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40-pin male snappable header A 40-pin snappable header which can be broken or cut apart and soldered to any of the SMD adaptor PCBs to make a SIL/DIL device.
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Eight SMD passive/diode/LED adaptor PCB A small board to which up to eight SMD parts in 2012/1608/1206(metric) or 0805/0603/0402(imperial) packages can be soldered, converting them to a 0.1" 16-pin DIL array, suitable for breadboarding and prototyping. SMD components can be fitted to the top and bottom of the PCB, allowing up to two components to be paralleled for each pair of pads. For example, this would be useful for connecting high-value SMD ceramic capacitors to a breadboard. No through-hole pins are supplied; they are available separately.
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SOT-23/SC-70 SMD adaptor PCB A small board to which an SMD semiconductor part can be soldered, converting it to a 0.1" 3-pin SIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD components:
Two different sets of pads are supplied to suit different package sizes and soldering techniques, on either side of the board. No through-hole pins are supplied; they are available separately.
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SOT-89/SOT-223 SMD adaptor PCB A small board to which an SMD semiconductor part can be soldered, converting it to a 0.1" 3-pin SIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD components:
SOT-89 parts are soldered to one side, SOT-223. No through-hole pins are supplied; they are available separately.
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SOIC-8/SOP-8/SSOP-8/TSSOP-8/MSOP-8 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a standard 0.3" 8-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
SOIC/SOP parts are soldered to one side, SSOP/TSSOP/MSOP to the other. No through-hole pins are supplied; they are available separately.
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SOIC-8/SOP-8 SMD adaptor PCB with thermal pad A small board to which an SMD IC can be soldered, converting it to a standard 0.3" 8-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
There is a small copper pad on the bottom of the adaptor for heatsinking the chip. No through-hole pins are supplied; they are available separately.
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MSOP-10/SOT-23-10 SMD adaptor PCB A small board to which an SMD IC or semiconductor device can be soldered, converting it to a 0.6" 10-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD devices:
SOT-23 parts are soldered to one side, MSOP to the other. No through-hole pins are supplied; they are available separately.
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DFN-10/MSOP-10/eMSOP-10 SMD adaptor PCB A small board to which an SMD semiconductor part can be soldered, converting it to a 0.1" 10-pin SIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD components:
Two extra through-hole pads are provided at each end of the adaptor which connect to the ground plane underneath the IC. No through-hole pins are supplied; they are available separately.
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SOIC-14/SOP-14/SSOP-14/TSSOP-14 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.6" 14-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
SOIC/SOP parts are soldered to one side, SSOP/TSSOP/MSOP to the other. No through-hole pins are supplied; they are available separately.
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SOIC-16/SOP-16/SSOP-16/TSSOP-16 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.6" 16-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
SOIC/SOP parts are soldered to one side, SSOP/TSSOP/MSOP to the other. No through-hole pins are supplied; they are available separately.
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SOIC-20/SOP-20/SSOP-20/TSSOP-20 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.6" 20-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
SOIC/SOP parts are soldered to one side, SSOP/TSSOP/MSOP to the other. No through-hole pins are supplied; they are available separately.
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SOIC-24/SOP-24/SSOP-24/TSSOP-24 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.6" 24-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
SOIC/SOP parts are soldered to one side, SSOP/TSSOP/MSOP to the other. No through-hole pins are supplied; they are available separately.
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SOIC-28/SOP-28/SSOP-28/TSSOP-28 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.7" DIL format, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
SOIC/SOP parts are soldered to one side, SSOP/TSSOP/MSOP to the other. No through-hole pins are supplied; they are available separately.
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SOIC-32 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.9" 32-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
This board will also accept a 1.27mm-pitch pin header with one or two rows and up to 16/32 pins and adapt it to 2.54mm pitch. No through-hole pins are supplied; they are available separately.
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SOIC-56/TSSOP-II-56 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a through-hole device, suitable for prototyping. This adaptor accepts the following types of SMD ICs (typically used for RAM):
The 56 pins are broken out to two double rows of 14 pins on each side with a standard 0.1" pitch. SOIC/SOP parts are soldered to one side, TSSOP-II to the other. No through-hole pins are supplied; they are available separately.
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QFN-16/LGA-16 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.3" 16-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
QFN parts are soldered to one side, LGA to the other. A central pad is provided for parts with a thermal pad on the underside, although there is no provision to make an electrical connection to it. No through-hole pins are supplied; they are available separately.
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QFN-20 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.3" 20-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
Parts are soldered to one side of the PCB or the other, depending on pin spacing. A central pad is provided for parts with a thermal pad on the underside, with electrical connection to it possible by soldering a wire to the central pad on the opposite side. No through-hole pins are supplied; they are available separately.
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QFN-32/QFN-40 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.3" 32-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
Parts are soldered to one side of the PCB or the other, depending on the number of pins. Note that for 40-pin devices, the through-hole pins form a rectangle and so would need to be connected to flying leads for use with a breadboard. No through-hole pins are supplied; they are available separately.
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QFP-32/TQFP-32/LQFP-32/EQFP-32 SMD adaptor PCB with ground plane & passive component mounting pads A small board to which an SMD IC can be soldered, converting it to a 0.6" 32-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
The IC is soldered to one side of the PCB. The other side contains a ground plane and pads for 1608(metric)/0603(imperial) or 1005(metric)/0402(imperial) passive components such as resistors or capacitors to connect from each pin to ground. There is a small ground pad under the IC to which it can be soldered if it has a thermal pad on the underside, plus a ground connection/test point at each end of the PCB. No through-hole pins are supplied; they are available separately.
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QFP-44/TQFP-44/LQFP-44/EQFP-44 SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a 0.6" 44-pin DIL through-hole package, suitable for breadboarding and prototyping. This adaptor accepts the following types of SMD ICs:
Note that due to the limited amount of space on the board, in order to allow it to fit in a standard DIL footprint, pins 8-15 and 30-37 do not have through-hole pads. Instead, right-angle headers can be surface-mounted to the underside of the board. No through-hole pins are supplied with this board.
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QFP-32 to QFP-100/QFP-64 0.5mm/0.8mm SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a through-hole package, suitable for prototyping. This adaptor accepts the following types of SMD ICs:
0.5mm pitch ICs are soldered to one side of the board while 0.8mm pitch ICs are soldered to the other. Note that the through-hole pins are arranged in double rows on both sides so would suit standard protoboard/veroboard but not solderless breadboard. No through-hole pins are supplied; they are available separately.
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QFP 16 to 80 pin 0.4/0.5/0.65mm SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a through-hole package, suitable for prototyping. This adaptor accepts the following types of SMD ICs:
Parts are soldered to one side of the PCB or the other, depending on the pitch. Note that the through-hole pins are arranged in double rows on both sides so would suit standard protoboard/veroboard but not solderless breadboard. No through-hole pins are supplied; they are available separately.
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QFP-128/QFP-144 0.5mm SMD adaptor PCB A small board to which an SMD IC can be soldered, converting it to a through-hole package, suitable for prototyping. This adaptor accepts the following types of SMD ICs:
Pads are provided on the underside to solder 1608/1206(metric) or 0603/0402(imperial) passives between each IC pin and ground. For example, these could be used for bypass capacitors. A central pad is provided in case the IC has a ground pad on the underside. This connects to a large ground plane on the under-side of the PCB and two large ground solder pads plus twelve smaller ground points are provided in each corner of the PCB. Note that the through-hole pins are arranged in double rows on both sides so would suit standard protoboard/veroboard but not solderless breadboard. No through-hole pins are supplied; they are available separately.
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