted heat
transfer fan, but we need to adjust
the controller’s temperature difference and hysteresis settings for the
best results.
Many of these ‘house operating’
decisions need to be made in the context of temperatures – temperatures of
the different rooms, of the concrete
slab, of the outside air. Other decisions
need to be made in the context of the
season, the predicted weather over the
next few days, and what weather has
occurred in the previous days.
What the occupants are doing also
matters, eg, cooking over a hot stove,
sitting at a home office typing, or
sleeping.
Initially, I thought of automating all
these decisions – that is, having windows and ceiling vents that opened
themselves, automatically switchingon the roof ventilator, and so on. Then
I realised that such a system would
rapidly become complicated, expensive and hard to maintain over the
life of the house. So, manual control
it is – but with a lot of information at
our fingertips.
That’s where the logging and display system comes in. Showing 25
sensed and calculated parameters,
both numerically and via trend line
graphs, the system allows us to see,
at a glance, what the house is doing,
and what we should do (if anything).
If the house needs to be opened up
for summer night cooling, the time to
do it is when the falling outside temperature graph line crosses the interior temperature line. If, during winter, the slab temperature is getting low,
lighting the wood stove early will help
‘recharge’ it with heat.
The logging and display system will
also show how well the house design
siliconchip.com.au
House passive solar design features
» R5 roof and R2.7 wall insulation; periphery of concrete slab insulated to R2.3
» Thermally broken, double-glazed windows
» 150mm-thick concrete slab floor with two layers of steel mesh reinforcement, multiple deep cast-in pillars
» Rectangular plan-form house with extensive northern glazing, limited eastern
glazing shaded by a 5m deck overhang, very limited western glazing (a door)
shaded by a porch, southern glazing limited in area and illuminated in winter
by a freestanding southern reflector panel (yet to be built)
» Increased interior thermal mass provided by brick feature walls and two
internal 2000L steel water tanks, one at each end of the house, plus a further
375L tank in the home office
» 600mm wind powered roof ventilator working in conjunction with electrically opened ceiling vents
The 2000L water tank in the lounge provides thermal mass, reducing indoor
temperature fluctuations. The main thermal mass is provided by the concrete
floor slab, insulated around its edges. The slab was strengthened to bear the
two-tonne weight of the tank. The tiling wasn’t complete at the time of this
photograph – it was added using AI.
actually works. How hot and cold does
the interior get over a year? How long
does it take for heat to migrate from
the northern, sunshine-exposed side
of the slab to the southern side?
I have many books with descriptions of a home designed with passive-
solar optimisation principles, but
invariably when it comes time to
describe how effective they are, the
analysis gets quite vague! For this
house, I wanted hard data. So, finally,
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what does the logging and display system comprise?
Logging and display
The logging and display system
comprises the following:
• A wall-mounted, 24-inch (61cm)
LCD touchscreen panel shows realtime data, such as room temperatures
• A logging system records data
and displays it numerically and in
trend graphs
April 2026 57
Two Picolog model 1012 10-bit analog loggers are used. Each logger has 12
single-ended input channels. Off-the-shelf software allows the use of lookup
tables and displayed values calculated from multiple inputs.
The main display is a touchscreen PC in a wall nook located centrally in the
house. The PC allows easy control over the scaling and data
to be displayed. Two USB cables link the PC to the
Picolog loggers in the loft directly above. There is a
repeater display in the home office.
This wall-mounted sensor detects
radiant heat. It uses a thermistor
mounted inside a metal hemisphere.
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Silicon Chip
The outside sensors for the logging
and display system include wind
speed and UV intensity (bottom
sensors). The top sensors are for a
Davis Vantage Vue weather station
used for calibration and redundancy.
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• Warnings/indicators are shown
when certain actions are suggested
The LCD touchscreen is an HP
24-cr1000a all-in-one desktop computer. This is located in a wall recess
that is easily accessible from all parts
of the house. A repeating LCD screen,
linked by a fibre optic HDMI cable, is
mounted in my home office.
Data is collected and logged by two
Picolog model 1012 10-bit analog loggers. Each logger has 12 input channels
and two digital outputs, giving the system 24 input channels and 4 software-
switchable outputs. The Picolog units
are in a storage loft, directly above the
PC, and are connected to it by two
USB cables. These cables power the
Picologs, and provide data transfer
to the PC.
I selected Picologs because the
UK-based Pico company provides free
logging and display software and has
good technical support. The software
allows quite complex treatments of
input data for calibration (eg, the use
of equations or lookup tables) and has
easily programmable maths functions
to display calculated data.
The lookup tables allow non-linear
or linear sensors to be used, and maths
functions can be used for functions
like averaging the readings from multiple sensors. In addition, data from
each individual input can be averaged over pre-selected time periods,
eg, temperature readings can be averaged over 10-minute periods.
The Picologs use 0-2.5V single-
ended sensor inputs – that is, the
input signal for each channel needs
to be an analog voltage in this range.
A regulated 2.5V output is available
for powering sensors. The amount of
data logged is limited only by the storage available on the PC or, if desired,
the ‘cloud’ – so in practical terms, it
is unlimited.
In my system, nine different environmental factors are displayed:
• indoor temperatures
• indoor relative humidity
• indoor dew point temperature
• indoor carbon dioxide (CO2) level
• indoor radiant temperature
• outdoor temperatures
• outdoor wind speed
• outdoor UV intensity
• the flow volume through the roof
ventilator
Let’s look at each in turn. Most of
the logger inputs are for temperature
sensors. Temperatures are sensed:
siliconchip.com.au
The flow through
the roof-mounted
ventilator is
measured by a
pitot tube (circled)
and differential
pressure sensor.
The logging
software shows this
flow in m3/min,
calculated from the
velocity and crosssectional area.
Electrically opening
ceiling hatches
allow convectional
or forced air
ventilation through
the house.
• Within the concrete slab
• 1150mm above the floor in multiple rooms
• Near the peaks of the cathedral
ceilings in the two main end rooms
• In the two internal water storage
tanks (more on these later)
• Outside in the shade
• In the roof space near the ventilator
In total, 18 temperatures are currently sensed. Not all are displayed by
trend graphs on the PC screen – sometimes, an average of multiple sensors
is calculated and this average then
shown on the graph.
Temperature sensors
A lot of thought was given to using
temperature sensors that would have a
very long life – this ruled out IC-based
sensors, for example (they would be
more susceptible to lightning damage,
especially on the end of long cables).
Should they fail, the in-slab sensors
are not easily replaceable – although,
unfortunately, that has already happened.
The chosen temperature sensor is
a thermistor, a device that changes
resistance with temperature. I used
the Ametherm ACW-016 precision
thermistor exclusively; this has a 50kW
resistance at 25°C and an accuracy of
±0.5°C. In use, I have found them to
be more accurate than their specification suggests.
This sensor is also provided with
a table of resistance versus temperature readings, and this table, when
converted to voltages, can be input
directly into the Picolog software to
give a readout in °C (the change in
resistance is not linear with respect
to temperature).
To allow the thermistor to give a
variable voltage output, a precision
50kW resistor is used to form half of
a voltage divider, with the thermistor
forming the other half.
The ACW-016 thermistor is tiny –
its body is only 1.8mm in diameter,
and its connecting wires are equally
small – just 0.2mm thick! This means
the sensors and their wiring need to
be connected so that no physical stress
is placed on them.
The slab sensors were soldered
directly across the splayed ends of the
cabling conductors, with the connections and thermistors then wrapped
in electrical tape before being placed
in the flexible plastic conduit (truck
siliconchip.com.au
Before the concrete slab was poured, plastic tubes containing thermistors and
their associated cabling were put into place. One of the orange tubes can be
seen here. Unfortunately, nearly every tube allowed water in, wrecking the
thermistors! It happened twice – I nearly cried.
Australia's electronics magazine
April 2026 59
air brake hose) that was buried within
the slab. As events proved, taking this
approach was a mistake – more on
that soon.
The room thermistors were wired
in the same way, with these assemblies then mounted in small, ventilated enclosures that attach to standard Clipsal Classic wall plates, which
visually match the rest of the wallmounted switches.
The thermistors sensing the temperature of water in the internal heat
storage tanks were attached to the outside of the tanks, then insulated from
the room air with polystyrene blocks
shaped to match the tank corrugations.
All temperature sensing connections were made with 1.5mm2
shielded instrumentation cable –
physically strong, with a very low
resistance. Hundreds of metres of
cable were used, all installed during
the house construction.
The Picologs are optionally provided with plug-in PCBs that have
connecting terminal blocks. However,
these terminal blocks were too small to
take the sensor cable conductors, and
physically not strong enough to resist
the pull of 12 cables on each Picolog.
To cater for these aspects, the Picologs were mounted in a 19-inch rack
mount case with the sensor cable
terminations on heavy-duty terminal strips mounted on standoffs. The
required voltage divider resistors were
easily installed between the sensor
inputs and another terminal strip fed
from the 2.5V reference supply.
Other sensors
Indoor relative humidity is detected
by a commercial sensor that has a
linear analog output. However, after
monitoring the relative humidity for
a while, I found it rather useless in
assessing comfort. This is because, if
the temperature is low, one doesn’t
even notice high relative humidity –
it feels ‘muggy’ only when the temperature is also rather high. I therefore added a calculated dew point to
the display.
Dew point is the temperature at
which condensation would occur at a
given combination of relative humidity and air temperature. Because it
takes into account both of these factors,
it is a very good guide to human comfort. If you live in a temperate climate,
dew points above about 15°C start to
feel uncomfortable. As with all human
60
Silicon Chip
comfort parameters, it also depends on
what you’re used to.
The dew point calculation can get
very complex; a simplified equation
is (dew point) = (air temperature) –
(100% – relative humidity) ÷ 5%/°C,
but note that this is more like a ruleof-thumb than a rigorous equation.
For more details on this calculation, including its loss of accuracy at
low relative humidities, refer to “The
relationship between relative humidity and the dew point temperature in
moist air: A simple conversion and
applications” by Mark G. Lawrence in
the Bulletin of the American Meteorological Society, February 2005 (see
siliconchip.au/link/ac9l).
Carbon dioxide is measured with
a commercial sensor. This parameter is a good proxy for general ventilation flow – CO2 levels should be
kept below about 1000ppm. The normal atmospheric CO2 level is about
400ppm. I found that a correction
was needed – when calibrated with
outside air, the sensor tended to read
too high. This offset was added in the
Picolog software.
Radiant temperature is measured in
one room. Much heat gain in a house
is via radiation through the windows
– direct radiation (sunshine) and indirect radiation (reflected light). Radiant
heat is measured by sensing the temperature inside a small black metal
ball or hemisphere.
I used a Sontay TT-BB radiant heat
sensor, with the assembly disassembled
and the standard thermistor replaced
with an Ametherm ACW-016 thermistor to give directly comparable readings to the other temperature sensors.
The difference between radiant and
normal temperatures can be very small,
so an offset was added to the radiant
thermistor’s output until, in conditions
of no radiant heat gain or loss, it was
precisely the same as air temperature
measured at the same location.
Outside wind speed is detected by
a rotating cup anemometer that has a
0-5V output. This is reduced to 0-2.5V
by a voltage divider. The anemometer
output was calibrated in km/h by comparison with the output of a Davis Vantage Vue weather station anemometer
mounted on the same mast. The table
of wind speed versus output voltage
was then fed into the Picolog software.
UV intensity is detected by a Sonbest SM9568V5 sensor. Sonbest
makes a variety of sunlight sensors,
Australia's electronics magazine
including total irradiance and light
level. I decided a UV sensor was the
most practically useful in terms of the
likelihood of getting sunburn; I also
expect this sensor’s output to roughly
correspond with sunlight intensity.
The sensor has a 0-5V output
(converted to 0-2.5V using a voltage
divider); however, the manufacturer’s data sheet doesn’t relate the output voltage to UV Index. The sensor
was calibrated by comparing its output voltage to the Bureau of Meteorology’s locally published UV Index daily
data. This relationship was then converted to a lookup table in the Picolog software.
This conversion probably needs further work – the sensor output doesn’t
seem linear with respect to published
UV levels. In the meantime, I use this
sensor primarily to determine whether
the sun has been out.
The anemometer and UV sensor are
mounted on a 1.4m-tall mast above the
roof at the eastern end of the house.
This end of the house is highest above
the ground, so it is the most exposed
to the wind. The mast is mounted to
the fascia; during construction of the
house frame, this area was strengthened with added pieces of timber.
In addition, the mast carries the sensors for the standalone Davis weather
station, which shows temperature,
wind speed and direction, relative
humidity and rainfall.
The volume of air passing through
the rooftop ventilator is measured by a
pitot tube working with a Dwyer Magnesense II pressure-measuring transmitter. Good-quality aluminium pitot
tubes are now available quite cheaply
from China; these are sold for measuring the airspeed in model aircraft.
The Magnesense transmitter was
bought cheaply in a job lot – an alternative would be to use the pressure-
sensing electronic modules also sold
for model aircraft use.
A pitot tube measures airflow speed
by comparing two pressures sensed by
the pitot. One is the atmospheric pressure, sensed by several tangential ports
around the periphery of the tube. The
other pressure is atmospheric plus the
‘impact’ pressure, sensed at the end
of the pitot that faces into the airflow
direction. The greater the pressure difference between the ports, the higher
the airflow speed.
By measuring airflow speed and
knowing the cross-sectional area of
siliconchip.com.au
House modelling
Many people are unaware that the heating and cooling energy consumption of a house can be modelled before the house
is built. Or, in the case of an existing house, before any improvements are made.
The software, developed under the umbrella of the Australian Government’s NatHERS (Nationwide House Energy Rating Scheme; www.nathers.gov.au) program, provides the energy star ratings that all new houses must meet. However,
rather than being used just to provide an energy rating, the software can also be used to develop a house design to give
reduced energy usage.
Different NatHERS software packages are available, including one that is free. I initially had my house design
NatHERS-modelled by an architect, and then when I saw how fascinating the results were, I took the course myself in
one of the software packages. It is not something you could easily pick up just by trial and error.
The software allows house design changes to be made and then the annual energy usage modelled. For example, in
your climate, what difference occurs from fitting R6 rather than R5 ceiling insulation? What about adding more windows
on the south wall? Changing the northern eave width? A different house orientation? And so on.
Not only will the software show the annual energy consumption for heating and cooling, it can also be configured to
show the modelled interior room temperatures for every hour of every day of a typical year, in every room!
This is another reason I wanted a logging system – to see how well the actual house performance matches the modelled performance. At the time of writing, the performance of the house has been close to the software predictions – if
anything, it is doing better than the software predicted.
Finally, the CSIRO has
released predicted climate data that can be
used in the software, so
the house design can
be modelled for future
climates – a good idea
since the life of a house
is likely to be 50+ years.
The modelled
temperature of my
home office (blue) and
the outside temperature
(red) for a year, with
no heating or cooling
systems operating.
The modelled temperatures for each room at 3pm on July 31st in a typical year. The outside temperature is only 11°C but
most rooms are around 20°C. The lower temperatures are in the rooms with exhaust fans – even when closed by dampers,
lots of heat is still lost through these openings. This is with no heating or cooling systems operating. These two images were
made using the software FirstRate5 (www.fr5.com.au).
siliconchip.com.au
Australia's electronics magazine
April 2026 61
Climate 80km north of Canberra
These values shown in the table below are averages – the extremes are 43°C and -8°C. Note the high diurnal (night/day)
temperature range in summer, allowing a passive solar home to work very effectively in this climate. Initial results indicate the house will likely not need cooling or heating more than 90% of the time.
Mar
Apr
May
Mean max. 27.9°C 26.4°C 24°C
Month Jan
20°C
15.8°C 12.3°C 11.5°C 13.3°C 16.6°C 19.9°C 22.9°C 26°C
Mean min. 14°C
Feb
13.7°C 11.5°C 7.9°C
the ventilator’s throat, airflow volume
can be calculated and displayed by the
logging system. I use units of cubic
metres per minute. I made a lookup
table to display the data in this form,
with a check of the system’s accuracy
made with a handheld flow meter
positioned temporarily in the throat
of the ventilator.
Thermistor problems
Unfortunately, the in-slab thermistors gave a lot of trouble.
As described, the thermistors were
soldered to the cables, then wrapped
in tape and slid into hard plastic
hoses, with the assemblies placed
before the concrete slab was cast. Well
before the house construction was
finished, the logging system was up
4.6°C
Jun
2.6°C
Jul
1.7°C
Aug
2.4°C
and running – and this soon showed
a problem.
One by one, the in-slab sensors
started to give incorrect readings. The
readings progressively worsened until,
typically, they were showing either
extremely high or low temperatures.
Reluctantly, because I didn’t think
they could be replaced, I pulled out
each cable, complete with sensor,
from its plastic tube. This invariably
revealed that the sensor was wet.
Either the plastic hose had been holed
during the concrete pour, water had
entered the ‘house’ end of the plastic
hose (despite it being sealed with tape)
before the roof was on, or condensation was occurring.
Even a small amount of moisture was enough to cause problems.
Sep
4.7°C
Oct
7.2°C
Nov
9.8°C
Dec
12°C
Furthermore, even when the thermistors were dried, they still gave incorrect readings.
Clearly, new sensors needed to
be installed – and they needed to be
waterproofed. A new thermistor was
soldered across each cable’s conductors, as had been done previously. But
this time, rather than wrap the sensor in tape, I slipped a 50mm length
of vinyl tubing over the sensor, with
about 10mm of the tubing then pushed
over the full diameter of the cable,
where it was a tight fit.
I then used Selleys MarineFlex sealant to fill the open end of the tubing,
completely enveloping the sensor and
its wiring, while adding some more of
the sealant around the vinyl tubing/
cable join.
Screen 1: about three weeks of temperature data in November with no heating or cooling. The outside temperature (green)
varied from 2-32°C, while the indoor temperature (blue) varied from 18-24°C. The concrete slab varied in temperature by
only 1.5°C (red). Four of the slab temperatures (right-hand column) show the fault discussed in the article. The gap in the
recording is due to an electrical storm.
62
Silicon Chip
Australia's electronics magazine
siliconchip.com.au
With some effort, each sensor could
then be pushed into the plastic hose
sufficiently far that the sensors were
returned to the original positions, deep
inside the concrete slab and in about
the middle of the respective rooms.
Incredibly, this did not fix the
problem! Months later, when the
house walls were complete and so
access to the cables and thermistors
was near-impossible, one by one, the
thermistors began to give the same
trouble. I can only assume that again
water was the culprit – and that it
could infiltrate through the cable
insulation.
