Silicon ChipPractically Speaking - April 2020 SILICON CHIP
  1. Outer Front Cover
  2. Contents
  3. Subscriptions: PE Subscription
  4. Publisher's Letter
  5. Feature: NEWS
  6. Feature: Techno Talk by Mark Nelson
  7. Feature: Net Work by Alan Winstanley
  8. Project: Ultra-low-distortion Preamplifier with Tone Controls by John Clarke
  9. Project: iCEstick by Tim Blythman
  10. Back Issues: BACK ISSUES ON CD-ROMS by Jim Rowe
  11. Project: FLIP DOT DISPLAY by TIM BLYTHMAN
  12. Feature: Circuit Surgery by IAN BELL
  13. Feature: Practically Speaking
  14. Feature: Make it with Micromite by Phil Boyce
  15. Feature: AUDIO OUT by Jake Rothman
  16. Feature: Visual programming with XOD by Julian Edgar
  17. Feature: Max’s Cool Beans by Max the Magnificent
  18. PCB Order Form
  19. Advertising Index

This is only a preview of the April 2020 issue of Practical Electronics.

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Articles in this series:
  • (April 2020)
  • (April 2020)
  • Techno Talk (May 2020)
  • Techno Talk (May 2020)
  • Techno Talk (June 2020)
  • Techno Talk (June 2020)
  • Techno Talk (July 2020)
  • Techno Talk (July 2020)
  • Techno Talk (August 2020)
  • Techno Talk (August 2020)
  • Techno Talk (September 2020)
  • Techno Talk (September 2020)
  • Techno Talk (October 2020)
  • Techno Talk (October 2020)
  • (November 2020)
  • (November 2020)
  • Techno Talk (December 2020)
  • Techno Talk (December 2020)
  • Techno Talk (January 2021)
  • Techno Talk (January 2021)
  • Techno Talk (February 2021)
  • Techno Talk (February 2021)
  • Techno Talk (March 2021)
  • Techno Talk (March 2021)
  • Techno Talk (April 2021)
  • Techno Talk (April 2021)
  • Techno Talk (May 2021)
  • Techno Talk (May 2021)
  • Techno Talk (June 2021)
  • Techno Talk (June 2021)
  • Techno Talk (July 2021)
  • Techno Talk (July 2021)
  • Techno Talk (August 2021)
  • Techno Talk (August 2021)
  • Techno Talk (September 2021)
  • Techno Talk (September 2021)
  • Techno Talk (October 2021)
  • Techno Talk (October 2021)
  • Techno Talk (November 2021)
  • Techno Talk (November 2021)
  • Techno Talk (December 2021)
  • Techno Talk (December 2021)
  • Communing with nature (January 2022)
  • Communing with nature (January 2022)
  • Should we be worried? (February 2022)
  • Should we be worried? (February 2022)
  • How resilient is your lifeline? (March 2022)
  • How resilient is your lifeline? (March 2022)
  • Go eco, get ethical! (April 2022)
  • Go eco, get ethical! (April 2022)
  • From nano to bio (May 2022)
  • From nano to bio (May 2022)
  • Positivity follows the gloom (June 2022)
  • Positivity follows the gloom (June 2022)
  • Mixed menu (July 2022)
  • Mixed menu (July 2022)
  • Time for a total rethink? (August 2022)
  • Time for a total rethink? (August 2022)
  • What’s in a name? (September 2022)
  • What’s in a name? (September 2022)
  • Forget leaves on the line! (October 2022)
  • Forget leaves on the line! (October 2022)
  • Giant Boost for Batteries (December 2022)
  • Giant Boost for Batteries (December 2022)
  • Raudive Voices Revisited (January 2023)
  • Raudive Voices Revisited (January 2023)
  • A thousand words (February 2023)
  • A thousand words (February 2023)
  • It’s handover time (March 2023)
  • It’s handover time (March 2023)
  • AI, Robots, Horticulture and Agriculture (April 2023)
  • AI, Robots, Horticulture and Agriculture (April 2023)
  • Prophecy can be perplexing (May 2023)
  • Prophecy can be perplexing (May 2023)
  • Technology comes in different shapes and sizes (June 2023)
  • Technology comes in different shapes and sizes (June 2023)
  • AI and robots – what could possibly go wrong? (July 2023)
  • AI and robots – what could possibly go wrong? (July 2023)
  • How long until we’re all out of work? (August 2023)
  • How long until we’re all out of work? (August 2023)
  • We both have truths, are mine the same as yours? (September 2023)
  • We both have truths, are mine the same as yours? (September 2023)
  • Holy Spheres, Batman! (October 2023)
  • Holy Spheres, Batman! (October 2023)
  • Where’s my pneumatic car? (November 2023)
  • Where’s my pneumatic car? (November 2023)
  • Good grief! (December 2023)
  • Good grief! (December 2023)
  • Cheeky chiplets (January 2024)
  • Cheeky chiplets (January 2024)
  • Cheeky chiplets (February 2024)
  • Cheeky chiplets (February 2024)
  • The Wibbly-Wobbly World of Quantum (March 2024)
  • The Wibbly-Wobbly World of Quantum (March 2024)
  • Techno Talk - Wait! What? Really? (April 2024)
  • Techno Talk - Wait! What? Really? (April 2024)
  • Techno Talk - One step closer to a dystopian abyss? (May 2024)
  • Techno Talk - One step closer to a dystopian abyss? (May 2024)
  • Techno Talk - Program that! (June 2024)
