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PRODUCT SHOWCASE Largest Electronex Expo yet coming to Melbourne this May Electronex – The Electronics Design and Assembly Expo is almost sold out and has been enthusiastically supported by local and international exhibitors. It will be the largest show since the inaugural event in 2010, with over 100 companies represented. Exhibitions are experiencing strong growth post-COVID as businesses welcome the return of face-to-face discussions of their specific requirements with suppliers and industry experts. At the Melbourne Convention and Exhibition Centre on the 10th & 11th of May 2023, Electronex is Australia’s major exhibition for companies using electronics in design, assembly, manufacture and service. In another first, Electronex will be co-located with Australian Manufacturing Week, with trade visitors able to visit both events on either day, to see the entire spectrum of the latest products, technology and turnkey solutions for the electronics and manufacturing sectors. Many of the exhibitors will be launching and showcasing new products and technology. The next issue of Silicon Chip (May 2023) will include a full show feature article with the exhibitor list and new product highlights. The SMCBA Electronics Design and Manufacture Conference will be held concurrently, featuring technical workshops from international and local experts. 98% of visitors to the previous Melbourne event in 2019 said Electronex was beneficial for their industry, so don’t miss it! Visitors can register for free at www.electronex. com.au SMCBA conference topics & speaker overview Keynote Speaker – Cheryl Tulkoff Cheryl is an experienced executive director, teacher and author with over 30 years of experience in electronics manufacturing establishing policies, processes, and procedures aimed at exceeding corporate quality goals. Focusing on reliability and failure analysis, Cheryl is passionate about accelerated product development while improving reliability, optimising resources and improving customer satisfaction. 92 Silicon Chip The keynote “Securing the Electronics Future: Technological Sovereignty Through Innovation & Collaboration” will emphasise the importance of developing secure, reliable and sustainable electronics manufacturing. It will also investigate the need for increased international cooperation between industry, government, and academia to promote innovation. Ultimately, by working together to advance the electronics industry, we can create a more secure and prosperous future for all. Cheryl will also present “The ABCs of DfX in Electronics Manufacturing”. Design for Excellence (DfX) is based on the concept that optimising a product early in the design process is far more effective than addressing problems later. Do some of your design practices limit long-term product success? Is the design process focused solely on meeting a narrow set of defined requirements? Having a broad knowledge of the entire product life cycle – from cradle to grave – dramatically improves productivity, reliability, and sustainability. Common barriers and mistakes will be discussed, along with practices that can be immediately implemented. Phil Zarrow – ITM Consulting In over 30 years of consulting, Phil Zarrow and Jim Hall of ITM Consulting have just about seen it all! You may be familiar with their popular podcast, Board Talk, which addresses industry issues with deep understanding and a sense of humour. Join the “Assembly Brothers” for “SMT Assembly Troubleshooting and Process Optimization”, a journey through troubleshooting the most common defects in SMT with an emphasis on identifying the fundamental root causes and an entertaining overview of SMT assembly process optimisation techniques. Jasbir Bath – Bath Consultancy Jasbir has over 25 years of experience in research, design, development and implementation in the areas of soldering, Australia's electronics magazine siliconchip.com.au surface mount and packaging technologies. He will present “SMT Process Setup”, focusing on the solder paste printer, ensuring correct printing, ensuring the printed paste volume is in the correct range and setting up the reflow oven to ensure the correct reflow profile. Inspection/test equipment during manufacturing will be discussed, including SPI, AOI, X-ray and ICT. Jasbir will also speak on “SMT Process Development”, including the optimisation of printing of solder paste for different components on the board and developing the reflow profile to reduce soldering defects. Audra McCarthy, CEO of Defence Teaming Centre Inc The Defence Teaming Centre Inc is Australia’s peak defence industry body connecting, developing and advocating for Australia’s defence industry. Audra will present “The role of the Australian electronics sector in establishing a sovereign defence industry capability”. She has experience working across the defence industry sector, having previously worked for the Department of Defence, “primes” and small businesses. She has an excellent understanding of the complex challenges impacting the defence sector and its various stakeholders. The full conference program can be viewed at www. smcba.asn.au/conference Australasian Exhibitions and Events Pty Ltd Suite 11, Pier 35-263 Lorimer St, Port Melbourne VIC 3207 Tel: (03) 9676 2133 mail: ngray<at>auexhibitions.com.au www.auexhibitions.com.au | www.electronex.com.au Infineon XENSIV sensor kits Unit 1901-1906, 19/F LU Plaza, 2 Wing Yip Street, Kowloon, Hong Kong Phone: +852 3756 4700 www.mouser.com siliconchip.com.au Microchip’s PolarFire FPGAs and SoCs deliver up to two times the performance per watt compared to competitive devices. The thermal images opposite show the power and heat dissipation when identical designs are run on the PolarFire (top) and a competing FPGA (bottom). PolarFire SoCs and FPGAs demonstrate far superior thermal performance over the operating temperature range. The chart below shows a stable power and thermal performance of PolarFire SoC FPGAs while a competing SoC FPGA demonstrates a thermal runaway at a 60˚C ambient temperature. Failure In Time (FIT) rate grows exponentially over temperature; the low power consumption of PolarFire SoCs and FPGAs delivers superior FIT rates. PolarFire SoCs deliver significant power savings while outperforming SRAM-based SoC FPGAs over the operating temperature range. While consuming 1.3W (dashed yellow vertical line) PolarFire SoCs deliver 6000 CoreMarks whereas competing SRAM based SoC FPGAs deliver 0. Low power advantages of PolarFire SoCs and FPGAs include: • Save up to US$1.5/W (fan-less and heatsink-less designs) • Enable power- and thermal-constrained applications • Create smaller industrial designs • Achieve lower FIT rates with lower thermals Eliminating fans reduces cost and increases system reliability. Total Power Consumption (mW) Power Comparison vs Ambient Temperature 8000 7000 6000 5000 4000 Polarfire 3000 Competitor 2000 1000 0 0 20 40 60 80 100 Ambient Temperature, °C CoreMarks / mW 9000 8000 7000 CoreMarks Mouser Electronics is now stocking the XENSIV KIT CSK PASCO2 and KIT CSK BGT60TR13C 60GHz radar connected sensor kits (CSK) from Infineon Technologies. The XENSIV CSK provide a ready-to-use sensor development platform for IoT devices. The CSK platform enables the creation of new prototype ideas based on Infineon sensors, including radar, environmental sensors and others. Combining sensors, microcontrollers and secure connectivity for a prototype can become a resource-intensive process. The CSK platform solves this by combing XENSIV sensors with power-efficient, high-performance processing based on an Infineon PSoC 6 microcontroller. An OPTIGA Trust M security controller enables secure connectivity. The modular board design of the CSK is compatible with the Adafruit Feather form factor, allowing the user to prototype solutions for various sensor use cases, for example, battery-powered smart home applications. The XENSIV CSK is currently available from Mouser. To learn more about the CSKs, visit: siliconchip.au/link/abjx siliconchip.au/link/abjy Mouser Electronics (HK) Ltd. PolarFire SoC and FPGAs for the lowest total power solution 6000 5000 4000 3000 2000 1000 0 0 500 1000 1500 2000 2500 3000 3500 Power (mW) MPFS095T 2xCortex A9 2xCortex A9 2xCortex A53 Microchip Technology Australia Suite 32, 41 Rawson Street, Epping NSW 2121 Phone: (02) 9868 6733 www.microchip.com Australia's electronics magazine April 2023  93