Luckily, a single thermistor cable
could still be accessed – it was behind
the plasterboard wall inside a linen
cupboard. I was able to cut a hole in the
plasterboard and fish out the cable. I
then drilled a hole in the concrete slab
inside the cupboard and put in a new
sensor. I covered the wiring junction
with a wall blanking plate.
Should further problems occur, this
sensor is easily replaceable. While it
is not as good as having multiple slab
sensors in different parts of the house,
the sensor is at least located centrally
and so provides a good average slab
temperature.
At the time of writing, three of the
eight original slab sensors remain
working – but I am not hopeful that
will continue!
Trend graphs
The most useful aspect of the logging
and display system is the trend graphs.
Three different vertical axes can be
shown on the one screen, and typically the following approach is used:
• Top axis: inside temperature,
concrete slab temperature, outside
temperature
• Middle axis: wind speed and roof
ventilator flow
• Bottom axis: UV index
Using the touchscreen, the number
of axes shown (one, two or all three)
can be changed, with the graphs automatically resizing to fill the screen.
The horizontal and vertical axes of
each graph are also easily rescaled by
two-finger pinching and expanding
on the touchscreen. This approach
allows many parameters to be shown
in a way that allows understanding at
just a glance.
It’s easy to use the touchscreen to
draw horizontal lines that show the
maximum and minimum of each
graph. The system then calculates and
displays the numerical difference. For
example, seeing the range over which
the slab temperature has varied in the
past month is quick and easy. Screens
1-5 show some of the logged data.
Conclusion
Apart from those darned slab thermistors, the system has worked flawlessly. The ability of the system to
work with any analog sensor with an
output range of at least 0-2.5V means
that sensors for most environmental
parameters are readily available and
can be easily connected.
The touchscreen PC and Picolog
software give intuitive and quick
interaction – selecting data, changing
scales and allowing measurements to
be made. Hard-wiring of the sensors
avoids the need for periodic sensor battery replacement, and is more immune
to interference.
The system wasn’t cheap, but my
major goals of ease of use, accuracy and
clarity have been achieved. Plus, my
wife and I find the results fascinating
– while many of the measurements are
as we expected, significantly, some are
not. So it’s been a great learning experience – on a scale the size of a house!
SC
See overleaf for Screens 3-5
Screen 2: all three axes are visible: the top graph of temperature, middle graph of outside wind speed and roof ventilator
flow, and bottom graph of sunshine intensity. The abrupt dips in the sunshine graph indicate passing clouds.
siliconchip.com.au
Australia's electronics magazine
April 2026 63
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Screen 3: the red line shows the temperature at shoulder height, and the green
line the temperature at about 5m, near the ceiling. Note how the temperature
at height is greater than normal room temperature during the day, but this
reverses at night due to heat loss into the roof space through the upper walls
and ceiling.
Screen 4: logging over two days shows how slowly the internal temperature of
the concrete slab (red) varies. Here, its greatest rate of change is about 0.5°C per
day. The black line is the temperature of one of the 2000L internal water tanks
that provides quicker-response thermal mass. The tank changes in temperature
a little more rapidly than the concrete slab and is about 1°C warmer.
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Silicon Chip
Screen 5: the air temperature of different rooms in the house over two days.
Even with all the internal doors open, the northern rooms, exposed to spring
sunshine, are 1-3°C warmer than the southern rooms.
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The miniature 100W Hummingbird Amplifier from December
2021 has been popular, but some of the parts used
in that design are now obsolete. This
improved version features several
minor improvements, plus the
ability to use a wide range of
transistors in several roles.
100W Calliope
Amplifier
by Phil Prosser
T
his amplifier is founded on a
classic design made famous by
Douglas Self as the ‘blameless
amplifier’, and is reliable and powerful, especially for its size. As with
many things in the electronics field,
parts change and go obsolete.
Since it is useful and popular, we
thought it was worth updating to use
currently available devices, with as
many alternatives as possible; in case
something else becomes hard to get...
While at it, we have made a few optimisations to the layout, which at least
technically improves the performance
of this amplifier. Still, the performance
of the original amplifier was very good,
so we consider these minor upgrades.
Part of the popularity of the Hummingbird amplifier module is that it
that packs a surprising punch for its
size, while keeping the low-distortion
characteristics of the Ultra-LD Amplifiers from which it takes inspiration.
It can achieve up to 60W into 8W or
100W into 4W with distortion below
0.0005% at 1kHz, and less than
0.004% all the way up to 20kHz. That’s
way better than “CD quality”.
This project is more about the process of dealing with obsolescence, validating the changes and some discussion on the measurements we made.
For an in-depth explanation of the
design itself, refer to the original article
(siliconchip.au/Article/15126).
If you are in for a truly deep dive
into amplifier design, look up Douglas Self’s books, especially the Power
Amplifier Design Handbook that we
reviewed in the March 2010 issue
(siliconchip.au/Article/89). It is still
very much relevant more than 15
years later.
Maintaining and supporting this
design is a balancing act between
making necessary changes and adding
improvements while maintaining both
physical and performance compatibility with the original design.
The part that triggered this update is
the KSC3503 transistor (Q14) used in
the voltage amplification stage (VAS),
between the input differential pair and
Scopes 1 & 2: a Calliope amplifier driven into clipping with a KSC3503 transistor as the VAS compared to another
Calliope board with an MJE340 for the VAS (right). With the MJE340, it spends quite a long time ‘stuck’ to the negative
rail. For high-frequency signals, this can get very ugly.
66
Silicon Chip
Australia's electronics magazine
siliconchip.com.au
the output stage. This does not look
that critical, but it provides the bulk of
the voltage gain in the amplifier. How
this transistor behaves as it enters and
leaves saturation, which occurs when
the amplifier clips, is an important but
unusual requirement.
For a transistor to do well as a VAS
device, it needs to handle high voltages, and its Cob (output capacitance)
needs to be extremely low, ideally only
a couple of picofarads. In the old days,
this was an easy thing to find, as the
video stage in cathode ray tube (CRT)
television sets demanded similar specifications. These are broadly:
● Output capacitance (Cob): very
low, ideally < 3pF
● Collector-emitter voltage (BVceo):
>150V
● Current gain bandwidth product
(Ft): ideally in the 50-100MHz region
● Collector current (DC): >50mA
● Power dissipation: >1W
When we saw the KSC3503 was
marked as ‘end of life’, we went looking for an alternative part. With the
passing of the days of CRT monitors,
there is little reason for manufacturers to produce this type of device.
We knew this would not be a simple
change, as we looked for good VAS
transistors during the original design.
After days of searching suppliers
and audio forums, it started looking
like the only option was a surface-
mounting device. Were we being
silly? Should we care that much?
What happens if we just throw a
bog standard MJE340 into the board
instead? Well, the amplifier will work,
but you take a serious hit on how it
behaves around clipping, and in general performance and stability, as
shown in Scopes 1 & 2.
Less critical but also important for
the future, the range of output devices
and drivers has changed. We bought
a selection of different parts and validated them, so you can confidently
build this with one of numerous parts
options. Of particular interest to us are
new output device options (see Table 1
overleaf) and driver transistor options
(Table 2).
As can be seen in Table 3, ideal
options for the VAS are pretty limited,
and there is no ideal part that is readily available in a through-hole package. There are some decent choices in
SOT-223 (a fairly large SMD package),
though. So we had to bite the bullet
and make board changes to accommodate SMD parts for the VAS.
To test the VAS devices, we set up
a Calliope on our test jig (Photo 1),
set the input to 0.9V RMS and connected a 3W load. We then tested each
VAS device, one after another, without changing any settings or moving
cables. This setup might look agricultural, but has a fair bit of thought in it
and allows an objective comparison
between modules.
The test jig allows rapid changeover
between modules and allows us to
change components in situ, as the base
is narrow enough to access the rear of
the boards. It includes enough local filtering to let us run it from a bench DC
supply, so there are no mains voltages
involved, and we have a 6A current
limit on our power supply. Despite
that, it is beefy enough to allow us to
run the amplifiers hard.
The heatsink is undersized, and
gets very hot on long tests, but this
is handy, as we want to know how
the various versions behave when
abused.
Amplifier Features
Accepts a wide range of easy-toget parts (especially transistors)
Low distortion and noise
Extremely compact PCB
Fits vertically on a 75mm heatsink,
and can be stacked in a 2RU case
Produces the specified output
continuously with passive cooling
Uses all through-hole parts (or
optionally, one SMD for the VAS
transistor)
Low in cost and simple to build
Onboard DC fuses
Output over-current and shortcircuit protection
Clean overload recovery with
minimal ringing
Improved tolerance of hum and
EMI fields through small size and
improved layout
Quiescent current adjustment with
temperature compensation
Amplifier Specifications
Output Power (with ±34V DC rails):
100W RMS into 4Ω, 60W RMS into
8Ω
Frequency response (-3dB): 1Hz to
150kHz
Signal-to-noise ratio (SNR): 118dB
with respect to 50W into 4Ω
Input Sensitivity: 1.2V RMS for
60W into 8Ω, 1.04V RMS for 100W
into 4Ω
Input impedance: 22kΩ || 1nF
Total harmonic distortion (THD)
(32W into 8Ω, ±32V DC): < 0.005%,
20Hz to 20kHz, 50kHz bandwidth
Photo 1: our test
rig made it really
easy to measure
the difference in
performance as we
changed various
transistors on
the board. You
can see the
difference
between the
correct wiring
on the right
(cyan curve in Fig.2)
and the incorrect
wiring on the left
(mauve curve).
siliconchip.com.au
Stability: unconditional with any
normal speaker load ≥4Ω
Power Supply: ±20-40V DC; ideally
±34V DC from a 25-0-25V AC
transformer
Quiescent current: 53mA nominal
Quiescent power: 4W nominal
Output offset: typically <20mV
(measured)
Australia's electronics magazine
April 2026 67
Table 1 – output transistor options (available from Mouser, DigiKey & element14)
Device
Key characteristics
Comment
MJW21193G/
MJW21194G
High gain, optimised for
linearity
A new version of a
‘bulletproof’ favourite
MJW21195G/
MJW21196G
High gain, optimised for
linearity
A new, higher-voltage
version of a ‘bulletproof’
favourite
MJL21195G/
MJL21196G
Same as above but in a
slightly different package
TTA1943Q/TTC5200Q Targets audio
or 2SA1943/2SC5200 applications – linear gain
A cost-effective version
of another old favourite –
higher Hfe and Ft
NJW0281G/
NJW0302G
Lower power versions of
a ‘standard’
Optimised for match and
linearity – lower power
MJL21193G/
MJL21194G
Known good
MJL3281A/
MJL1302A
Known good
NJW21193G/
NJW21194G
Known good
2SC5242/2SA1962
Known good
Table 2 – driver transistor options (available from Mouser, DigiKey & element14)
Device
Key characteristics
Comment
MJF15030G/MJF15031G
Insulated-tab versions of
standard output drivers
Known good
MJE15030G/MJE15031G
Known good
MJE15032G/MJE15033G
Known good
Table 3 – VAS transistor options (most available from Mouser, DigiKey & element14)
Device
Package
Key characteristics
Comment
KSC2690A
TO-126
A higher Cob than
preferred
Works, but with some
sticking on clipping
KSC1845FTA
TO-92
On the edge with power Do not use at high
handling
voltages
KSC3503
TO-126
Obsolete/hard to find
Known good, if you can
get them
2N6517TA
TO-92
Higher Cob than
preferred
Works fine but do not use
at elevated voltages
BSP19-115
SOT-223
70MHz Ft
Prefer BF720/722
BF720
SOT-223
60MHz Ft
Works fine
BF722
SOT-223
60MHz Ft
Works fine (preferred)
PZTA42-TP
SOT-223
50MHz Ft
Assumed OK given DZTA
tests
DZTA42-13
SOT-223
50MHz Ft
Works fine (almost
surprisingly well)
2SC2911
TO-126
Obsolete/hard to find
A good choice if you can
get them
2SC3416
TO-126
Obsolete/hard to find
A good choice if you can
get them
BF469
TO-126
Obsolete/hard to find
An outstanding part if
you can get them
68
Silicon Chip
Australia's electronics magazine
We found a handful of BF469 transistors that had been gathering dust.
We don’t use obsolete parts in projects,
so they are not specified here, but it is
an old-school legendary VAS driver.
Since we had the test jig up and running, we dropped one in to compare
to all the other choices. It did very
well, so if you have a few BF469s and
are building this amplifier, we suggest
you use them.
Load line curves, which show the
safety margins for the various output
transistor options with 4W & 8W reactive loads (simulating typical loudspeakers) are shown in Figs.1(a) & 1(b).
You can see that all the options are
more than good enough for 8W loads,
apart from the venerable TIP35/36,
which are marginal but work if you
limit the supply rail voltages.
The recommended devices for 4W
loudspeakers are shown in Fig.1(b)
and they are all suitable. Fig.1(c)
shows how the single-slope load line
protection curves compare to the
SOA curves for a selection of output devices. The circuit is designed
to limit the devices to stay under the
dashed lines, which are fully within
the respective SOA curves, providing
complete protection.
There is no need to actually change
the general design, as the ‘blameless’
configuration is known to be good and
in use in many amplifiers around the
world. However, while we were at
the computer shuffling parts around,
it gave us the opportunity to make
some changes that have been on our
‘to-do list’ for some time. The changes
we have made to the PCB layout are:
● Moving the driver transistors
from the middle of the board to right
next to the output devices, and moving the bias setting potentiometer and
associated parts. This reduces routing complexity and provides better
thermal coupling of the driver transistors to the output stage, which
will improve thermal stability. The
better routing should improve high-
frequency performance, although this
is not something we could measure.
● We made room for a VAS transistor in an SMD SOT-223 package, with
a modest PCB heatsink area, while
keeping the option to use a TO-126
through-hole device.
We also tried a few different VAS
compensation schemes, in particular,
two-pole compensation as used on
the Ultra-LD Mk.3 & Mk.4 Amplifiers.
siliconchip.com.au
Photo 2: the Calliope (Hummingbird
Mk2) Amplifier module.
We could measure a difference, but
with this amplifier being so squished,
we saw more effect from wiring layout changes than the compensation
change delivered. So we used the
KISS principle on this and went back
to single-pole compensation. The final
board is shown in Photo 2.
Performance
Fig.2 shows total harmonic distortion plus noise (THD+N) measurements for the new amplifier into a 9W
resistive load at 32W. This is what we
could generate using our bench supply, but it is representative of what will
be achieved at higher supply voltages
into normal loudspeaker loads.
The performance is essentially the
same as the original Hummingbird.
If you are comparing this to what we
published in the December 2021 issue,
it’s important to realise that this plot
includes noise, whereas the earlier one
was THD only, so that plot showed
lower figures.
As with the original design, we have
tested the distortion of a range of output devices, VAS transistors and output drivers to ensure it behaves well
with all of them.
An important test for an audio
amplifier is how it behaves coming
out of clipping, especially with low
impedance loads. If you have the
wrong VAS device, it will ‘stick’ to the
negative rail, and if the output stage
has very high-frequency devices, you
can find bursts of oscillation near negative rail clipping. Scope 3 shows the
behaviour when driving a worst-case
3W load.
Figs.1(a)-(c):
SOA curves
and load
lines for
the various
output device
options
with 4W &
8W reactive
(loudspeakerlike) loads.
The dashed
lines in
Fig.1(c)
show the
protection
lines that
the circuit
prevents the
devices from
exceeding,
which
remain
within
their safe
operating
areas (SOA).
siliconchip.com.au
Australia's electronics magazine
April 2026 69
We also have checked the squarewave behaviour. The Calliope is very
well behaved with what is essentially
a band-limited square wave output.
We tested the harmonics generated
by the Calliope using a high-quality
audio spectrum analyser and found
they are very low in level. All harmonics are in the region of -110dBc
(0.000316%) to -115dBc (0.000177%).
Circuit details
Scope 3: clipping with the recommended BF722 VAS. The slight sticking to
the rails is normal; the amplifier recovers from saturation at a high output
current without ringing or oscillation.
Fig.2: three THD+N plots for the Calliope amplifier module at a reasonably
high operating power into a resistive dummy load. The cyan curve shows
what you can expect if you follow our instructions, while the mauve curve
is what you get if you don’t route the output wire as suggested. The red
curve shows the result of all the transistors being mismatched.
We will not go into a detailed
description of the circuit, as the one in
the December 2021 issue still applies.
This article focuses on building the
updated amplifier. You can download
or purchase this article from our website if you don’t have a copy and want
the detailed design description.
The Hummingbird and Calliope
amplifiers are physically much smaller
than those in the Ultra-LD series, but a
review of the circuit (shown in Fig.3)
reveals that it is very similar, with
the major difference being that Hummingbird/Calliope uses only one pair
of output devices (to handle up to
100W) instead of two (up to 200W),
and is optimised for operation at the
lower voltages that implies.
There are three main stages in a
‘blameless amplifier’. These are all
described in detail in the original
article:
1. The input stage, which uses Q7
& Q8 as a differential pair having a
constant-current source (Q3) and a
current-mirror load (Q15 & Q16).
2. The voltage amplifier stage (VAS),
comprising Q14 driven by emitter-
follower Q13 and loaded by constant-
current source Q2.
3. The output stage, which comprises
transistors Q4/Q5 & Q11/Q12, plus protection devices Q6/Q10. This is a conventional complementary output stage.
While the Hummingbird Mk1 and
Calliope circuits are very similar, if
Table 4 – protection resistor values for various output devices
NPN device
PNP device
22kW
W 560W
W 220W
W Comments
MJW21194G MJW21193G 22kW 560W 220W Performs as presented
NJW21194G
NJW21193G
22kW 560W 220W Performs as presented
MJL21194
MJL21193
22kW 560W 220W Performs as presented
2SC5242
2SA1962
15kW 470W 220W Limit to 25V AC transformer if driving difficult 4W loads
2SC5200
2SA1943
12kW 560W 180W Performs as presented
TTC5200Q
TTA1943Q
12kW 560W 180W Essentially the same performance
MJL3281A
MJL1302A
15kW 560W 180W Essentially the same performance
TIP35B/C
TIP36B/C
10kW 680W 180W Limit to 25V AC transformer, prefer 8W load; good performance
TIP3055
70
Silicon CTIP2955
hip
12kW 680W Australia's
270W Limit
to 25V AC
transformer & 8W loads; not verified
electronics
magazine
siliconchip.com.au
you compare Figs.4 & 5, you will see
how much the layout has changed.