  • Techno Talk - Program that! (June 2024)
  • Techno Talk (July 2024)
  • Techno Talk (July 2024)
  • Techno Talk - That makes so much sense! (August 2024)
  • Techno Talk - That makes so much sense! (August 2024)
  • Techno Talk - I don’t want to be a Norbert... (September 2024)
  • Techno Talk - I don’t want to be a Norbert... (September 2024)
  • Techno Talk - Sticking the landing (October 2024)
  • Techno Talk - Sticking the landing (October 2024)
  • Techno Talk (November 2024)
  • Techno Talk (November 2024)
  • Techno Talk (December 2024)
  • Techno Talk (December 2024)
  • Techno Talk (January 2025)
  • Techno Talk (January 2025)
  • Techno Talk (February 2025)
  • Techno Talk (February 2025)
  • Techno Talk (March 2025)
  • Techno Talk (March 2025)
  • Techno Talk (April 2025)
  • Techno Talk (April 2025)
  • Techno Talk (May 2025)
  • Techno Talk (May 2025)
  • Techno Talk (June 2025)
  • Techno Talk (June 2025)
  • Techno Talk (July 2025)
  • Techno Talk (July 2025)
Practically Speaking Hands-on techniques for turning ideas into projects – by Mike Hibbett Introduction to surface mount technology – Part 1 O ver the years that this magazine has been in circulation – the first issue came out in 1964 – our projects have been based on a wide variety of electronic components and soldering techniques. Integrated circuits were not widely available in 1964, certainly not for hobbyists; and in the early days we soldered components between lugs on a pegboard, often leaving the components in the air. We certainly used transistors, but also valves (‘tubes’ for our US friends), which were so large they needed metal work to support them. In those days, some projects were as much mechanical construction as electrical! It’s difficult to accurately define when electronic components were first introduced to the public; it very much depends on your definition of an ‘electronic component’. Leyden jar ‘capacitors’ probably come first (18th century), acting as a primitive electrical power source – but they were important because a circuit cannot function without a power supply. These were followed by piles (early batteries), coils, including transformers, and large plate capacitors, all used extensively by scientists like Faraday, Hertz and later Marconi to create early communication technologies such as telephone, data transmission via Morse code and radio. The invention of vacuum tube diodes and then triodes using thermionic emission technology (based on X-ray tube and light bulb research) ushered in what we would now call ‘electronics’, ultimately leading to the birth of what we recognise as our hobby in the late 1920s. The Second World War was a huge impetus to electronics. The mass production of radio, radar, electronic proximity fuses and a whole host of other devices spurred research that led to huge improvements in electronic component size, quality and price. Early kits Fig.1. Old-school construction – (top) part of a power amplifier built without the benefit of a PCB (photo courtesy of Alan Winstanley); (bottom) an example of a 1962 home project – a Heathkit Visual-Aural Signal Tracer Model IT-12. Practical Electronics | April | 2020 Jut like today, early hobbyists were expected to assemble circuits themselves, and kits by companies like Heathkit (who formed in the years after the Second World War) were based on designs created from the surplus of ex-military components sold at low cost at the end of the war. The Heathkit assembly manuals from those days were works of art; their kits include products ranging from Morse code audio oscillators up to televisions and oscilloscopes. Even 30 years later in the 1970s with advanced production technologies available, radically new electronic products were still being offered in kit form – the Acorn System 1 computer being one example (the author still has his.) The mechanical structure of electronic components has changed enormously over the years. Initially, circuits were based around glass tubes with pins designed for large sockets, or large component packages with long wires, these devices were ideally suited to circuit assembly that more reflected a mechanical assembly project than the designs we build today. Anyone who has seen 49 a 1960s Heathkit assembly manual, like the one in Fig.1, will understand. And the tools we needed to assemble these projects were huge. Not to mention the need to wear a tie like the chap in Fig.2! (For younger readers, in those days it was not uncommon for manual workers to wear two or three-piece suits.) Over the years components became smaller, wirewrap board assembly and eventually PCB manufacturing processes became available. The vital pivot to the consumer industry however was when surface-mount components and production techniques became