Note how the new PCB accommodates either a through-hole or SMD
package transistor Q14. We have
thoroughly tested the various output
transistor, driver transistor and VAS
options.
We have stuck to the MJE150XX
family of driver transistors because
they are available, robust and perform
well. Any of the devices in this series
will do as long as you use the complementary NPN and PNP types. The layout changes have shifted the drivers
and resulted in a new layout for the
whole top half of the board.
This provides better thermal coupling of the drivers to the output
devices, and reduces the length of
traces with the relatively high base
drive current for the output devices,
improving stability. Should you be
using this amplifier in a very demanding application, there is still room to
mount small heatsinks to the output
driver transistors.
We have kept all mechanical features the same between versions, so if
you need to mix and match or replace
Hummingbird and Calliope amplifier
modules, everything will drop in.
We have kept the over-current/safe
operating area (SOA) protection for the
output devices. This provides protection if you connect a really horrible
load or somebody abuses the amplifier.
The Hummingbird amplifier delivers the measured performance with the
parts specified, but we have checked
that it works properly with a range
of other parts. For different output
devices, change the protection resistor values as per Table 4.
An amplifier using a dual 25-30V
AC output transformer, diode bridge
and capacitor bank will have ±35-42V
DC rails, which is safe operating into
4W, 6W and 8W loads. This will deliver
60W into an 8W load and 100W into
a 4W load.
Component matching
Part selection for the Calliope amplifier should be fairly straightforward.
We have provided tables of tested
parts. Provided you use complementary pairs for the output devices and
drivers, and select matched pairs for
the input differential amplifier and
current mirror, you will be fine.
The output pair; for example,
NJW21193/NJW21194, and the
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Challenges with measuring low distortion levels
Measuring very low levels of distortion is a lot harder than it might seem. There are a
few reasons for this, including:
1. Generating a sinewave test signal that is pure enough to measure distortion at levels below 0.001% reliably is hard, especially if you want to vary the frequency.
2. Knowing if what you are measuring is your measurement system or the device
under test is also tricky.
3. Even a tiny bit of EMI pickup can make huge differences in the measurements (simply rotating or moving the DUT can make the readings change massively).
4. Depending on how you Earth the DUT, you can measure voltages induced across
ground wires if you are not very careful.
For #1, we ended up using a Stanford Research Systems DS360 Ultra Low Distortion
Function Generator.
To measure the Calliope amplifier’s output harmonics, we are using a high-quality
sound card/ADC that requires a line level signal, so we use a 2.2kW/120W resistive
divider across the amplifier’s output, in parallel with our dummy load.
If we feed the test signal back into the ADC directly, we get a THD reading of 0.00017%,
so anything higher than that means we are measuring the amplifier’s distortion.
While making amplifier measurements, we got a distortion reading of 0.0018%. While
that is still not very high, it’s an order of magnitude higher than we were expecting. After
a lot of fiddling, we realised that it depends on which of the two screw terminals of CON4
we make the measurement at!
Connecting our measurement system to the unused terminal of the output connector
gave a lower distortion reading than the one that is carrying the current (Photo 3). The
only differences we see between these two points are:
1. We had to move the measurement probe and cabling slightly, which will pick up
different magnetic fields.
2. The output current is going through the PCB-to-connector junction and the connector-to-output wire junction (this is probably the reason, as dissimilar metal junctions
can be non-linear).
The point of mentioning this is that, when you are aiming for very low distortion, all
sorts of second order things start to matter, such as:
1. Earthing and where currents flow (probably the most significant concern)
2. Wiring layout, the magnetic fields the wires produce, and what they can couple into
3. The linearity of loads; we have seen wound Nichrome resistors cause significant
problems
4. The types of connector used; our terminals are made of steel, which we think may
be a factor
5. The actual ability of measurement
equipment
Now you know why, in the wiring section,
we recommend running the output wire up
past inductor L1 and trimpot VR1 to join
the supply wires running across the top of
the board. Simply running this wire on the
other side of L1 has a measurable impact
on performance, shown by the difference
between the cyan and red plots in Fig.2.
The effect is real and repeatable; moving the wire increases the size of the positive rail current loop to the output, which
is coupling the positive rail current into the
input and VAS stages. This makes the distortion worse across most of the audible
frequency range.
Photo 3: the two screw terminals on the
output connector are both soldered to
the output track; the left one is carrying
the output current, the right none. We
measured 0.0018% distortion on the left,
0.0007% on the right.
Australia's electronics magazine
April 2026 71
Fig.3: the Calliope circuit is
intentionally similar to the
original Hummingbird; there
are a few subtle tweaks, but
most of the improvements are
in the PCB layout and expanded
transistor choices. While we
have nominated NJL21193/4,
any of the MJL, MJL, NJL or
NJW prefix series with the same
numbers will work pretty much
identically.
Photo 4: the FrankenAmp in all its
glory! The input transistors are all
different parts, as are the drivers and
output pair. Do not do this in your
build unless you are truly desperate.
drivers, MJE15032/MJE15033 are
manufactured to have characteristics
such that the NPN and PNP characteristics reflect one another. This reduces
distortion when used in an amplifier
of this type.
The input differential pair, Q7/Q8,
does the heavy lifting in making sure
that the error in the amplifier output
(ie, distortion) is minimised. It also
plays a very important role in making sure there is no DC offset. These
transistors should be the same as best
we can match them, and ideally, thermally coupled.
The current mirror, Q15/Q16, keeps
the input differential pair in balance
and provides gain. These transistors
should also ideally be matched and
thermally coupled.
Feel free to choose pretty much
any pairs from the table; match those
input transistors and you will be good.
At this point, a question arose in my
mind: what if you get it really wrong? I
couldn’t resist the temptation, so out of
my fervid imagination comes the FrankenAmp (Photo 4). In this unit, every
single part that can be mismatched
was mismatched.
It isn’t just a matter of using BC556s
from different batches, either; in the
FrankenAmp, the input differential
pair is a BC558 and a BC556B, the
current mirror uses a BC549 and a
BC546, and so on. The drivers and
output devices are from completely
different families. How bad could
it be?
Fig.4: the original Hummingbird
Amplifier PCB layout, shown for
comparison to Fig.5.
72
Silicon Chip
Australia's electronics magazine
Unsurprisingly, the DC offset was
terrible, at 140mV. This is because
the gain of the input devices is grossly
mismatched.
Despite this, the amplifier is totally
stable and even behaves OK on clipping. The distortion performance is
even quite reasonable, as shown in
Fig.2! (BD139s are notoriously different between manufacturers; it is
likely I used an old Philips one, better than most).
So even if you get it really wrong,
as long as the DC offset is acceptable,
the amp will work quite well.
Construction
Construction of the Calliope amplifier is pretty easy. It is built on a 63
× 86.5mm double-sided PCB that’s
coded 01111212 – see Fig.5.
First, based on the output devices
you will be using, select the required
resistor values from Table 4. These
components are shown in red in Fig.5.
If you read those same values off
Table 4, build it as per our diagrams.
siliconchip.com.au
Otherwise, substitute the resistors
with values shown in red for the different values in the table.
After fitting those, install all the
other small (¼W resistors). Follow
with the 1N4148/1N914 diodes, making sure they are orientated as per
Fig.5. Follow by fitting all the capacitors, soldering the smaller ceramic
and MKT types first, then the electrolytics. Make sure that the electrolytic
capacitors go in the right way around,
with the longer (positive) leads to the
pads marked +.
If you are using an SMD VAS transistor, as recommended, fit it now, as
there will be more room. Follow with
all remaining transistors, except those
that mount to the heatsink. Ensure
that driver transistors Q4 and Q12 are
installed with their metal tabs facing
towards the amplifier input (ie, away
from the output transistors).
We want transistor pairs Q7/Q8
and Q15/Q16 to be thermally coupled with one another. Our approach
is to superglue these face-to-back, then
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put heatshrink tubing over them. You
could glue them together after mounting them, as long as you mount their
bodies reasonably close.
If you can, select pairs for these
devices with similar Hfe by measuring
a handful of devices and choosing two
that are similar. This can minimise the
DC offset of the final amplifier.
Now solder the fuse clips, making
sure they go in the right way around,
with the retention tabs on the outside.
After that, solder all the connectors.
The wire entries for the power terminal blocks go towards the edges of
the board, while the output connector should have its wire entries facing
towards nearby diodes D1 & D3.
After that, you can mount the larger
resistors (0.22W × 2, 4.7W & 15W) and
the multi-turn potentiometer, VR1.
We need to make sure the potentiometer starts at maximum resistance, so
fit it with the screw located as shown,
Fig.5: the new Calliope PCB layout
moves the driver transistors (Q4 &
Q12) closer to the output transistors
(Q5 & Q11) and makes room for Q14
to be either in a vertically mounted
through-hole (TO-126) package or an
SMD (SOT-223) package.
Australia's electronics magazine
April 2026 73
Parts List – Calliope 100W Amplifier (per module)
1 double-sided PCB coded 01111212, 63 × 86.5mm
1 split rail power supply delivering ±20V to ±40V DC (15-28V AC mains transformer,
bridge rectifier, filter capacitors, mains socket, mains-rated wiring, heatshrink etc)
3 2-way 5/5.08mm pitch mini terminal blocks (CON1, CON3, CON4)
1 2-way polarised/locking pin header (CON2)
4 M205 fuse clips (F1, F2)
2 5A M205 fast-blow ceramic fuses (F1, F2) [Altronics S5931]
1 1m length of 0.8mm diameter enamelled copper wire (L1)
1 500W vertical or side-adjust multi-turn trimpot (VR1)
2 TO-3P insulating kits (washers and bushes)
1 TO-126 insulating kit (washer and bush)
3 M3 × 25mm panhead machine screws
3 flat washers to suit M3 screws
3 crinkle washers to suit M3 screws
3 M3 hex nuts
2 blown M205 fuses (for testing, or purposefully blow 100mA fuses)
1 heatsink (we used one Altronics H0545 for six modules)
1 small tube of superglue
1 5cm length of masking tape
Semiconductors
5 BC556 65V 100mA PNP transistors, TO-92 (Q1, Q3, Q7, Q8, Q10)
1 MJE350 300V 500mA PNP transistor, TO-126 (Q2) [Altronics Z1127, Jaycar ZT2260]
1 MJE15032G or MJE15034G 250V/350V 8A NPN transistor, TO-220 (Q4)
[element14 9556621, DigiKey MJE15034GOS-ND, Mouser 863-MJE15032G]
1 NJW21194G or MJL21194 250V 16A NPN transistor, TO-3P (Q5) [Jaycar ZT2228,
element14 2535656, DigiKey NJW21194GOS-ND, Mouser 863-NJW21194G]
3 BC546 65V 100mA NPN transistors, TO-92 (Q6, Q13, Q17)
1 BD139 80V 1A NPN transistor, TO-126 (Q9) [Altronics Z1068, Jaycar ZT2189]
1 NJW21193G or MJL21193 250V 16A PNP transistor, TO-3P (Q11) [Jaycar ZT2227,
element14 9555781, DigiKey NJW21193GOS-ND, Mouser 863-NJW21193G]
1 MJE15033G or MJE15035G 250V/350V 8A PNP transistor, TO-220 (Q12)
[element14 9556630, DigiKey MJE15035GOS-ND, Mouser 863-MJE15033G]
1 BF722 250V 100mA NPN transistor, SOT-223 (Q14)
[element14 1757916, DigiKey BF722,115, Mouser 771-BF722-T/R]
2 BC549 30V 100mA NPN transistors (Q15, Q16)
3 1N4148/1N914 75V 250mA small signal diodes (D1-D3)
Capacitors
1 220μF 25V electrolytic [Altronics R5144, Jaycar RE6324]
4 100μF 50V 105°C electrolytic [Altronics R4827, Jaycar RE6346]
1 47μF 50V low-ESR electrolytic [Altronics R6107, Jaycar RE6344]
1 10μF 50V non-polarised electrolytic [Altronics R6560, Jaycar RY6810]
1 220nF 63V MKT [Altronics R3029B, Jaycar RM7145]
5 100nF 63V MKT [Altronics R3025B, Jaycar RM7125]
1 22nF 63V MKT [Altronics R3017B, Jaycar RM7085]
1 1nF 63V MKT [Altronics R3001B, Jaycar RM7010]
1 220pF 100V NP0/C0G ceramic [element14 1600858,
DigiKey 56-K221J10C0GH5UH5CT-ND, Mouser 594-K221J15C0GH5TH5]
Resistors (all ¼W+ 1% metal film axial unless otherwise stated)
1 220kW
1 82W
4 22kW ♦
2 68W
2 3.9kW
2 47W ♦
3 2.2kW
1 39W
1 1.2kW
1 15W 1W 5%
2 560W ♦
1 10W
1 390W
2 10W 5W 10% (for testing)
4 220W ♦
1 4.7W 1W 5%
6 100W ♦
2 0.22W 5W 5% ♦
♦ two of each may need to change in value depending on the output transistors used
♦ ½W or 0.6W 1% metal film
♦ element14 1735119, DigiKey BC3440CT-ND, Mouser 594-AC050002207JAC00
then rotate the screw anti-clockwise
until it clicks.
Verify with a multimeter that the
resistance between its two outside terminals is below 25W.
By the way, side-adjustment pots
are better if you’re going to be mounting the amplifiers vertically on the
heatsink, while a top-adjustment pot
makes most sense if it will be mounted
horizontally.
Next, make the inductor using
0.8mm diameter enamelled copper
wire (ECW) as follows:
1. Find a mandrel that is about
10mm diameter and has a slight chamfer to it so that, once complete, you
will be able to slide the inductor off.
We chose a large Sharpie marker.
2. Put masking tape around the
mandrel with the sticky side faced
outwards.
3. Placed a bend in the ECW
30-40mm from the end and wind nine
turns onto the tape.
4. Put a few drops of superglue on
the ECW; don’t worry if it gets on the
masking tape. You do need to be careful not to get glue on your mandrel,
though!
5. Give this a minute to set, then
wind another layer on top of the first
nine turns. You might only be able to
get eight in; that is OK. Add more super
glue and again, allow it to set.
6. Add a final winding layer and
glue it.
7. Push the inductor off the mandrel.
8. Tease the masking tape from
inside the inductor; we used needle-
nosed pliers to do this.
9. Scrape the enamel off the leads
and mount it to the PCB above the
4.7W resistor.
At this point, the board should be
complete bar Q5, Q9 and Q11. From
here, you need to mount the output
devices to their final heatsink using
insulating kits. Then bend the legs of
the transistors to match the PCB, as
shown in the photos. Slip them into
their respective holes on the PCB. The
aim here is that these transistors fit
reasonably well.
Once the three transistors are properly inserted into the PCB, solder them
in place. This way, we know that the
transistors are mounted with minimal
tension on the soldered connections,
ensuring a long life of the solder joints
(a solder joint under stress has a tendency to crack and go dry).
At this point, you should have all
Australia's electronics magazine
siliconchip.com.au
74
Silicon Chip
Photos 5 & 6: The finished Calliope Amplifier, and the test jig used for
measurements. The output wire (brown in this case) should be pushed back to
run next to the emitter resistor, like it does here.
parts mounted to the board, and are
ready to test it.
Testing & adjustment
Your amplifier is probably mounted
to the heatsink, but the initial test can
be done without it – just make sure that
the bias current is set to minimum.
This test will check the amplifier is
operational:
1. Remove the normal 5A fuses from
the board and install blown M205
fuses with 10W 5W resistors soldered
across them (‘safety resistors’).
2. Connect a voltmeter between the
output and ground, set to a 200V range
or similar.
3. Connect a voltmeter across one of
the 10W safety resistors, set on a 20V
range or similar. If you only have one
meter, run an initial check monitoring
the output voltage only.
4. With the input to the module disconnected, apply power. Anything
over about ±15V is fine. If you can, set
the current limit on the power supply
to about 100mA.
5. Check that the output voltage
settles to 0V ±50mV. We built 14 test
units, and all were well within this
range.
6. Check that the voltage across the
10W resistor is less than 1V (ie, it’s
drawing under 100mA).
If either test fails, you need to check
for the cause. Do you have VR1 set at
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SC6633 ($30 plus postage): Songbird Kit
Choose from one of four colours for the PCB (purple, green, yellow or red). The kit includes nearly all
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siliconchip.com.au
Australia's electronics magazine
April 2026 75
the right end of its travel? Are all the
electrolytic capacitors in the right way
around? Do you have the input connected? If so, disconnect it. Are all the
transistors in the right places and the
right way around? Check those output
devices are in the right spot!
Is your power supply delivering
both positive and negative rails, and
do you have the ground connected?
Assuming it passes the test, it’s time
to adjust the quiescent current and run
a full operational test. This requires
the amplifier to be mounted to a heatsink with appropriate insulators for
the output devices and thermal sense
transistor. Before powering it up, verify a high resistance between both
power supply rails and the heatsink.
Apply power and adjust the bias by
turning the potentiometer clockwise
while watching the voltage across the
10W resistor. Nothing will happen for
quite a few turns, then the bias current will rapidly increase. Adjust it to
achieve 500mV across the 10W resistor.
Allow this to settle and readjust. It can
take a while to settle, and should be
set with the full rail voltage applied.
Power it off, re-install the 5A fuses
and you are ready to connect a loudspeaker and run it with an audio signal.
You can check the bias (quiescent
current) later by measuring the voltage
across the 0.22W resistors; you should
see close to 10mV across each.
Installation
Our earlier discussion on measurement pointed out the criticality of
Fig.6: when finalising
the amplifier wiring
in your case, run the
supply and output
wire to each module
like this to get the best
performance.
layout to get the most of the amplifier. Careful attention to layout and
the power supply is required.
The power wiring from the main
supply capacitors should be delivered
on twisted sets of positive, negative
and ground wires. The output should
fold back toward the output devices,
and run parallel to the 0.22W resistors,
then follow the power wires – see Fig.6.
The output wire should follow the
power wires back past the power supply and pick up a ground wire, minimising the loop area created, then
run as a pair from there to the speaker
terminals.
Ensure that the power supply has a
‘star Earth point’ from which you connect to the input ground, the amplifier
ground and the speaker output ground,
as shown in Fig.7. Also make sure that
the way you connect the rectifier and
its ground to the capacitors does not
inject noise onto your star Earth point.
The input cable shields/screens
should also be connected to the star
Earth point.
Make sure all connections are secure
and low resistance; poor connections
can easily more than double the distortion level. We found this measuring
a batch of modules we built to verify
our results, having to tighten the connections to achieve consistent results.
Is it worth upgrading a
Hummingbird to the Calliope?
Not really. While the layout is
improved, and we provide options
for some more recent and ‘optimised’
parts, the Hummingbird performs
pretty well. While the Calliope is an
improvement overall, its main advantage is that it is more future-proof and
easier to source parts for. We have a
mix of both in use and are quite comSC
fortable with this.
Boosting the output power
Fig.7: configure your amplifier power supply like this to keep the ripple
currents from recharging the capacitor bank out of the amplifier ground lines.
76
Silicon Chip
Australia's electronics magazine
If you add extra output devices, you
can within reason. But watch the
ratings of your capacitors and input
devices. If you want serious power,
you should consider the SC200
(January-March 2017; siliconchip.
au/Series/308), which gives roughly
double the output power.
Otherwise, the Ultra-LD Mk.3/4
Amplifiers (July-September 2011
& August-October 2015) will give
you roughly the same power as the
SC200 but with lower distortion.
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ilicon Chip
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Rotating Lights
April 2025
SMD LED Complete Kit
SC7462: $20
TH LED Complete Kit
SC7463: $20
USB-C Power Monitor
August-September 2025
Short-Form Kit
SC7489: $60
USB Power Adaptors
May 2025
Complete Kit
with choice of USB socket
SC7433: $10
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This kit includes everything needed to build
the Rotating Light for Models, except for a
power supply and wire.
This kit includes all non-optional parts, except
the case, lithium-ion cell and glue. It does
include the FFC (flat flexible cable) PCB.
You can choose from one of four USB sockets
(USB-C power only, USB-C power+data, mini-B
or micro-B). The kit includes all other parts.
Compact HiFi Headphone Amplifier
Complete Kit
SC6885: $70
PICKit Basic Power
Breakout Board
September 2025
December 2024
& January 2025
siliconchip.au/Series/432
This kit includes everything required to build the Compact HiFi Headphone Amplifier. The case is
included, but you will need your own power supply.
Mic the Mouse
Complete Kit
SC7508: $37.50
August 2025
siliconchip.au/Article/18637
It includes
everything
needed to build
one Mic the
Mouse, except for
solder, glue and a
CR2032 cell.
Complete Kit
SC7512: $20
siliconchip.au/Article/18850
Includes the PCB, all onboard parts and a
length of clear heatshrink tubing. Jumper wire
and glue is not supplied.
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→ Prices listed do not include postage. Postage rates within Australia start at $12, rates are calculated at the checkout.
Project by Gianni Pallotti
These days most mobile phones can play
audio files (in formats like MP3 and WAV) but
sometimes you just want something simple to
play some music or sounds. This circuit uses
little other than a Micromite LCD BackPack
and a DFPlayer Mini module, and it can play
such files from a microSD card.
Micromite-based
MUSIC PLAYER
S
ome potential uses for this design
include playing sounds or white
noise to drown out a noisy environment (such as construction noise),
or playing calming music before bedtime, which can benefit some children
or those with insomnia or tinnitus.
Depending on personal preferences,
options like coloured noise, soothing
music or natural sounds such as running water, animal sounds or rain can
help you to relax and fall asleep easily. A consistent sound, like running
water or waves crashing, can help
to mask background noises without
being intrusive.
I have succumbed to tinnitus (commonly known as ringing in the ears)
and, after trying some possible solutions, I have found the best one is listening to soft sounds during the silent
part of the day and night.
Although there are various ways to
listen to such sounds, including apps,
websites and dedicated devices, I liked
the idea of building my own player. I
am using it to play the calming patter of rain on a window, soft rustling
leaves, birds chirping, plus wind and
ocean wave noises. They also help to
focus our attention outward rather
than on our own anxiety or obsessive
thoughts.
This project could also function as
a digital MP3 music player, capable of
storing and playing plenty of songs.
The DFPlayer Mini MP3 player
module (data sheet: siliconchip.au/
link/ac83) used in this design was
described in detail in the article
titled “A stamp sized digital audio
player” (December 2018; siliconchip.
au/Article/11341). I also used it in a
previous design, the Slot Machine
project (May 2022; siliconchip.au/
Article/15310).
microcontroller and LCD, effectively
turning it into an ‘audio BackPack’.
For the first two options, most components used are obtainable from
the Silicon Chip Online Shop, such
as the Micromite LCD BackPack kit
(see siliconchip.au/Shop/20/3321)
and DFPlayer Mini (siliconchip.au/
Shop/7/4789). The only other required
Fig.1: very little needs to be added to
a Micromite LCD BackPack to turn it
into an audio player. The audio files
are stored in MP3 format or similar
on a microSD card plugged into the
DFPlayer Mini module.
Assembly options
An enlarged view of the DFPlayer
Mini’s underside. The module is
shown at actual size in the lead photo.
78
Silicon Chip
The circuit is quite basic, as shown
in Fig.1. There are three ways to build
the Music Player:
1. You can wire up the DFPlayer
Mini module and other parts (there
are just a few) to a Micromite LCD
BackPack using jumper leads or by
soldering wires.
2. You can build my small add-on
board that hosts the DFPlayer Mini
and other parts, and plugs into the
LCD BackPack.
3. I have also designed a board that
has everything onboard, including the
Australia's electronics magazine
siliconchip.com.au
An empty cotton bud
container is an inexpensive
way to house the finished
project.
The add-on board
for the Music
Player. It’s a
simple design
due to most of the
work being done
by the Micromite
BackPack. There is a
single 1kW resistor on
the underside.
component is an adaptor for linking
the DFPlayer to the BackPack.
The optional PCB coded 01110251
(38.5 × 30.5mm) plugs into the BackPack and hosts the DFPlayer Mini
plus a handful of other components,
making both the construction and wiring easy.
The optional all-in-one board,
which uses a 2.4-inch touchscreen
rather than the 2.8-inch one used on
the BackPack, is coded 01110252 and
measures 87 × 52mm.
Besides connecting the audio
player module to the BackPack, both
boards also facilitate connections to
a loudspeaker and the input power
supply.
The whole assembly will easily fit
inside a small container measuring
110 × 80 × 55mm or so. I have found
it very economical to use an empty
cotton bud container for this. It costs
just $2.99, and you get 200 cotton buds
as a bonus! I painted the inside of the
clear box to minimise any light from
the LEDs on the DFPlayer Mini module showing through it, but you might
like that effect.
The cutouts required for the LCD
panel, speaker, USB power input and
on/off switch when using this container are shown in Fig.2.
I used a 2.8-inch Micromite LCD
BackPack V1 as it’s the simplest and
cheapest of the BackPacks that use the
2.8-inch TFT touchscreen. You can
use the V2 (with onboard USB interface and PWM backlight dimming)
or the V3 (with even more features,
although we don’t need any of them
here). In the following description, I
will assume you are going to use the
V1 like I did.
As there is no PWM option to reduce
Fig.2: these are the cut-outs required in the specified 110 × 80 × 55mm box. You could use a larger box, but will need to
adjust the hole positions.
the LCD panel backlight on the V1
Micromite LCD BackPack, the unit
can simply be placed face-down if you
don’t want bright light from the screen.
This will have the added advantage of
better dispersion from the speaker hole
in the rear of the case.
If you use the larger all-in-one board,
you don’t need to assemble a BackPack; it’s integrated into that design,
as shown in the Fig.3 circuit.
If you are using the separate BackPack, build the BackPack first, then
assemble the add-on board as per Fig.4.
80
Silicon Chip
It’s pretty straightforward. If building
the all-in-one version, mount the components as per Fig.5 now.
For the all-in-one version, either
fit the 13W resistor and omit Q1 & Q2
for fixed touchscreen backlight brightness, or omit the 13W resistor and fit
Q1 & Q2 for PWM backlight brightness
control. Importantly, if your touchscreen has yellow plastic on the 16-pin
connectors, it will run at full brightness regardless of the value of the 13W
resistor, unless you opt for PWM backlight control.
Australia's electronics magazine
Note that if you are using Micromite
LCD BackPack V3, or the all-in-one
PCB with PWM backlight brightness
control, by default, the backlight will
be driven with a 50% duty cycle. It’s
possible to have touchscreen controls
to adjust the brightness, but they are
not part of the supplied software. So
if you want such controls, you will
need to add them.
Once the board(s) have been assembled, wire them up and mount the
components in the case as shown in
Fig.6 (overleaf). This shows the wiring
siliconchip.com.au
Fig.3: this is the
simplified circuit
of the larger
all-in-one PCB that uses the
2.4-inch touchscreen. The other
difference is the BUSY signal from
the DFPlayer Mini module goes to
pin 6 of IC1 instead of pin 24.
Fig.4: it’s easy to build the
add-on board; it basically
exists just to connect the
DFPlayer Mini module (via
two header sockets) to the
BackPack and loudspeaker.
Fig.5: this board has all
parts onboard so doesn’t
require the BackPack,
although it’s sized for the 2.4-inch touchscreen rather
than 2.8-inch (they have the same pixel resolution).
The screen plugs into CON4 & CON5 and mounts on the
three tapped spacers.
for the add-on board version. Note that
the speaker wiring polarity is unimportant.
Keep in mind that, if you use a
USB-C socket like I did, and it doesn’t
have any onboard resistors (most
don’t), it isn’t guaranteed to work if
you use a Type-C to Type-C cable.
It will work with Type-C to Type-A
cables, though.
If you’ve built the all-in-one version,
the USB socket is onboard, so position
it to be accessible through the hole in
the case. There is no power switch in
siliconchip.com.au
this case; you unplug it to switch it off.
The speaker wiring is the only external wiring required.
Software
Once the board(s) have been built,
assuming the PIC32 chip is programmed with the Micromite firmware, you just need to load the BASIC
code onto it. You can do this by using
a USB/Serial adaptor or, if your BackPack has a USB socket, via that socket.
Refer to the Micromite and BackPack
articles for detailed instructions on
Australia's electronics magazine
doing this. The basic procedure is as
follows.
You will need a serial terminal
program, such as TeraTerm on the
Windows operating systems. The
AUTOSAVE command is probably
the simplest way to load the BASIC
code. You will also need to configure
the Micromite OPTIONs to enable the
LCD panel and touch sensor, then calibrate the touch sensor.
If you haven’t used a Micromite
processor before, Geoff Graham’s
Micromite webpage includes all the
April 2026 81
information you might need on the
Micromite (see https://geoffg.net/
micromite.html). The Micromite manual, which you can download from
that page, includes instructions for
configuring LCD touch panels.
The BASIC files list the OPTIONs
in comments near the start. There are
two different files. “Sound Player.bas”
is used with the Micromite BackPack
PCB, while “Sound Player2.bas” is
used with the All-In-One PCB.
Parts List – Micromite-based Audio Player
Common to all versions
1 plastic box, 110 × 80 × 55mm
1 DFPlayer Mini audio player module [Silicon Chip SC4789]
1 4W 3W miniature loudspeaker [Adafruit 3351]
1 microSD card
1 2-pin right-angle female header socket, 2.54mm pitch
4 10G × 10mm self-tapping screws
4 M3 × 25mm panhead machine screws
4 M3 × 12mm tapped nylon spacers
4 M3 × 3mm untapped nylon spacers
2 M1.6 × 6mm machine screws and nuts
1 50cm length of twin medium-duty red & black cable
Operating the Player
Add-on PCB version
The Micromite program is controlled through touch commands on
the LCD screen.
All-in-one version
These include the following main
buttons (see Screen 1):
PLAY: start playing a track
PAUSE: pause playback of the current track
<PREV: play the previous track in
the same folder
NEXT>: play the following track in
the same folder
FOLD: change to the next available
folder and play the first track
−VOL: decrease the volume, from a
maximum of 30 down to 0
+VOL: increase the volume, from a
minimum of 0 up to 30
1 2.8-inch Micromite LCD BackPack programmed with MMBasic V5.05.05 [SC3321]
1 single-sided PCB coded 01110251, 38.5 × 30.5mm
1 SPST panel-mount switch (toggle or slide)
1 1kW SMD resistor, M2012/0805 size
Connectors
1 panel-mount USB socket with breakout board
1 14-pin female header socket, 2.54mm pitch
1 2-pin right-angle header, 2.54mm pitch
1 double-sided PCB coded 01110252, 87 × 52mm
1 2.4-inch ILI9341-based LCD touchscreen module
1 PIC32MX170F256B-50I/SP microcontroller, DIP-28, MMBasic V5.05.05 (IC1)
1 28-pin DIL IC socket (optional; for IC1)
1 MCP1703AT-3302E/MB 3.3V LDO voltage regulator, SOT-89 (REG1)
1 2N7002 N-channel Mosfet, SOT-23 (Q1)
1 AO3401(A) P-channel Mosfet, SOT-23 (Q2)
4 10µF 50V X5R SMD ceramic capacitors, M3216/1206 size
2 100nF 50V X7R SMD ceramic capacitors, M3216/1206 size
1 10kW SMD resistor, M2012/0805 size
3 1kW SMD resistors, M2012/0805 size
1 13W SMD resistor, M2012/0805 size (optional; fixed backlighting; omit Q1 & Q2)
Connectors
1 PCB-mounting 4-pin USB mini Type-B miniature socket (CON1)
1 4-pin female header socket, 2.54mm pitch (CON4)
1 14-pin female header socket, 2.54mm pitch (CON5)
Screen 1:
the default
screen of
the Audio
Player in
use.
The round buttons provide the following options:
PLAY ONCE: play the selected track
once only
REPLAY: continuous looping of the
selected track
2HRS: stop playback after two hours
SAVE: saves the current folder, track
selection, play mode and volume
The SAVE button changes to yellow each time a setting is changed,
then reverts to white when the button is touched, confirming that the
new settings have been saved. This
is a reminder to save the changes.
At startup, the stored data (if saved)
is loaded and the MP3 is set accordingly. Otherwise, it uses the defaults:
volume = 15, folder #1, track #1, no
repeat (play once).
The list of folders is hard-coded in
the Micromite MMBasic program. For
example, by default the line is:
DIM FolderName(4)
As String = (“1-Nature”,
”2-Rain”,”3-Water”,
”4-Wind”,”5-Sounds”)
82
Silicon Chip
Australia's electronics magazine
siliconchip.com.au
The finished Music Player fits neatly
in the painted plastic box that the
cotton buds came in.
Only the red (+) and
black (-) wires need to be
connected.
This is the 3W
speaker I used. It
works well and I recommend it,
but there are plenty of other options.
The reason it’s (4) instead of (5) is
that there is an index zero, so with a
maximum index of 4, up to five strings
can be stored. You can change that
number, but make sure it’s always one
less than the number of folders listed.
Each folder can contain as many as
3000 tracks, assuming the SD card has
sufficient capacity.
If the next folder or previous/next
track is not found, the program will
revert to the first folder saved on the
microSD card, or to the first track in
the pre-selected folder.
The name of the folder and the track
number within the selected folder will
show on the LCD panel. The volume
setting is shown as a bargraph and as
a number next to the graph.
Micromite pins 9 & 10 (COM2) are
used for the 9600 baud bidirectional
serial communications port with the
DFPlayer Mini module. The commands sent to the module have been
reduced to only the strict requirements, each consisting of three strings:
Initiate$ + Function$ + End$. The
Function$ string is the main command
SC
component.
Fig.6: how to wire up the add-on module to the BackPack (V1 shown here),
speaker, switch and power socket. The wiring for the full board shown in
Fig.5 is much simpler, as only the speaker needs to be connected.
siliconchip.com.au
Australia's electronics magazine
April 2026 83
SERVICEMAN’S LOG
Going straight for the jug-ular
Dave Thompson
Home appliances – I love them! So much, in fact, that I have plenty
languishing unused in cupboards and often have to have a clear out to
make room for more. They make life so much easier for most of us.
While the rock stars of the appliance world, such as
ovens, refrigerators, dishwashers, washing machines and
dryers, all make our usual chores faster and more efficient, it is the unsung heroes that can really make a difference. That’s the backing band of kettles, juicers, mixers and vacuum cleaners. These guys all get a thorough
thrashing in the typical household, and are equally stars
of the show.
We all know that appliances are not made to last anymore; it seems nothing is made for a long service life these
days. Still, so many of them are inexpensive and just ‘do
the job’. For example, I can buy an electric jug from the
local ‘mart’ (insert shop name here) for less than $20. These
plastic fantastic models work well and do what they say
on the tin – they boil water.
Once the plastic taste is boiled out of them, they will
give years of service, until they have boiled dry one too
many times, or simply get too manky to clean anymore.
When that happens – and it will – it’s no big deal to just
go and buy another one. Rinse, wash and repeat ad nauseum (and ad infinitum?).
These cheap jugs are perfect for a student doss, a worksite,
or down in the shed; there is nothing wrong with these ‘consumable’ products. Back in my day, when I walked
to school in the snow, bare-footed (and uphill both
ways!), my parents ‘invested’ in appliances like a
kettle or a bench mixer.
Yes, they were more expensive than they are
now, and it is true we had limited choices, but
these things were well made and built to last
(for a lifetime in some cases). The business
model was similar to that of a car.
By that I mean that you bought
the appliance once as they had
been made solidly and with longterm use and eventual repairs
in mind.
There was a backup
network of agents, dealers, repair guys and (more
importantly) lots of spare
parts available,
with the intention that their
product would
provide householders many
84
Silicon Chip
years of service and last as long as it was still sensible and
viable to repair them.
And when you realised that company made good products, presumably you went back and bought more of them,
since you wanted your stuff to last. Alas, that effect must
not be too strong, because even legendary companies like
Toyota seem to be giving up on quality being a selling
point (or at least are struggling to maintain consistently
high quality these days).
My mother had a benchtop mixer made by a well-known
brand. She had it for more than 30 years, and Dad kept
it going with a bearing here and a motor armature there.
Things wear out, especially if they are being used. The point
is that he just got onto the agent and bought the parts for
it; it was relatively easily repaired. We can still get parts
for that mixer even now!
But I digress. We’d been through many cheaper electric jugs and decided to splash out on the latest one. It’s a
known brand, and while pricey, it is designed, built and
supported according to the principles I mentioned above:
aesthetically pleasing (and very retro), can be fully disassembled and the parts replaced, and those parts are available worldwide (more on this later!).
The company has been around since the early
1900s, so they’ve obviously worked out how to
do it well and in keeping with the old-style business model of building things to last. So if it does
fail, we can simply repair it.
I’ve actually written about this particular jug
before (a while ago), where sometimes it wouldn’t
‘reset’ after it had boiled, in the September 2020 issue, starting on
page 64 (siliconchip.au/Article/
14575).