available. Automation Circuits based on valve technology could be assembled only by hand. Even with today’s technology, robotic point-to-point wiring would be a harder problem to automate than driving a car. The precision required to solder point-to-point wired circuits would be at the millimetre level in a three dimensional space. Automated cars are required to navigate roads at the centimetre level. And they are not able to do that reliably yet. With the introduction of surface-mount components, component part sizes and even the reels that they are supplied on became standardised. That standardisation meant that the designers of machines that will hold, dispense, pick up and place components could be built to a common standard – a standard used by all component suppliers. This focused academic and industrial research into efficient tools to do the job, and with all manufacturers adopting those common standards, there was a business case to justify the R&D investment. If the market had been fragmented by a large number of proprietary component size and delivery packages, automation advances would simply not have been as financially viable, and technology improvements not as fast. As the accuracy of automated pick-andplace machines has improved over the years, the size of components that can be automatically placed has been reduced, significantly. A 4.7kΩ 1/8-watt wire-ended resistor that we all know and love is not the size it is because it needs to be; as can be seen in Fig.3, it can be a lot smaller – and this is not the smallest size an automated pick and place machine can work with! The wire-ended component is this size because of the wires, nothing else. It’s true that for specialised components, working at very high voltages or very high wattage rating, their sizes will be larger – but the vast majority of components placed on circuits for consumer products work at very low voltages and very low power ratings, and these components can be incredibly small, while 50 Fig.2. Building a circuit 1965-style. Want to be on the cover – make sure you wear a tie! (For the benefit of younger and foreign readers, the 1965 price of ‘2'6’ is 12.5p, or £0.125!) still reliably placed by machines onto a printed circuit board (PCB). The rise of SMD The use of surface-mount components (SMD) also results in a significant reduction in the size of the PCB, with a corresponding reduction in weight (if that is important,) and cost, which is always important. With less weight and closer contact to a PCB, SMD components are less susceptible to mechanical stresses, assuming they have been soldered to the PCB correctly in the first place. With smaller components the soldering process itself becomes a critical part of the overall production process. Academic and industrial research has focused on this for decades, covering:  Component size standardisation  Component solder pad design  Solder mask  Solder paste  Component placement  Soldering process Let’s cover each of those in turn. The first two points are basically the same; if component manufacturers agree on standard component sizes, engineers spend less time designing new footprints for the components they add to their PCBs. The resulting world-wide agreements has had a major impact beyond saving engineers a few hours effort. Optimisation of soldering processes and general reliability improvements has been far more effective and quickly adopted when all companies are able to focus on the same problem. Even minor improvements in the design of a solder pad shape, if it improves soldering reliability by a fraction of 1%, can have a huge impact when every company in the world is using the same design, and can make the same changes. This is the power of standardisation! Solder mask The solder mask is a solder-resisting film layer applied to the PCB during manufacture. It is automatically calculated Practical Electronics | April | 2020 Fig.3. Wire-ended components verses their SMD equivalents: exactly the same device, very different packaging. by your CAD program based on the standard component outlines that you place on your PCB; it’s not something you have to create yourself. The solder mask is a coloured layer (you get to choose the colour) that both protects the copper traces from corrosion and also acts as a repellent to solder – forcing any solder that wants to ‘creep’ between two tracks away, back to the pad they are supposed to melt on. This is hugely important as component solder pads get closer together. Solder paste The solder paste layer is again a layer that is created automatically for you based on the components you place. It defines the areas on your PCB that should be left exposed for the application of a thin layer of solder paste. While it is possible to add solder