Anyway, it eventually settled down and never did that
again. However, a short while
ago, it started not switching off
when the water boiled.
While it does seem to take a
little longer than some
kettles and jugs
I’ve had, usually after about
10 seconds of
boiling, it used
to switch off and
Australia's electronics magazine
siliconchip.com.au
Items Covered This Month
• A juggling act
• The heat gun that got too hot
• Repairing an electric cooktop
• An electric fence repair
Dave Thompson runs PC Anytime in Christchurch, NZ.
Website: www.pcanytime.co.nz
Email: dave<at>pcanytime.co.nz
Cartoonist – Louis Decrevel
Website: loueee.com
the heating button would click back to its default ‘off’
position.
As a test, I let this one boil for a good two or three minutes at a full, rolling boil and it still didn’t stop, so it was
time to look into it.
The first thing was to get more information. The user
manual that comes with it is comprehensive, but doesn’t
have much of a troubleshooting section because, well,
there’s not a lot to troubleshoot! That section consists of
just the basics: Jug doesn’t turn on? Check the power connection and that the jug is seated properly in the cradle,
that sort of thing.
Obviously, this isn’t much chop at all, so I went looking
further afield into forums and user groups in the hope of
a service manual. I didn’t find anything, to be honest. The
best suggestion, which seems to have worked for some, is
to de-scale the appliance.
This seemed to me like too simple a resolution. I mean,
yes, we all usually need to de-scale appliances, and I’ll
admit, in the eight years we’d had it, we had never de-scaled
it. Still, I didn’t think we had to if we couldn’t see any obvious signs of scale in the jug. It looked to me to be almost
as-new inside.
But this is what people were suggesting, so maybe that’s
all it was? Perhaps it had clogged up with scale somehow.
Of course, I had to then go and buy a de-scaling agent,
and there are a surprising number to choose from. There
are specialist types for dishwashers, coffee machines, water
filters and others, but I only found one supposedly meant
for kettles, so that would have to do .
I wasn’t about to deep dive into the differences between
them all (my hunch is they are likely all the same), so I
stuck with that one and got down to de-scaling the jug.
Editor’s note: you can also use white vinegar mixed
50/50% with water. Don’t boil it for long; switch it off and
let it sit for 30 minutes before emptying, then rinse it thoroughly. Citric acid solution is even better.
This highly technical process involves adding the contents of a sachet to the jug, pouring in half a litre of water
and boiling it. I let it cool, then tipped out the solution and
repeated. This is supposed to break down any limescale
or other residues that might clog up the element or thermostat mechanism.
This is fine in jugs and kettles that have an exposed element or a sensor inside the boil chamber, but if the element or thermal switch is on the underside of the chamber, it will never get scaly, anyway. To be honest, I didn’t
see any difference to the boiling chamber after descaling,
and in true fashion, it still didn’t switch off when the water
boiled. So, no simple fix for me then!
siliconchip.com.au
There was no other option but to tear the thing apart and
have a look. However, as we were dead in the water without a jug, we ordered another identical one, which was
delivered a few days later. I was just hedging our bets; if
I could repair the old one (at this point I had no idea if I
could), at worst we’d end up with two jugs.
Most people would never use two jugs, and I didn’t need
two either, so if I did get it working, it would become a
spare. It could sit in the cupboard with the other unused
machines.
But first, I’d have to find out exactly how this one worked.
I mean, it’s not complex, but while manufacturers use various methods to control the automatic cut-off, all the ‘cordless’ type kettles appear to use a very similar system. It is
simple, efficient and easy to repair, with ready access to
whatever element (har!) needs replacing.
Of course, different kettles will come apart differently.
Some aren’t repairable at all; they are designed to be thrown
away, not repaired, and are typically cheap and made of
plastic. Luckily, this one is held together like an old aeroplane, with obvious and exposed PK/panhead-style Phillips screws that are all easily accessible. Most hold on the
removable bottom cover.
Revealing the gubbins is as easy as removing eight
screws (some with fibre washers) and involves minimal
fettling. I had to remove the on-switch button but then the
whole bottom end opened up and this exposed everything
I needed to check.
As you no doubt already suspect, there isn’t a lot to it.
An element, moulded into the metal base of the boil chamber, some fibreglass-coated wiring and a large plastic power
socket and switch actuator assembly, which takes up much
of the space in the jug base (see the photo overleaf).
Of course, all the magic happens in that switch assembly. It is straightforward, meat and three veg technology,
but don’t let the apparent simplicity fool you. There’s actually a lot going on in these very clever (and usually reliable) mechanisms.
For those who just fill a kettle and switch it on, and don’t
know what’s happening in there, here’s a
brief kettle primer.
In the old days,
a metal kettle was
put on the gas
or electric stove
t o
Australia's electronics magazine
April 2026 85
to heat water, and it whistled when the water boiled and
steam started coming out of the small hole in the spout
cap. If you left it, it would simply burn dry and be ruined
(although that whistle is hard to ignore!).
Then someone had the idea of putting an electric element in a kettle body and boiling the water that way – no
stove needed. Those old appliances (many still exist) were
corded, mains-powered and pretty efficient.
However, the exposed elements they used presented
problems, especially with scaling, where water impurities harden over time with heat, coating exposed metal
surfaces with a hard, white residue. That made the kettle
increasingly inefficient over time, not to mention tainting
any water boiled in it.
Then some bright spark came up with the idea of mounting the element underneath the bottom of the boil chamber, keeping it out of the water and essentially eliminating
element scaling. Evolution in action.
The next big leap was kettles that switched off by themselves when the water was vigorously boiling. If you forget
about it, or get caught up doing something else, your jug
wouldn’t boil dry. Otherwise, that would almost certainly
burn out the element or even damage the kettle.
While some electric kettles had thermostats to help prevent that from happening, the next big thing was already
in the works.
Soon, along came ‘cordless’ kettles. The term cordless
these days usually implies something battery-powered, but
in the high-octane world of kettles, this just means the kettle
could be picked up from the base that had the mains cord
attached, and used without the hassle of a cable dragging
behind it as you pour.
Despite the sheer number of styles and brands available,
the majority of cordless kettles and jugs work in a very similar way. In this one, a thermostat senses the boiling water
Most of the space in the base of the kettle is taken up by the
switch actuator.
86
Silicon Chip
temperature (technically 100°C, though this can change
with altitude and water quality), and the power is disconnected automatically while the manually operated switch
automatically drops back to the off position.
Simple, effective and usually very reliable
This jug sits on a circular base unit, which is connected
to the mains. When switched on, the switching mechanism
connects mains power to the element, which initiates the
boiling cycle.
When the water boils, steam makes its way down a silicone tube, hidden in the jug’s handle, to the switching
mechanism. When it hits the right temperature, it ‘trips’
the switch, disconnects the elements and switches if off.
The idea of descaling the jug aims to clear that silicone
tube of any scale, which in rare cases can stop it from powering off. Sadly, not in this case.
After removing the bottom, I could see a little of the south
end of the tube and it looked totally clear. There was really
only one possibility left: the thermal switch.
This is where the clever bit comes in. Pushing the ‘on’
button sets a plastic swing-arm into a detent (as long as
power is applied) and, after connecting the element (and
any indicator lights that may be present), it stays that way
until it trips off.
When setting the mechanism, a bimetal convex (or concave) disc with a hole in the centre for a mounting pin,
about the size of a (CR)2032 coin cell, is ‘puckered’ into
its non-natural ‘active’ state. When the jug boils, steam is
applied to the disc via the silicone tube, and as the disc
heats, it simply pops back into its resting state and mechanically resets everything to ‘off’.
Simple, yet very effective. Until that disc wears out,
which apparently they do. I can ‘set’ the disc and the jug
works, and of course I can manually stop it by lifting the
switch or taking the jug from the cradle, but it seems that
disc won’t return to its default state, no matter how hot
it gets.
The obvious solution here is to replace that bimetal disc.
Unfortunately, that part isn’t available to buy separately. I
Australia's electronics magazine
siliconchip.com.au
mean, they are in general, but I can’t find one specifically
for this jug. The only way to buy it is as part of the main
switch housing, with the disc already moulded into it.
While I imagine there are ways of drilling the plastic centre pin out and replacing the thermostat disc with another,
that would require modifying the housing, and there’s no
guarantee that would work. There is nothing for it but to
buy a whole new housing.
My next step was to find a parts supplier in town. I
couldn’t find any – although one guy I called said he could
order one in, and it would be around $100. That sounded
quite steep to me, so I hit the interwebs to see if I could
find one elsewhere.
Surprisingly, after me talking up the repairability of these
appliances, I can only find filters. No elements or switches
from their parts outlets anywhere. So, I searched for thirdparty suppliers and found dozens of thermostat assemblies,
but nothing that looks anything like this one.
Well, that was frustrating. This is a $400 jug, so while
$100 plus shipping and tax is likely not too bad for a repair,
I still thought I’d be able to get a new switch assembly for
less than several times the cost of a whole new cheap jug
that includes one!
I ended up doing a Google image search and discovered
that this looks like a standard Philips part, and I can get
one from AliExpress for 20 dollarbucks, including delivery.
On closer inspection, it looks identical; all the mounting
measurements check out, so I think that’ll do me! It is on
its way, and I’m confident it will solve the problem.
In the meantime, the old housing is out and on closer
inspection, the plastic centre pin is quite worn – I guess
the edges of the disc chew away at it each time it is used.
Anyway, now we’ll have two jugs! Anyone want a refurbished one for ‘cheap’?
Taurus Heat Gun repair
Many years ago, I bought a Taurus heat gun from ALDI
Special Buys. I’ve used it many times over the years and it
has been quite reliable. Just once I had to shorten the power
cable slightly after one of the wires broke near the body.
Recently, I had just switched it off and put it on the
ground when I accidentally bumped it. That somehow
switched it back on. I was about to pick it up to turn it
off when there was a sudden fireworks display, a heap of
smoke and the heat gun stopped.
The switch was in the low-speed, low-heat position. I
could move it to off, but not to high-speed, high-heat, so
it seemed that the switch was damaged.
The cheapest replacement heat gun I found was $40,
but it had many one-star reviews saying that the case had
melted in use. I also ruled out a $50 heat gun that had a lot
of one-star reviews saying that it did not even get as hot as
a hair dryer; that was useless!
So the cheapest decent replacement I could find was
$55, and it wasn’t even available locally. Thus, I decided
to open up the Taurus heat gun to see what had happened
to it. I expected to find everything burnt out, but the damage appeared to be confined to the switch, which was toast.
I identified the Active wire coming into the switch, and
the low-speed and high-speed wires going to the motor and
element. I decided to test the motor and element to see if
they still worked.
I set things up in a safe way, including a ‘safety switch’ in
the mains socket, and plugged the power cord into power
Luckily only the switch was damaged when my heat gun stopped working.
siliconchip.com.au
Australia's electronics magazine
April 2026 87
so I could use a jumper wire to connect the Active wire to
the low-speed wire. The heat gun burst into life. I did the
same with the high-speed wire, and once again, it worked.
So it just needed a new switch.
I couldn’t find a similar PCB-mounting switch on eBay in
Australia, but widening my search to include other countries, I found one for about $8 from China. Further searching using the part number from that result and I found two
PCB-mounting switches for $3.99.
It took one month for the new switches to arrive. I compared one of the new switches with the old switch, finding that the actuating lever was quite a bit longer and the
slider would not sit on the switch correctly.
I got my mini hacksaw and, while holding the actuating
lever with pliers, cut the excess length off and used a file
to smooth the top and chamfer the edges. The slider then
sat on top of the switch correctly.
But first, I would need to remove the old switch and
clean up the circuit board. I de-soldered the old switch
and cleaned the soot from the circuit board. I then used
a knife to scrape away all the burnt material, leaving a
good-sized hole in the circuit board. I soldered on the
new switch and used some copper wire to repair the circuit board tracks.
With the new switch installed, I reconnected the power
cable, reassembled the heat gun and tested it. It was back
in working order. So I saved $53 and saved another item
from ending up in landfill.
Looking further at the destroyed switch, I figured out
why it failed. When it was bumped, it was not fully on,
with the contacts barely touching, causing them to overheat and arc.
Bruce Pierson, Dundathu, Qld.
The “Power & Control Relay” board had an IC that looked
to have heat stress (the more orange area of the PCB).
Electric cooktop repair
I was asked to have a quick look at an electric cooktop
with ceramic plate heating that wouldn’t switch on. The
circuit breaker had been reset a couple of times with no
benefit. I volunteered to call in and have a quick look.
I checked the cooktop circuit breaker and it was OK. I
found the range’s power junction box and determined that
mains voltage was getting there. I surmised that the problem was within the touch controls under the glass top.
I had to remove the glass sheet to see what was going
on, and I discovered two separate PCBs underneath it: the
“Touch Control Board” was mounted on top of the “Power
and Control Relay Board”. I then discovered a blown 2A
fuse on the “Power & Control Relay Board”.
Removing the board, I found an IC that had obvious signs
Servicing Stories Wanted
Do you have any good servicing stories that you would like
to share in The Serviceman column in SILICON CHIP? If so,
why not send those stories in to us? It doesn’t matter what
the story is about as long as it’s in some way related to the
electronics or electrical industries, to computers or even to
cars and similar.
We pay for all contributions published but please note that
your material must be original. Send your contribution by
email to: editor<at>siliconchip.com.au
Please be sure to include your full name and address details.
88
Silicon Chip
The application circuit for the TinySwitch III (TNY274280) switch-mode IC.
of heat stress around it on the PCB, which you can see in
the accompanying photo.
In desperation, I tried a temporary fuse replacement,
which immediately failed.
I thought I would simply go ahead and order a new
“Power & Relay Board” but no; there were no spares for
this 10-year-old cooktop in Australia on any of the sites I
checked on the internet!
I then took the cooktop home to start further investigations and unfortunately, the IC that was my suspect
had its designations lacquered over. Luckily, I could
read a few characters in strong light with a magnifying
glass and started a search for a data sheet because this
circuit was obviously designed to reduce the mains to
12V DC & 5V DC.
It was using an IC that I hadn’t come across before; it
turned out to be a TinySwitch III coded TNY274-280. I was
able to obtain a new one and replace it. I also replaced the
10μF 450V DC capacitor at the input to this IC that sits
across the mains bridge rectifier.
While buying the replacement parts, I also happened to
find a replacement board on AliExpress, so I ordered one.
The cooktop is now working again with a new board, but
I kept the old board as a spare. On powering it up after the
Australia's electronics magazine
siliconchip.com.au
repair, I found that its 5V DC & 12V DC rails were present
and correct.
I don’t know what caused the IC to fail, but I suspect the
closed space within the cooktop’s metal housing trapping
heat contributed.
Paul James, Kanwal, NSW.
Electric fence repair (Xstop EL500LEDS)
Like my dad, I’m scared of high voltages. I was horrified
one day when we walked beneath a transmission line and
a spark flew between us when we briefly touched. I think
his fears were born from being an electrical operator at a
terminal station. Scary things happened when possums
tried to walk along a multi-hundred-kV bus!
I grew up playing with Kettering ignition, but now as a
farmer, high voltages are all around me in the form of electric fences. So you can imagine my dread when my electric
fence energiser died. The neon voltage indicators stopped
working a while ago, but as long as the shed kept emitting
“tac… tac… tac”, I knew it was working.
Now, however it was going “tic… tic… tic”, which to
my experienced ear meant that either there was a dead
short in the fence somewhere (usually a 5km round-trip
walk to find out), or that it had carked it. The other indicator of fence failure was half of the cow herd in the
house paddock.
I’ve always wanted a directional fence tester, and I had
hoped that one day a circuit would appear in Silicon Chip.
I know testers have been published in the past, but I have
long made do with a length of three-core mains cord that
had been chewed by my Maremma dog.
She chewed in linear fashion from the end, so I had a
visual gradation in spark through the insulation when I
touched the wire to the fence with the safe end grounded.
Sadly, on this occasion, no spark.
At least the oscillator was working. So the most likely
culprits were the 40μF capacitor or the transformer. I needed
to have a spare capacitor in stock in case that was it, so I
ordered a couple. After swapping it out, there was still no
spark. I had a great deal of trouble finding a suitable transformer; I ended up ordering one from Pakton Technologies,
who know a bit about electric fences.
The transformer wasn’t a direct swap and required some
plastic case reshaping. The primary was easily identified
by the heavy copper wires. It was a while ago that I learned
higher voltage, lower current, so my secondary had lighter
gauge. But there were three wires. I chose the pair with the
highest resistance. After a bit of cable extending and connector soldering, I shoehorned it into the case.
The neon indicator board had a blown 47kW 1W resistor, so I replaced it with a 3W equivalent I had on hand.
In doing so, one of the neons disintegrated, so I had to
replace that too.
I set up a suitable spark gap and stood at arm’s length from
the mains power switch. Upon flicking it, I was rewarded
with a satisfying, yet strangely disturbing crack... crack...
crack sound. A $150 unit was repaired for $80.
Also, it provided some entertainment. My neighbour discovered the fence working after testing at my gate with his
gluteus maximus… three times! I don’t think I can count on
him testing it again in the near future, and I’m still scared
of high voltages!
SC
Ian Oldman, Budgeree, Vic.
siliconchip.com.au
Australia's electronics magazine
April 2026 89
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PRE-PROGRAMMED MICROS
For a complete list, go to siliconchip.com.au/Shop/9
$10 MICROS
$15 MICROS
ATmega328P
ATtiny45-20PU
ATtiny85-20PU
PIC12F617-I/P
110dB RF Attenuator (Jul22), Basic RF Signal Generator (Jun23)
2m VHF CW/FM Test Generator (Oct23)
Graphing Thermometer (Mar26)
Active Mains Soft Starter (Feb23), Model Railway Uncoupler (Jul23)
Battery-Powered Model Railway Transmitter (Jan25)
PIC16F1455-I/P
Battery-Powered Model Railway TH Receiver (Jan25)
Dual Train Controller (Transmitter / TH Receiver, Oct25)
PIC16F1455-I/SL Battery Multi Logger (Feb21), USB-C Serial Adaptor (Jun24)
Battery-Powered Model Railway SMD Receiver (Jan25)
USB Programmable Frequency Divider (Feb25)
Dual Train Controller (SMD Receiver, Oct25)
PIC16LF1455-I/P New GPS-Synchronised Analog Clock (Sep22)
PIC16F1459-I/P
K-Type Thermostat (Nov23), Secure Remote Switch (RX, Dec23)
Mains Power-Up Sequencer (Feb24 | repurposed firmware Jul24)
8CH Learning IR Remote (Oct24), Heat Transfer Controller (Aug25)
Vacuum Controller (Oct25)
PIC16F15214-I/SN Silicon Chirp Cricket (Apr23), Mic The Mouse (Aug25)
PIC16F15214-I/P Filament Dryer (Oct24), Tool Safety Timer (May25)
PIC16F15224-I/SL Multi-Channel Volume Control (OLED Module; Dec23)
NFC IR Keyfob Transmitter (Feb25), Rotating Light (Apr25)
PIC16F18126-I/SL DCC Decoder (Dec25), RGB LED Star (Dec25)
DCC/DC Stepper Motor Driver (Apr26)
PIC16F18146-I/SO Versatile Battery Checker (May25), RGB LED ‘Analog’ Clock (May25)
USB-C Power Monitor (Aug25), DCC Remote Controller (Feb26)
DCC Booster & Reverse Loop Controller (Mar26)
PIC16LF15323-I/SL Remote Mains Switch (TX, Jul22), Secure Remote Switch (TX, Dec23)
STM32G030K6T6 Variable Speed Drive Mk2 (Nov24)
PIC16F1847-I/P
PIC16F18877-I/PT
Digital Capacitance Meter (Jan25)
Dual-Channel Breadboard PSU Display Adaptor (Dec22)
Wideband Fuel Mixture Display (WFMD; Apr23)
PIC16F88-I/P
Battery Charge Controller (Jun22), Railway Semaphore (Apr22)
PIC24FJ256GA702-I/SS
Ohmmeter (Aug22), Advanced SMD Test Tweezers (Feb23)
ESR Test Tweezers (Jun24)
PIC32MX170F256D-501P/T 44-pin Micromite Mk2 (Aug14), 4DoF Simulation Seat (Sep19)
PIC32MX170F256B-50I/SP Micromite LCD BackPack V1-V3 (Feb16 / May17 / Aug19)
Advanced GPS Computer (Jun21), Touchscreen Digital Preamp (Sep21)
PIC32MX170F256B-I/SO
Battery Multi Logger (Feb21), Battery Manager BackPack (Aug21)
PIC32MX270F256B-50I/SP ASCII Video Terminal (Jul14), USB M&K Adaptor (Feb19)
STM32L031F6P6
SmartProbe (Jul25)
$20 MICROS
ATmega32U4
ATmega644PA-AU
PIC32MK0128MCA048
PIC32MX270F256D-50I/PT
Wii Nunchuk RGB Light Driver (Mar24)
AM-FM DDS Signal Generator (May22)
Power LCR Meter (Mar25)
Digital Preamplifier (Oct25)
$25 MICROS
PIC32MX170F256B-50I/SO + PIC16F1455-I/SL
Micromite Explore-40 (SC5157, Oct24)
PIC32MX470F512H-120/PT Micromite Explore 64 (Aug 16), Micromite Plus (Nov16)
PIC32MX470F512L-120/PT Micromite Explore 100 (Sep16)
$30 MICROS
PIC32MX695F512H-80I/PT Touchscreen Audio Recorder (Jun14)
PIC32MZ2048EFH064-I/PT DSP Crossover/Equaliser (May19), Low-Distortion DDS (Feb20)
DIY Reflow Oven Controller (Apr20), Dual Hybrid Supply (Feb22)
KITS, SPECIALISED COMPONENTS ETC
PICOSDR SHORTWAVE RECEIVER
(APR 26)
STEPPER MOTOR DRIVER KIT (SC7601)
(APR 26)
CALLIOPE AMPLIFIER PARTS (SC6021)
(APR 26)
MICROMITE MUSIC PLAYER
(APR 26)
- 128×64-pixel 0.96in OLED screen with SSD1306 controller (SC6176)
- 3.5in LCD module with ILI9488 controller (SC5062)
Includes all required parts for DCC or DC mode (see p55, Apr26)
Includes some of the harder-to-get transistors, resistors and a capacitor
Micromite BackPack V2 Kit (SC4237): ready to load the BASIC code,
3mm acrylic lid is included but isn’t required for the project
- DFPlayer Mini module (SC4789)
DCC BOOSTER / REVERSE LOOP CONTROLLER KIT (SC7579)
$10.00
$35.00
$35.00
$15.00
$70.00
$6.00
(MAR 26)
Includes all required parts, except for the Jiffy box, OLED screen (see below),
power supply and front panel (see p58, Mar26)
- 0.91-inch OLED screen (SC7484)
siliconchip.com.au/Shop/
RP2350B COMPUTER
(NOV 25)
Assembled Board: a fully-assembled PCB with all non-optional components,
front and rear panels are sold separately below (SC7531; see p28, Nov25)
- front & rear panels (SC7532)
- 8MiB APS6404L-3SQR-SN PSRAM SOIC-8 IC (SC7530)
DUAL TRAIN CONTROLLER MICROCONTROLLERS
(OCT 25)
PICKIT BASIC POWER BREAKOUT KIT (SC7512)
(SEP 25)
RP2350B DEVELOPMENT BOARD
(AUG 25)
- PIC16F1455-I/P programmed with 0911024D.HEX (Transmitter)
- PIC16F1455-I/P programmed with 0911024S(or T).HEX (Receiver, TH)
- PIC16F1455-I/SL programmed with 0911024S(or T).HEX (Receiver, SMD)
firmware ending with “S.HEX” is for train 1, while “T.HEX” is for train 2
Includes all parts except the jumper wire and glue (see p39, Sep25)
DCC REMOTE CONTROLLER KIT (SC7552)
(FEB 26)
Assembled Board: a pre-assembled PCB with all mandatory parts fitted,
optional components are sold separately below (SC7514; see p49, Aug25)
- 40-pin header (two are required, SC3189)
- 8MiB APS6404L-3SQR-SN PSRAM SOIC-8 IC (SC7530)
MAINS HUM NOTCH FILTER (SC7598)
(FEB 26)
Includes all parts except a CR2032 cell (see p64, Aug25)
$45.00
$7.50
Includes all required parts, except for the case and wire/cable (see p63, Feb26) $35.00
MIC THE MOUSE KIT (SC7508)
(AUG 25)
USB-C POWER MONITOR KIT (SC7489)
(AUG 25)
Includes everything but the plastic case, power supply and some optional parts.
The Pico 2 is supplied but not programmed (see p39, Jan26)
$90.00
433MHz RECEIVER KIT (SC7447)
(JUN 25)
RGB LED STAR KIT (SC7535)
(DEC 25)
VERSATILE BATTERY CHECKER KIT (SC7465)
(MAY 25)
EARTH RADIO KIT (SC7582)
(DEC 25)
RGB LED ‘ANALOG’ CLOCK KIT (SC7416)
(MAY 25)
USB POWER ADAPTOR COMPLETE KIT (SC7433)
(MAY 25)
Includes everything except for the case and power supply (see p53, Feb26)
DCC BASE STATION KIT (SC7539)
Includes the mostly-assembled board and all non-optional components
except the power supply (see p43, Dec25)
Includes everything to build the radio itself except the case and battery,
plus the plug for the antenna (see p65, Dec25)
DCC DECODER KIT (SC7524)
Includes everything in the parts list (see p73, Dec25)
$50.00
Includes all non-optional parts except the case, cell & glue (see p39, Aug25)
(JAN 26)
$80.00
$55.00
(DEC 25)
$25.00
Includes the PCB and all onboard parts (see p66, Jun25)
Includes everything in the parts list (including the case), except the optional
components, batteries and glue (see p30, May25)
$90.00
$7.50
$5.00
$10.00
$10.00
$10.00
$20.00
$30.00
$1.00ea
$5.00
$37.50
$60.00
$20.00
$65.00
Includes all the parts except the power supply. When buying the kit select either a BZ-121
GPS module or Pico W (unprogrammed) for the time source (see p66, May25)
$65.00
Includes everything in the parts list and a choice of one USB socket: USB-C power only;
USB-C power+data; Type-B mini; or Type-B micro (see p80, May25)
$10.00
*Prices valid for month of magazine issue only. All prices in Australian dollars and include GST where applicable. # Overseas? Place an order on our website for a quote.
PRINTED CIRCUIT BOARDS & CASE PIECES
PRINTED CIRCUIT BOARD TO SUIT PROJECT
WATERING SYSTEM CONTROLLER
SALAD BOWL SPEAKER CROSSOVER
PIC PROGRAMMING ADAPTOR
REVISED 30V 2A BENCH SUPPLY MAIN PCB
↳ FRONT PANEL CONTROL PCB
↳ VOLTAGE INVERTER / DOUBLER
2M VHF CW/FM TEST GENERATOR
TQFP-32 PROGRAMMING ADAPTOR
↳ TQFP-44
↳ TQFP-48
↳ TQFP-64
K-TYPE THERMOMETER / THERMOSTAT (SET; RED)
MODEM / ROUTER WATCHDOG (BLUE)
DISCRETE MICROAMP LED FLASHER
MAGNETIC LEVITATION DEMONSTRATION
MULTI-CHANNEL VOLUME CONTROL: VOLUME PCB
↳ CONTROL PCB
↳ OLED PCB
SECURE REMOTE SWITCH RECEIVER
↳ TRANSMITTER (MODULE VERSION)
↳ TRANSMITTER (DISCRETE VERSION
COIN CELL EMULATOR (BLACK)
IDEAL BRIDGE RECTIFIER, 28mm SQUARE SPADE
↳ 21mm SQUARE PIN
↳ 5mm PITCH SIL
↳ MINI SOT-23
↳ STANDALONE D2PAK SMD
↳ STANDALONE TO-220 (70μm COPPER)
RASPBERRY PI CLOCK RADIO MAIN PCB
↳ DISPLAY PCB
KEYBOARD ADAPTOR (VGA PICOMITE)
↳ PS2X2PICO VERSION
MICROPHONE PREAMPLIFIER
↳ EMBEDDED VERSION
RAILWAY POINTS CONTROLLER TRANSMITTER
↳ RECEIVER
LASER COMMUNICATOR TRANSMITTER
↳ RECEIVER
PICO DIGITAL VIDEO TERMINAL
↳ FRONT PANEL FOR ALTRONICS H0190 (BLACK)
↳ FRONT PANEL FOR ALTRONICS H0191 (BLACK)
ARDUINO FOR ARDUINIANS (PACK OF SIX PCBS)
↳ PROJECT 27 PCB
WII NUNCHUK RGB LIGHT DRIVER (BLACK)
SKILL TESTER 9000
PICO GAMER
ESP32-CAM BACKPACK
WIFI DDS FUNCTION GENERATOR
10MHz to 1MHz / 1Hz FREQUENCY DIVIDER (BLUE)
FAN SPEED CONTROLLER MK2
ESR TEST TWEEZERS (SET OF FOUR, WHITE)
DC SUPPLY PROTECTOR (ADJUSTABLE SMD)
↳ ADJUSTABLE THROUGH-HOLE
↳ FIXED THROUGH-HOLE
USB-C SERIAL ADAPTOR (BLACK)
AUTOMATIC LQ METER MAIN
AUTOMATIC LQ METER FRONT PANEL (BLACK)
180-230V DC MOTOR SPEED CONTROLLER
STYLOCLONE (CASE VERSION)
↳ STANDALONE VERSION
DUAL MINI LED DICE (THROUGH-HOLE LEDs)
↳ SMD LEDs
GUITAR PICKGUARD (FENDER JAZZ BASS)
↳ J&D T-STYLE BASS
↳ MUSIC MAN STINGRAY BASS
↳ FENDER TELECASTER
COMPACT OLED CLOCK & TIMER
USB MIXED-SIGNAL LOGIC ANALYSER (PicoMSA)
DISCRETE IDEAL BRIDGE RECTIFIER (TH)
↳ SMD VERSION
MICROMITE EXPLORE-40 (BLUE)
PICO BACKPACK AUDIO BREAKOUT (with conns.)
8-CHANNEL LEARNING IR REMOTE (BLUE)
DATE
AUG23
SEP23
SEP23
SEP23
OCT22
SEP23
OCT23
OCT23
OCT23
OCT23
OCT23
NOV23
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DEC23
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01109231
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10111231
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16103241
08101241
08104241
07102241
04104241
04112231
10104241
SC6963
08106241
08106242
08106243
24106241
CSE240203A
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11104241
23106241
23106242
08103241
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10111251
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Vintage Electronics
The Tektronix 2465B Oscilloscope
and electrolytic capacitor ageing
The 2465B is an analog
oscilloscope but with
digital supporting
infrastructure. Because
of this, it has many
features of a digital
‘scope, but without any
sampling or aliasing
concerns.
By Dr Hugo Holden
I
t has calibrated frequency, time
and voltage cursors and a memory
for the scope’s panel settings. There is
also an on-screen digital display, but
otherwise, it behaves like an analog
oscilloscope.
It was rated for a bandwidth of
400MHz, but testing with a levelled
sinewave generator and 50W termination shows that it is flat to 400MHz and
only 3dB down by about 600-650MHz.
Its trigger circuits are so good that you
can visualise and lock a 900MHz waveform. Of course, at that frequency, the
amplitude calibration is meaningless.
I used it to diagnose and repair UHF
TV tuners. It can also be configured
for four-channel use, which comes in
very handy fault-finding logic circuits.
The scope is a masterpiece of
application-specific ICs (ASIC). Tektronix called them ‘hybrids’. They
optimised every stage and function
with dedicated ASICs and other ICs
they designed themselves. The main
multi-layer board is nothing short of
awe-inspiring (Photo 1).
Tektronix also designed and manufactured the CRT, a highly complex
process. It is a shame that no company
in the world now manufactures or
92
Silicon Chip
repairs CRTs. This CRT is an extravaganza of precision metallurgy, glasswork and phosphor coating, all created by complex industrial processes.
This article focuses on the oscilloscope’s power supply unit (PSU). It is
a mixed switching and linear power
supply. For a scope made in the late
1980s, the question is: do all the electrolytic capacitors in the power supply need changing now that they are
35 years old?
It is an interesting question, especially for a product where the designers sought in the first instance to use
the highest-quality parts.
The oldest 2465B I have was made
in 1989. The last time I powered it on,
about a year ago, it was 100% functional. This time, it was totally dead. I
performed the usual initial checks and
found that power was being applied,
and none of the fuses were blown.
What could have caused it to fail?
A2A1 Board
A3 Inverter Board
Photo 2: the power supply boards inside the chassis.
Australia's electronics magazine
siliconchip.com.au
Photo 1:
this is what
you’re
greeted with
when you
first open the
case of the
2465B.
The PSU is buried inside the scope.
Once the chassis is slid out of its
outer shell, you are greeted with a
top screening cover. With the cover
removed, there is some access to the
PSU. Two boards are sandwiched
together with a series of long goldplated plug-pins that connect the
two PCBs.
The lower A3 inverter PCB largely
processes the mains voltage (Photo 2).
There are some line input filter circuit
components on the upper A2A1 board,
where the power on/off switch, NTC
surge suppressor and X2 EMI filter
capacitors are located. However, the
A2A1 board primarily handles the
low-voltage side of things.
With the PSU unit mounted in the
scope, the access to the A3 inverter
board is very poor. An aluminium
shield partially covers it too. It is not
practical to gain access to most of the
PCB’s components initially.
Photo 3: the A2A1 board removed from the chassis. Its construction,
particularly the components used, changed somewhat over time.
siliconchip.com.au
Australia's electronics magazine
One solution is to remove the whole
assembly, attach flying leads to various test points and re-fit the PSU to
the scope. In many cases (not all), it is
better, if possible, to diagnose the PSU
with it connected to its standard loads
in the scope. This is the case with most
SMPS repairs, unless specific dummy
loads are substituted.
Another method is extension leads
for the supply’s output connectors, if
you have them on hand.
Notice the green-jacket 100μF/25V
electrolytic capacitors in Photos 2
& 3. These are high-quality 105°C
Nichicon parts. There are three on
the A3 board and five on the A2A1
board. A year or two later, Tektronix
moved to 100μF/50V Nichicon types
with a brown jacket. Clearly, they had
a lot of confidence in these Japanese
capacitors.
The blue-jacket capacitors (which
sometimes have a clear jacket) are
American made 180μF/40V and
250μF/20V 105°C types.
The two brown-jacket electrolytic capacitors on this board are
10μF/100V parts, which seldom if ever
give any trouble. The smaller electrolytic capacitors with black jackets are
April 2026 93
Fig.1: part
of the
2465B’s
power
supply
circuit.
94
Silicon Chip
Australia's electronics magazine
siliconchip.com.au
Photo 4: note the two large
200V capacitors inside the
black insulating box on the
right.
C1025
1μF/50V bipolar types, which appear
very reliable. If they require replacement, I recommend using 1μF/63V
MKT capacitors instead.
The two small dark-blue-jacket
capacitors are 47μF/25V Nichicon
types that, in my scopes at least, are
still OK. On the right-hand side, where
the mains power is initially processed
and rectified, is a pair of Rifa 0.068μF
X2 capacitors; more on those later.
The A3 inverter board shown in
Photo 5 is a 1990 vintage specimen,
when they had moved to 100μF/50V
brown jacket Nichicon capacitors.
This board also contains some Rifa Y
capacitors.
On the right in Photo 4, there two
large blue radial capacitors in a black
plastic carrier. These are the main filter capacitors on the bridge rectifier
outputs. In every 2465B scope I have
assessed, these 290μF/200V parts have
been perfectly normal, with an ESR of
about 0.04-0.06W, no electrical or electrolyte leakage and replacement was
not required.
Along with other high-voltage electrolytic capacitors in the 2465B scope,
these appear, for reasons unknown, to
have much better longevity than the
lower-voltage-rated electrolytics. It
likely relates to the lower ripple currents that higher voltage parts experience.
In terms of capacitor failures in the
2465B, the surface-mount electrolytics, if present, fail first on the A5
computer board (due to electrolyte
leakage), followed by a similar problem with the 100μF/25V green-jacket
Nichicon parts. Some A5 boards were
fitted with tantalum capacitors, and
while they can fail short-circuit, they
don’t usually leak corrosive liquid.
The horizontally mounted radial
capacitor under the plastic carrier
on the right-hand side of Photo 4 is
designated C1025 and relates to the
power supply’s initial start-up function. This capacitor was stopping my
oldest 1989 vintage 2465B scope from
powering up (although the one in that
scope had a green jacket, rather than
blue).