paste to PCBs by hand, it is of course far more preferable to be able to apply the paste automatically, or at least by a more efficient process. The solder paste layer is a collection of polygons that define where the solder paste should be deposited; PCB manufacturers take this layer and laser cut a sheet of thin steel with these holes. Then, using the age-old process of screen printing, the thin sheet of steel is placed over the PCB and a squeegee is used – by a robot or manually – to apply a thin coat of solder paste to the PCB. Ink-jet-style printers are now available to do this task, but manual application is still common. Component placing Next, components need to be added to the PCB using very fast pick-and-place machines. I could write a whole article on these fascinating robots, which can place parts from reels or ‘sticks’ of parts at up to 100,000 parts per hour and to an accuracy of within 25µm. They typically represent 50% of the outlay for a complete production line. For the hobbyist side of things they come free – it’s you! Practical Electronics | April | 2020 Soldering process The soldering process itself has many critical parameters. The solder paste, consisting of tiny balls of solder in a flux paste, must be heated to a point where the flux melts, time allowed for the flux to clean the surfaces, then the temperature is raised again to melt the solder, and time allowed for the solder to flow over the component and the PCB pad. This process depends on many factors, including the size of the component, it’s shape, and how much of a ‘heat sink’ effect the PCB traces connecting to the component have. These problems have been studied for decades, and the results shared, driving subtle changes to the temperatures used, the cycle times and the specific layout of ground pads on components. It’s wonderful that this knowledge has been shared rather than tied down in patents and copyrights. While this all sounds very complicated, the process is actually very easy to use at home. With low-cost PCB manufacture available in Asia, it’s possible to order 10 complex double-sided PCBs with a laser-cut solder paste stencil for less than £30 (US$40). Solder paste can be purchased in small quantities from the usual electronics distributors, and while it has a limited shelf life, for hobbyists a small 30g tub of paste can be stored in the fridge for one to two years – if your partner will tolerate it! The re-flow oven used by electronics assembly companies can be replaced by a simple desktop convection oven, costing around £40 (US$52). A re-flow timer controller can be added for about $50 (US$65), less if you build one yourself. These are simple devices that will last for decades and are worth the investment if you expect to be making many boards, or would simply like to make assembling surface-mount PCB easier. This approach to SMD component assembly is well suited to the hobbyist, but if you are looking to expand, perhaps manufacture hundreds of PCBs, then there are better alternatives to simply getting a professional manufacturer to assemble you boards. Automated ‘Pick and Place’ machines have been created by amateurs and small companies that can place components on PCBs at high rates, yet the equipment is low cost – around €1700 for a machine equipped with an AI-based vision system to accurately place components (see: www.liteplacer.com). These kind of machines are only suited to very low production volumes, but they give the benefit of enabling you to quickly produce a large number of PCBs, albeit with a fair amount of post-production ‘touching up’ (error correction) required. They are desktop machines, and significantly cheaper than the £100k machines used by regular PCB assembly companies. The development and improvement of these machines has been driven by the open-source community, a group of people keen to expand their experience while sharing it with others. It’s through this community that small cottage industry companies have been able to create useful, technologically advanced machines that can help budding entrepreneurs grow their businesses. Practical Electronics magazine has been in print for 56 years. Ownership may have changed; staff have left or passed on. Over that time the magazine has carried the electronics hobbyist tradition across the era of valves/tubes wired to Paxalon, point-to-point wired components through to robot-assembled surface-mount components measuring just a few millimetres across. It makes us wonder what (and how) hobbyists 50 years hence will be assembling! Summary Next time in Practically Speaking we will look at passive surface-mount parts, including sockets and switches, and the challenges involved in choosing and placing them on a PCB, both automatically and by hand. 51