The 0.068μF X2 Rifa capacitors
had failed on the A2A1 board on this
scope in the past, evolving smoke,
and had been replaced. This is a common problem because the plastic casings crack and they absorb moisture
as they are a metallised paper type.
They swell up, opening the cracks
further until they become conductive and burn.
The partial PSU circuit is shown in
Fig.1. The area shaded in blue is what
we are concerned about.
The incoming mains voltage was
normal and the two large filter capacitors charged up. However, the prer
egulator buck converter based on
Photos 5 & 6: a later inverter board, from around 1990 (left). A close-up of some of the troublesome capacitors (right).
siliconchip.com.au
Australia's electronics magazine
April 2026 95
Photo 7: this one had clearly been
leaking through its rubber bung.
Fig.2: a litmus strip changes colour
depending on the pH of the solution
it’s soaked in. Comparing it to this
chart gives the reading.
Q1050 (an IRF820 Mosfet) and the
TL494 driver IC was not running.
I connected extension wires to the
gate and drain of Q1050 and, using a
Tektronix 222PS scope (with isolated
inputs), I found that there were no gate
drive pulses. This buck converter supplies the pre-regulated potential to the
primary windings of the main inverter
transformer, T1060.
The power supply system is moderately elaborate in that the switching
drive pulses to Q1050 are modulated
in their duty cycle at power-up to give
a soft start and avoid current surges.
Like many mains-powered switchmode supplies, this circuitry needs a
way to get started. In this case, current
sourced from the main bridge rectifier
flows via 270kW resistor R1020 and
a start-up circuit to get the driver IC
(U1030) running.
Once oscillations are established,
the power for the start-up circuit and
U1030 is derived instead from pins 7
& 6 of the buck converter’s own transformer, T1020. However, when the
power is initially applied, capacitor
C1025 (100μF/25V) is charged toward
the rectified mains voltage via R1020.
The voltage at the base of Q1022
follows at a level determined by the
voltage divider composed of R1022
(100kW), R1024 (47kW) and the load
provided by IC U1030, which is likely
significantly lower than 47kW. This
forms about a 1/3 voltage divider.
When the voltage across C1025
reaches about 21.5V, Q1022’s base
gets to around 6.9V (21.5V ÷ 3). This
overcomes the 6.2V zener voltage and
Q1022’s base-emitter voltage, and
Q1022 switches on, biasing on Q1021,
and then both transistors then remain
96
Silicon Chip
Photo 8: at a certain angle, a small
amount of fluid could be seen under
some components.
saturated. This effectively places
R1024 in parallel with R1022, which
reinforces the initial base drive current to Q1022.
One job of R1024 appears to be to
add some hysteresis to the switch-on
function of Q1022 and Q1021. The
initial positive voltage supply to the
pre-regulator IC U1030 is then established via CR1023.
If the pre-regulator IC (U1030) starts
and runs, capacitor C1025 is recharged
via CR1022 and the buck transformer,
and it stays at 13.2V However, after this
start-up process, the pre-regulator IC
draws current from capacitor C1025
and its terminal voltage drops.
If the pre-regulator IC and buck converter circuit didn’t run, for any reason, the voltage across CR1025 diode
drops to about 8V. This causes Q1022
and Q1021 to switch off.
Under a fault condition, this start
cycle repeats. In other words, the start
circuit becomes a relaxation oscillator
in the event of a failure. My initial tests
showed that this was not happening
either; there was no activity of any
kind in the power-up circuit.
The likely culprit was the 100μF/25V
electrolytic capacitor, C1025 (see Photo
7). A quick check showed its ESR was
a little high compared to a new part.
Initially, I had not noticed a couple
of telltale signs on the PCB in the area
of the start-up circuit. However, while
manipulating the PCB at a certain
angle to the light, there appeared to be
a fluid meniscus under several components below C1025, R1025, R1024 and
R1023, along with CR1023, VR1020,
Q1021 and Q1022 (see Photo 8).
In essence, the whole area shaded
mauve in Fig.1 had become a
Australia's electronics magazine
conductive blanket from leaked electrolyte from C1025.
To get Q1022 into conduction, its
base voltage has to initially exceed
around 6.9V. A leakage with a resistance no higher than 25kW across the
47kW resistor would prevent that. It
was either that, or the leaked electrolyte was shunting current from the
base of Q1022 to ground.
In addition to leakage, the electrolyte had caused component lead corrosion. Leaking electrolyte from the
base of capacitor C1025 was easy to
see after it was removed for inspection. Despite this, the capacitor measured normally, at close to 100μF on
my capacitance meter.
The rubber bung in the base was
softened, swollen and electrically conductive. I tore the corner off a piece of
A4 paper to soak up the fluid under
the components. It was yellow and a
quick test with my meter probes indicated it was quite electrically conductive. The resistance measured in the
order of 100kW across a small section
of the soaked paper.
Inside the capacitor, the electrical leakage effect of the electrolyte is
greatly reduced by the fact that one
of the foils is covered in aluminium
oxide, which is an insulator.
The other 100μF/25V green Nichicon
capacitors I had removed, on testing
with 20V applied via a 560kW resistor
for 15 minutes, had a leakage of only
1.5μA, corresponding to a leakage
resistance of about 13.3MW.
Further investigations
I tested the pH of electrolyte from
inside another of the green 100μF/25V
Nichicon capacitors and it had a pH
siliconchip.com.au
very close to 6-7. This is similar to
other new capacitors I have tested; I
see 7-8 with some brands, so there is
variation in electrolyte formulations.
I then tested the paper soaked in the
leaked electrolyte. It was quite alkaline, with a pH around 9 (see Fig.2).
I also put a sample of the A4 paper I
had used in another bag and it was
neutral (pH = 7).
Not only is an alkaline solution corrosive, it is much more electrically
conductive than a neutral solution,
explaining the relatively low resistance I measured. I presume this is due
to the electrolyte sitting on the PCB for
a while, in contact with lead, tin (solder) and copper (leads, PCB tracks).
This is not unexpected because,
when metals are dissolved by weak
acids, the result is an alkaline solution. When an acid and a metal react,
the metal gives electrons to the H+ protons to form hydrogen gas. The oxidised metal (now positively charged)
combines with the acid’s negatively
charged anions to form a salt. Most
soluble salts derived from weak acids
form alkaline solutions.
This is because the anions in the
salt accept H+ protons from water.
This leaves hydroxide ions (OH−) in
the water. For example, a lead borate
solution has a pH of 8.6 and a tin borate
solution a similar value. There was little copper corrosion yet, in this case,
but copper borate has a pH of about 9.
These may seem like small differences from a neutral pH of 7 but
remember that it’s a logarithmic scale;
if you add or subtract one from the
pH value, you are changing the ion
concentration by a factor of 10! So a
solution with a pH of 9 has 100 times
as many OH− ions available as a neutral solution.
Pure water (pH = 7) has the lowest
electrical conductivity compared to
alkaline (pH > 7) or acidic (pH < 7)
solutions. As a solution becomes more
acidic below pH = 7, it becomes more
electrically conductive because of the
higher number of aqueous H+ protons.
Similarly, as it becomes more basic
above pH = 7, there are more hydroxide OH− anions, again making it more
conductive.
Manufacturers of electrolyte solutions generally have tried to keep the
pH of the electrolyte as close to neutral as possible, although most are a
little acidic. Ageing effects inside the
capacitors, especially where H+ has
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reacted with the aluminium to evolve
hydrogen gas, result in a shift toward a
higher pH, so the electrolyte becomes
more alkaline.
Loss of hydrogen by way of gas evolution is obviously bad for the capacitor’s chemistry; a domed top is a sign
of it.
If the electrolyte leaks out of a capacitor, there are four main concerns:
1. The electrical effects of the electrolyte on the circuit.
2. Short- and long-term damage to
components.
3. Short- and long-term damage to
the PCB.
4. How to safely remove the electrolyte and avoid further failures.
Electrical effects on circuits
In this case, the circuitry involved
was relatively ‘high resistance’ in that
the resistor primarily dependent for
raising the base voltage of the transistor Q1022 has a value of 100kW and the
source resistance charging the capacitor is also high at 270kW.
However, low-resistance circuitry,
below say 10kW, could have electrolyte leaked all over it with possibly
no apparent fault until the resulting
corrosion becomes severe.
In many ways, the fact this start-up
circuit failed relatively early after
the electrolyte leaked was a blessing,
because significant corrosion damage
was yet to occur. It must have been relatively recent leakage because most of
it was still wet.
Damage to components
This must be considered in a
cleanup operation. Corrosion can
occur where tin-plated copper leads
enter a resistor’s body, which is often
made of ceramic with a metallised
coating. As this continues, it expands,
increasing its physical volume. This
can result in the component failing
at a later date. In extreme cases, the
expansion can crack the entire resistor or component body.
Electrolyte leaked from capacitors
can also eat through the conductive
films on surface-mount resistors, rendering them open-circuit.
In my case, corrosion had already
entered the ends of the resistor bodies. Although the 3kW, 1.2kW and 47kW
resistors tested OK, I replaced them to
be safe. The 100kW resistor also had
one leg affected. I also replaced both
diodes, the zener with a 1N4735A
and the plain diode with a 1N4148
(see Photo 9).
PCB damage
Unfortunately, the PCB’s conformal
coating (typically green) is not a total
barrier to a contaminated electrolyte
and its corrosive effects. The coating
breaks down after a period of exposure to the electrolyte, and the copper
under it beginning to corrode. With
voltages applied to copper tracks, the
copper corrosion is accelerated by
electrolysis, and fine tracks can be
eaten completely away.
If you find tracks that are fully corroded through, likely the electrolyte
leak occurred many months beforehand and the instrument remained
powered after that for a considerable
time.
After the electrolyte has been in
contact with solder for a while, the
Mild conformal coating and
track damage
Photo 9: the leaked electrolyte had already corroded some tracks and
component leads.
Australia's electronics magazine
April 2026 97
solder loses its shiny metallic surface
and acquires a grey oxide like coating.
The coating is a thermal insulator and
can sometimes make the component
difficult to desolder unless its surface is scraped down and fresh solder is added.
PCB cleanup methods
While a PCB can be cleaned with
contact cleaner, this does not help the
green conformal coating where the
electrolyte has absorbed into the full
thickness, with moisture and ionic
species filling microscopic voids in
the coating.
If two adjacent tracks are disconnected from any components and
the coating between them has previously been in contact with electrolyte,
testing will show electrical leakage
between the tracks. This is evident
even after the surface of the coating
has been thoroughly cleaned with contact cleaner. While the coating might
look normal, it is no longer an electrical insulator.
One remedy some have tried is to
remove the coating by scraping it off
or dissolving it with methylene chloride, but this ruins the appearance of
the board. Also, methylene chloride
is toxic and difficult to get in some
localities, and restricted for public use.
I prefer to use a leaching method to
remove the electrolyte but it requires
some patience. It involves letting a
thin stream of warm-to-hot water run
over the affected area of the board
for at least a half an hour (ideally
an hour). The retained ions migrate
from the coating into the water and
are washed away. If deionised water
is available, it is superior to tap water
for this.
After that, standard contact cleaners (IPA etc) can be used to clean the
water off the board.
Ideally, the stream of water runs
off the nearest corner of the board,
with the board held a 45° angle. The
whole board is not dunked in water.
Although that can leach out ions, there
are components than can absorb water
and they will be very difficult to dry
out. You could damage them that way.
Some people have put PCBs in
dishwashers to clean them, but it
can damage parts, especially items
such as trimcaps, some transformers,
DIP switches, IC sockets etc. Thus, I
never do it.
In this case, because the plastic carrier was screwed to the PCB in the area
being washed, I had to release the nuts
from the carrier, to lift it away from the
board surface a little, or water could
have become trapped in that area
around the stud’s threads.
Component replacement
I removed all five 100μF/25V green
Nichicon capacitors from the A2A1
board and the three from the A3 board
for inspection and testing. Some of the
capacitors had visible electrolyte leakage. Others had conductive bungs, as
revealed by a DVM on its ohms range.
This is something not all technicians
are aware of.
If an electrolytic capacitor has
leaked electrolyte in the past, it renders the surface of the rubber bung in
the capacitor’s base electrically conductive, which is easily picked up
with a DVM.
The removed green-jacket 100μF/
25V Nichicon capacitors all had higher
ESR values than a range of new parts
with similar ratings, and two of them
had an ESR higher than the worst-case
figure of 0.5W suggested by the ESR
meter’s guidelines.
The damage on the A2A1 board
indicated that one capacitor had probably been leaking for longer than the
one that caused the failure preventing
the scope from powering up. There
was damage to the board’s conformal
coating, and the electrolyte had started
to attack the copper traces. Also, where
the electrolyte had dried out, there
were white crystalline deposits.
Failure or degradation of the rubber
seal is one of the reasons why electrolytic capacitors leak. The leakage can
also be encouraged by hydrogen gas
evolution, pressurising the contents,
and in many cases, doming the top of
the capacitor. However, for these particular Nichicon capacitors, all their
tops were perfectly flat. Thus I think
they are failing due to drying out.
In another instrument, a 1000μF
capacitor dried out completely and
failed. There was no evidence of any
electrolyte leakage; it had lost nearly
all capacitance and went to a very high
ESR. I opened it up for inspection and
found that it was as dry as parchment
paper inside.
As an experiment, I placed it in
a container of deionised water for a
few hours. It returned to a normal
capacitance value and a normal ESR.
It appears that the seals can partially
fail to the extent that water vapour can
escape in some cases, but not fluid.
Comparison to another scope
Photo 10: a close-up of some of the corroded tracks (circled in red). The solder
mask helps, but it doesn’t stop the damage!
I stripped down another PSU unit
from a low-power-on-hours Tektronix scope for examination. This time,
the green Nichicon capacitors had a
date code of 8930. Their rubber bungs
were in good order, without softening, and they were not electrically
conductive.
Their ESRs were a little above the
normal range compared to new parts
tested, but within the 0.5W guideline,
and there was no significant electrical
leakage. So they were probably OK.
Likely, in the next five years or so,
they will also leak and damage components and the PCB, so I elected to
replace them anyway.
So apart from the date of manufacture, the amount of running time is
Australia's electronics magazine
siliconchip.com.au
98
Silicon Chip
Photo 11: the repaired inverter board, after I replaced all the troublesome capacitors with new ones from Nichicon.
the other main factor that determines
when the capacitor spills out its electrolyte. Indicators of a failed electrolytic capacitor include:
1. Visible electrolyte around the
capacitor or corrosion of tracks and
adjacent components. Loss of a metallic shine on nearby solder.
2. Damage to the conformal coating
and tracks directly under the capacitor.
3. Visible fluid leakage on capacitor’s rubber bung.
4. The rubber bung has become conductive.
5. Softening or disintegration of the
rubber bung.
6. ESR above the normal range for
similar new parts.
7. If a capacitor of exactly same type
has leaked elsewhere.
8. A very old device or a unit with
long running hours
Less reliable indicators are:
1. Measured capacitance outside of
the normal range.
2. High electrical leakage.
3. Capacitor has a domed top.
Returning to the 2465B
I decided that the other capacitors on the A3 board should also
be replaced. The manufacturer had
attempted to ‘leak proof’ them by gluing resin over the rubber bungs. This
appeared to have worked, except that
in one case, some electrolyte had
passed through the bung and around
the sides of the leads as they exited
through the section of resin.
For that capacitor, again the ESR was
a little on the high side compared to
new parts. I removed the red-brown
siliconchip.com.au
resin from one of the blue capacitors
to inspect the rubber bung and test its
electrolyte.
On the capacitance meter, the 250μF
20V part read 330μF, or abut 1.32 times
its marked value. The 180μF capacitor also measured about 1.45 times
its marked value. I opened one for pH
testing and found it had an alkaline
electrolyte, with a pH of 8.
Interestingly, an increase in capacitance can be a marker of increased
hydroxides in the capacitor. I performed an electrical leakage test on one
of the 250μF/20V parts and found that
its leakage current was low, at less than
2μA with 20V applied after 30 minutes, which is acceptable. However,
a new part’s leakage current tested at
0.2μA, an order of magnitude lower.
Rather than buying different values, I decided it would be reasonable to replace all of these with new
330μF/50V 125°C-rated Nichicon BT
series capacitors, which have a rated
ESR of 0.02W. These are similar to milspec parts. They can be recognised by
their pale blue jackets.
I replaced the original 100μF/25V
parts with the 100μF/50V capacitors,
as Tektronix did in their later model
2465B scopes.
Photo 11 shows one board recapped
with the new capacitors, including
replacement ceramic Y-type capacitors.
Should any electrolytic caps be
left unchanged on the A2A1 or A3
boards? There are a few 10μF high-
voltage electrolytic capacitors on
these boards. The main filter caps in
these scopes don’t appear to have any
Australia's electronics magazine
problems in the four scopes I own. For
now, I have left these ones in place for
observation.
There are also some small electrolytic capacitors elsewhere in the PSU.
They are elevated a little off the PCB on
their leads and are easy to inspect and
not prone to physical leaking or other
failure modes, yet. To inspect these,
apart from ESR testing, look closely
at the solder on their tracks.
The X2 & Y capacitor dilemma
The 35+ year old Rifa capacitors
should always be replaced because
their outer plastic casings crack. They
absorb moisture and swell up widening the cracks. The positive feedback
continues until the X2 capacitors
become electrically conductive, heat
up and burn, evolving copious smoke
and making a mess on the PCB.
The internet is awash with stories
about smoking Rifa X2 capacitors.
When they were new, they were good
performers. 30 years down the line,
though, trouble can start. It may simply be that they were not designed for
long service. So I don’t judge the Rifa
parts too harshly.
I previously replaced the two 68nF
Rifa X2 capacitors in the mains voltage
input area on the A2A1 board on all
my scopes. It is better to move away
from a metallised paper film product
and use plastic film X2-rated parts.
I fitted Wima MKP (polypropylene
film) or other plastic film 100nF types
instead.
However, there are three other Rifa
capacitors on the A3 board that now
have surface cracking and swelling in
April 2026 99
Photo 12: the rear of the
Tektronix 2465B
oscilloscope.
connector. You can generally
trust the X and Y capacitors
inside that unit; being sealed
in a metal enclosure, there is
no risk of smoke or fire.
In summary, for replacing the X2 capacitor, I prefer
Wima X2-class film parts, and
for the Y-class, capacitors I
use Y2-class (labelled) ceramic
types, which have similar proportions to 3-5kV rated ceramic
capacitors.
Battery-backed SRAM
all of my 2465B scopes. Two are 2.2nF
Y-class capacitors (C1020 & C1051).
The usage in the 2465B is to bypass
both the positive and negative outputs
of the bridge rectifier to Earth.
The customary use for Y-class capacitors is to bypass the incoming Active
and Neutral AC lines to Earth; however, the application in the 2465B similarly relies on them not shorting out.
Hence the use of Y-class capacitors.
There is also a 10nF capacitor,
C1052, that couples the negative side
of the bridge rectifier output to an
electrostatic screen behind the power
switching Mosfets on the A3 board.
I found visible horizontal cracks in
the bodies of the two 2.2nF Y-class
capacitors. The 10nF capacitor’s body
was starting to swell up on one side,
too.
Generally, X2-class capacitors are
designed for applications directly
across Active & Neutral, while Y-class
capacitors are designed to connect
from Active or Neutral to Earth. Both
types are often used to aid in the suppression of high-frequency interference either entering or exiting the
instrument via the mains wires. Often,
they are combined with inductors to
improve the filtering.
Before the Rifa-style metallised
paper film ‘safety capacitors’ were
invented, many manufacturers used
waxed paper, oil-filled or ceramic
types for Y-class capacitors. They got
around the reliability problems and
mitigated the risk of failure by using
capacitors with a substantially higher
voltage ratings than were required, and
seldom had any troubles.
Some products were encased in
metal housings to mitigate the fire risk.
100
Silicon Chip
The Y-class capacitor must be able
to support sustained voltages over 1kV.
Some manufacturers specify a 4kV DC
rating for a Y-class capacitor to give a
wider safety margin. This is because,
on occasion, high-voltage transients
can ride on the Active line. So capacitor failure can be made less likely by
increasing the insulation withstand
voltage. Tektronix also added some
gas-discharge voltage arrestors in the
mains power input circuitry. They act
as a negative resistance and a voltage
clamp once they activate.
In any event, the X2- and Y-class
capacitors in the 2465B’s power supply should be replaced, and they need
to be suitably rated X and Y parts for
the task. Ceramic capacitors generally don’t burn much, except for their
outer coating; they are a minimal fuel
source compared to a plastic part. I
prefer them for this reason.
Y-class ceramic capacitors usually have a flame-proof coating and
are designed to fail open-circuit. X2
capacitors frequently fail short-circuit,
which is why they burn up.
Fortunately, in the 2465B, the mains
input is protected by fusing prior to
the Y- and X2-class capacitors. Tektronix were also clever with the X2
capacitors, in that not only were they
placed after the fuse, but they added
small low-value resistors in series
with them. If the capacitor shorts, the
high current vaporises the resistor if
the fuse does not blow immediately.
That happened in one of my scopes
when the X2 capacitor went low-
resistance.
Tektronix relied on a Japanese-made
metal-cased commercial line power
filter as part of the panel-mount IEC
Australia's electronics magazine
The PSU’s electrolytic capacitors determine the speed that most
of the voltage rails collapse when
the scope is switched off. The 2465B
uses a Dallas DS1225 battery-backed
non-volatile SRAM with an internal
lithium battery to store the scope’s
calibration data and control settings.
The DS1225 incorporates either the
DS1210 or DS1218 control IC.
When the 5V power rail drops below
a specific level, this chip disables the
SRAM and prevents any writes that
could corrupt its contents. It works
extremely well; I have been unable to
corrupt the SRAM’s contents even by
switching it on and off rapidly.
I previously replaced the DS1225
with Ramtron FM16W08 FRAM
because the DS1225’s battery was flat.
This worked very well, and many people did this later with very little trouble. However, I noticed that power
cycling could occasionally alter the
FRAM contents.
Fortunately, it did not affect the calibration constants, as those addresses
are not active at the time of power
cycling, but did affect the last panel
control settings. In one case, I was able
to ameliorate it with a 330W resistor
from the WE line to +5V.
Additional information
I have written many other articles
about repairing different sections of
the 2465B oscilloscope. A list of them
can be found below:
• siliconchip.au/link/ac7b
• siliconchip.au/link/ac7c
• siliconchip.au/link/ac7d
• siliconchip.au/link/ac7e
• siliconchip.au/link/ac7f
• siliconchip.au/link/ac7g
SC
siliconchip.com.au
ASK SILICON CHIP
Got a technical problem? Can’t understand a piece of jargon or some technical principle? Drop us a line
and we’ll answer your question. Send your email to silicon<at>siliconchip.com.au
Identifying SMD parts
I have three Panasonic TH-49LF80W
LCDs with blown devices at their
HDMI inputs. I believe they are in SOT23-6 packages labelled “APOR 16”
and “APOH 16”. The blown ones are
shorted between pins 6 and 2 (pin 2 is
connected to GND). The result of this
is they don’t seem to perform the EDID
handshake with the source device and
require an EDID emulator/reclocker.
Does anyone know what this device
is? (R. T., Northmead, NSW)
system on an old slasher to make it
work and checking its timing with a
‘squarker’ buzz box (p92, siliconchip.
au/Article/19570).
I got interested in the buzz box and
was wondering if the Moisture Tester
in Short Circuits Volume 1 (Project 9b,
multivibrator circuit) would produce
a tone that changes when points open.
(E. M., Kew, Vic)
● Yes, you can use the Moisture Tester to perform the same function as the
squarker. It is a very similar circuit,
just used for a different application.
Digital Preamp not
using crystal
● Identifying SMDs can be tricky
because usually only the first two or
three letters of the printed code are
meaningful and often, there are several
or even dozens of devices that use the
same code. A good website to narrow
it down based on the code and package type is https://smd.yooneed.one/
code4150.html
We can see several possibilities,
including the Avago HSMS-280P
bridge quad schottky diode, Ricoh
RP500N synchronous buck regulator,
74AUP1G18 1-of-2 demultiplexer or
Richtek RT9011 dual LDO linear regulator. All come in an SOT-23-6 package or similar and have markings that
start with AP, usually followed by a
batch code.
All things considered, in this case,
we think it is most likely the RT9011
regulator, although if it’s near the
HDMI connector and involved with
EDID handshaking, it’s possible it’s
a logic device like the 74AUP1G18.
I have started construction of your
Digital Preamp (October-December
2025; siliconchip.au/Series/449). I
have just installed the PIC chip (which
I purchased programmed from the
Silicon Chip Online Shop). However,
the 8MHz oscillator does not run. It
appears to try to start based on my
probing with an oscilloscope, but cuts
out almost immediately.
I have changed the two 18pF capacitors, checked the 470W resistor and
even changed the crystal. All to no
avail. I have checked the signal continuity to pins 30 and 31.
Everything looks OK. I have
re-flashed the PIC with 0110725A.
HEX using my PICkit 5. This worked
fine, leading me to believe that the
PIC is OK. What am I missing? (M. F.,
Brassall, Qld)
● You aren’t missing anything – it
turns out that the configuration file in
the software became corrupted during
development, resulting in the distributed HEX file running the PIC32 from
its internal 8MHz oscillator rather than
the external 8MHz crystal. The software still works, but there will be little external oscillator activity as that
oscillator is shut down shortly after
booting.
We now have a revised version of
the software on our website (v1.1).
The only change is that it does utilise
the external 8MHz crystal as was the
design intent (and as described in the
magazine).
Op amps need negative
feedback
Can you connect a balanced microphone to the non-inverting and inverting inputs of an op amp and then connect the output to an amplifier? (R. M.,
Melville, Qld)
● Such an amplifier would be in
an open-loop high-gain configuration
and would surely produce severe output clipping. Instead, use a differential amplifier arrangement with a set
Why not use a transformer to power the LED?
The January 2026 issue has a servicing story about changing the magneto
Instead of the Mains LED Indicator circuit in the February 2026 issue (siliconchip.
au/Article/19655), how about using a mains transformer such as Altronics M7012A
3VA 6+6V AC, rectifier, filter capacitor and resistor to power the LED? At least then
the circuit is isolated from the mains.
I’d like to have an LED light up my front door keyhole at night so I can see where
to put the key, not necessarily powered directly from the mains. (I. H., Essendon, Vic)
● Yes you could use a transformer, rectifier and filter to drive the LED. The Mains
LED Indicator project intended to show a method of driving a light-emitting diode
directly from the mains as a replacement for neon indicators.
Keep in mind that when using a transformer, the magnetising current and thus idle
power of the transformer will likely be many times higher than the power actually
delivered to the LED, making such a circuit very inefficient. The one we presented
doesn’t draw much more real power from the mains than is delivered to the LED.
In the long term, that could add up to quite a lot of extra electricity used to power
the LED, especially if it’s on most of the time.
siliconchip.com.au
Australia's electronics magazine
Converting moisture
sensor to buzz box
April 2026 101
gain that prevents excessive output
swing. For more, see: siliconchip.au/
link/acb6
Versatile Battery
Checker doesn’t work
I just finished building the Versatile Battery Checker (May 2025 issue;
siliconchip.au/Article/18121) today. It
powered up OK, and then I connected
a brand-new 1.5V AA cell. It fails to
calibrate and test. It shows:
TEST BAT 9.0V
BATTERY 1.6V
MAX CURR 1A
——————————
CALIBRATE 8.8V
Run Auto
SET 3200mv
After pressing Enter, I get “Running” and then “Scan Failed Battery
Check”. I tried a few more new cells
with the same result. I also randomly
get “V too Low” and “I too High” messages. I did a reset and tried again
with similar results. (K. H., Castle
Hill, NSW)
● It seems like the unit’s calibration in EEPROM is corrupt for some
reason. Try the “reset to defaults”
option.
Final adjustments for
Differential Probe
I’ve completed all but the last step
of setting up my High Bandwidth Differential Probe (Feb 2025; siliconchip.
au/Article/17721), trimming the frequency compensation. I can’t guarantee that the CMRR was below ±20μV
in previous steps because my meter
only has a millivolt scale with two
digits after the decimal point.
Shown from left-to-right are screenshots of the input, positive divider output and negative divider output on my
50MHz oscilloscope.
The positive divider output has significant overshoot, while the negative
102
Silicon Chip
divider setup output has significant
undershoot. Adjusting the compensation trimmers doesn’t change the
shape of the output waveforms at all.
I have checked that adjusting the trimmers changes the parallel capacitance
(C5 || C6 || VC1) by approximately
12-60pF. Do you have any suggestions?
(D. H., Sorrento, WA)
● Andrew Levido responds: It’s odd
that adjusting the trimcaps makes no
difference at all to the waveform. It
also strikes me that the positive side
is over-compensated and the negative
side is under-compensated.
Assuming correct component placement, this suggests a measurement
setup error to me. It’s hard to tell what
the problem might be without seeing
the exact configuration, but my first
thoughts are that to check the following:
• The input waveform must be
applied between each input (positive
or negative) and the large ground test
point on the board. We only want to
exercise half of the input divider at
a time.
• The connection to the scope
should be a BNC-BNC cable, not an
oscilloscope probe, which will have
its own compensation network.
• The divider compensation should
be performed on the ×100 range. We
are only trimming the input divider
frequency compensation. The fixed
compensation on the ×10 gain stage
will muddy the waters.
Shunt reference and
heatsink questions
For the June 2024 DC Supply Protector (siliconchip.au/Article/16292),
I noticed the surface-mount version of
TL431 layout on the PCB has 6 pins. I
am assuming mounting of the TL431
is to use the overlay Fig 6. How do you
know if you have the mirror version of
the TL431? I need to use the surface-
mounting TL431 because I want to
protect a 5V supply.
Australia's electronics magazine
Also, what size heatsink do you
need for an LM317T to handle 1.5A?
I will be using an 18V DC 2.3A plugpack from Altronics. (R. M., Melville, WA)
● The TL431 pinout for the mirrored version will have a MFDT or
MSDT type number ending. The heatsink requirements for the LM317T
depend on the output voltage you set
it at. So for a 12V output for example,
there will be 6V (18V − 12V) across
it. Multiplied by 1.5A that gives 9W
of dissipation. So a <3°C/W heatsink
will keep it no more than 27°C (9W ×
3°C/W) above ambient.
Porting the Arduino
Seismograph to a Pico
I am looking into porting the Arduino Seismograph from the April 2018
issue (siliconchip.au/Series/334) to
a Raspberry Pi Pico, specifically the
newer RP2350 version. Amazingly,
when I select the RP2350 as the target
in the Arduino IDE, the sketch compiles with no errors.
Of course, to make it work on
the real hardware, I will need to go
through the sketch and make sure all
the pin assignments make sense for
the changed microcontroller. Do you
have any suggestions about this? For
example, the Pi Pico has two independent SPI channels; does it matter
which one I use?
Would it be worth separating certain software routines onto different
cores of the RP2350? This is probably
overkill; the massive speed increase
of the RP2350 over the Arduino Uno
will probably make the question moot.
Were there other features of the Seismograph that you wanted to add but
didn’t fit on the Arduino Uno version?
(N. W., Canberra, ACT)
● You are right that the pin assignments will need to be checked, both
for SPI and I2C. We would aim to use
pins attached to SPI0 and I2C0 on the
continued on page 104
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WARNING!
Silicon Chip magazine regularly describes projects which employ a mains power supply or produce high voltage. All such projects
should be considered dangerous or even lethal if not used safely. Readers are warned that high voltage wiring should be carried
out according to the instructions in the articles.
When working on these projects use extreme care to ensure that you do not accidentally come into contact with mains AC
voltages or high voltage DC. If you are not confident about working with projects employing mains voltages or other high voltages,
you are advised not to attempt work on them. Silicon Chip Publications Pty Ltd disclaims any liability for damages should anyone
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Australia's electronics magazine
April 2026 103
Pico, since these should align to the
default I2C and SPI peripherals used
on the Uno (and thus the Seismograph
libraries and sketch). This should minimise the code changes that might be
needed.
Assuming you are using the arduinopico package, this will involve
using the likes of Wire.setSDA() and
Wire.setSCL() for I2C and SPI.setSCK(),
Advertising Index
Altronics.................................31-34
Blackmagic Design....................... 5
Dave Thompson........................ 103
DigiKey Electronics..................OBC
Electronex................................... 11
Emona Instruments.................. IBC
Hare & Forbes............................... 7
Jaycar............................. IFC, 12-15
Keith Rippon Kit Assembly....... 103
Lazer Security........................... 103
LD Electronics........................... 103
LEDsales................................... 103
Microchip Technology.................. 9
Mouser Electronics....................... 3
PCBWay....................................... 19
PMD Way................................... 103
SC Dual Mini LED Dice.............. 103
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Errata and on-sale date
Watering System Controller,
August 2023: the optional 24V
transformer is incorrectly specified
as Jaycar MT2112. It should be
Jaycar MT2084 instead.
Next Issue: the May 2026 issue
is due on sale in newsagents by
Monday, April 27th. Expect postal
delivery of subscription copies in
Australia between April 27th and
May 12th.
104
Silicon Chip
SPI.setRX() and SPI.setTX() for SPI.
We’d probably put them right at the
start of setup(), so they are set before
any of the peripherals start up.
As you say, the Pico or Pico 2 will
be much more capable than the Uno,
so we wouldn’t bother with splitting
routines over cores. We wouldn’t be
surprised if there are some other subtle
changes that cause things not to work.
We’ve had some odd issues with different versions of the SD card libraries,
although the fact that it is compiling
is a good sign.
We updated that project in April
2019 (siliconchip.au/Article/11532) to
use a geophone sensor (still using the
Uno). The geophone is a purely analog
device, so shouldn’t present any difficulties in interfacing, although we did
use the Uno’s ATmega328 1.1V analog reference, which the Pico lacks.
So there might need to be changes to
get this version functional, but they
should not be difficult.
One thought that comes to mind
is to use a Pico W and make the contents of the SD card available on a web
server so the card doesn’t need to be
removed for reading. This would be
a similar concept to that used in the
WiFi Weather Logger from December
2024 (siliconchip.au/Article/17315).
Battery bank inverter
efficiency
Some years ago, I assembled
the Appliance Energy Meter (July
& August 2004; siliconchip.au/
Series/96) from an Altronics K4600
kit. I’ve been using it around the house
to measure the energy use of various
things. I recently purchased a Bluetti
AC70P battery bank and am testing it
using my car fridge. I’m using the AC
power brick that came with the fridge,
which has an input power rating of
220-240V AC 0.6A.
The output of this (transformer-
based) AC-to-DC converter is 12V DC
at 5A (60W). When the fridge compressor is running, the energy meter
shows a draw of about 56W; however,
the Bluetti AC draw is showing about
96W, a factor of 1.7 higher.
I would appreciate if you could comment on the accuracy of the Energy
Meter. I’ve never had any reason to
doubt it in the past.
To explain this difference, I suspect that the energy figure shown by
the power station is the actual draw
Australia's electronics magazine
from the battery, and the AC inverter
is very inefficient at this low power
draw. I would appreciate your comments on this line of thinking. 58%
efficiency is low, but the AC inverter is
rated at 1000W, so I guess that would
be reasonable.
I will investigate using the 12V 10A
supply on the AC70P. This may be a
more efficient use of the available battery watt-hours. (B. P., Jeir, NSW)
● That Energy Meter design should
be accurate to <0.5% when calibrated.
You certainly should expect the battery to be supplying more power at
the inverter input than the appliance
is drawing at the output.
If you have something like an incandescent desk or floor lamp (or perhaps
halogen) that you can use as a test load,
run it from the inverter and make the
same measurements. See if you find a
similar amount of lost power (40W).
That is enough to make something
pretty warm. If left running for a while,
does the inverter case temperature go
up noticeably?
An inverter can be expected to consume at least 10W internally, even
with a light load. The lost power will
probably be some fixed amount (say
around 10W), plus a percentage of
the load current (perhaps 10%). That
implies it would be less efficient with
a light load. Still, 40W seems like quite
a lot of wasted power.
It is possible that the battery bank
power meter is not 100% accurate.
Visual doorbell alert
wanted for the deaf
I have enjoyed your articles for
many years. I am deaf and need some
help to design/build myself a doorbell
button to trigger several flashing lights
simultaneously in several rooms in my
apartment as I cannot hear audio door
chimes commonly installed in homes.
Jaycar sells 433MHz receiver and
transmitter modules. I don’t know
what decoder/encoder I need for this
project. I am open to suggestions.
(Anthony, via email)
● We have published a suitable
project in the January 2009 issue,
titled “433MHz UHF Remote Switch”
(siliconchip.au/Article/1284). That
back issue is still available to order,
and programmed microcontrollers
for this project are available from
our Online Shop at siliconchip.au/
SC
Shop/?article=1284
siliconchip.com.au
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