Silicon ChipProduct Showcase - August 2019 SILICON CHIP
  1. Outer Front Cover
  2. Contents
  3. Publisher's Letter: Jaycar Maker Hubs bring great possibilities / New Micromite V3 BackPack will be the standard
  4. Feature: Fluid logic, Fluidics and Microfluidics by Dr David Maddison
  5. Feature: We visit the new “maker hub” concept by Jaycar by Tim Blythman
  6. Project: Micromite LCD BackPack Version 3 by Tim Blythman
  7. Feature: Canberra’s Vintage Radio “MegaFest” by Richard Begbie and Kevin Poulter
  8. Project: “HEY! THE SIGN SAYS NO JUNK MAIL!” by Allan Linton-Smith
  9. Product Showcase
  10. Serviceman's Log: Remaking a ‘vintage’ guitar FX pedal by Dave Thompson
  11. Feature: First look: the new Raspberry Pi 4B by Tim Blythman
  12. Project: Car Radio Head Unit Dimmer Adaptor by John Clarke
  13. Feature: Quantum-dot Cellular Automata by Dr Sankit Ramkrishna Kassa
  14. Project: Discrete Logic Random Number Generator by Tim Blythman
  15. Subscriptions
  16. Vintage Radio: 1924 RCA AR-812 superhet radio receiver by Dennis Jackson
  17. PartShop
  18. Market Centre
  19. Advertising Index
  20. Notes & Errata: Versatile Trailing Edge Dimmer, February-March 2019; Low-power AM Transmitter, March 2018; LifeSaver For Lithium & SLA Batteries, September 2013
  21. Outer Back Cover: Hare&Forbes MachineryHouse

This is only a preview of the August 2019 issue of Silicon Chip.

You can view 47 of the 112 pages in the full issue, including the advertisments.

For full access, purchase the issue for $10.00 or subscribe for access to the latest issues.

Articles in this series:
  • We visit the new “maker hub” concept by Jaycar (August 2019)
  • We visit the new “maker hub” concept by Jaycar (August 2019)
  • Follow up: Arduino Day at Jaycar’s Maker Hub! (June 2020)
  • Follow up: Arduino Day at Jaycar’s Maker Hub! (June 2020)
Items relevant to "Micromite LCD BackPack Version 3":
  • Micromite LCD BackPack V3 PCB [07106191] (AUD $7.50)
  • PIC16F1455-I/P programmed for the Microbridge [2410417A.HEX] (Programmed Microcontroller, AUD $10.00)
  • PIC32MX170F256B-50I/SP programmed for the Micromite Mk2 plus capacitor (Programmed Microcontroller, AUD $15.00)
  • DS3231 real-time clock IC (SOIC-16) (Component, AUD $7.50)
  • 3.5-inch TFT Touchscreen LCD module with SD card socket (Component, AUD $35.00)
  • GY-68 Barometric Pressure/Altitude/Temperature I²C Sensor breakout board (Component, AUD $2.50)
  • DHT22/AM2302 Compatible Temperature and Humidity sensor module (Component, AUD $9.00)
  • 23LC1024 128kB (1Mb) RAM (SOIC-8) (Component, AUD $6.00)
  • AT25SF041(B) 512KB flash (SOIC-8) (Component, AUD $1.50)
  • 10uF 16V X7R ceramic through-hole capacitor (Component, AUD $1.00)
  • 22uF 6.3V X7R ceramic through-hole capacitor (Component, AUD $1.50)
  • GY-BM BMP280 module (Component, AUD $5.00)
  • GY-BME280 Barometric Pressure/Altitude/Temperature/Humidity I²C Sensor breakout board (Component, AUD $12.50)
  • Micromite LCD BackPack V3 complete kit (Component, AUD $75.00)
  • Matte/Gloss Black UB3 Lid for Micromite LCD BackPack V3 or Pico BackPack using 3.5in screen (PCB, AUD $5.00)
  • Software for the Microbridge (Free)
  • Firmware (HEX) file and documents for the Micromite Mk.2 and Micromite Plus (Software, Free)
  • Demonstration software for the Micromite LCD BackPack V3 (Free)
  • Micromite LCD BackPack V3 PCB pattern (PDF download) [07106191] (Free)
Items relevant to "“HEY! THE SIGN SAYS NO JUNK MAIL!”":
  • ISD1820-based voice recording and playback module (Component, AUD $7.50)
Items relevant to "Car Radio Head Unit Dimmer Adaptor":
  • Radio Head Unit Dimmer Adaptor PCB [05107191] (AUD $5.00)
  • PIC12F617-I/P programmed for the Radio Head Unit Dimmer Adaptor [0510619A.HEX] (Programmed Microcontroller, AUD $10.00)
  • Firmware (ASM and HEX) files for the Radio Head Unit Dimmer Adaptor [0510619A.HEX] (Software, Free)
  • Radio Head Unit Dimmer Adaptor PCB pattern (PDF download) [05107191] (Free)
  • Radio Head Unit Dimmer Adaptor lid panel artwork (PDF download) (Free)
Articles in this series:
  • Quantum-dot Cellular Automata (August 2019)
  • Quantum-dot Cellular Automata (August 2019)
  • Follow-up: Quantum-dot Cellular Automata (February 2021)
  • Follow-up: Quantum-dot Cellular Automata (February 2021)
Items relevant to "Discrete Logic Random Number Generator":
  • Pseudo-random number generator (LFSR) PCB [16106191] (AUD $5.00)
  • Pseudo-random number generator (LFSR) PCB pattern (PDF download) [16106191] (Free)

Purchase a printed copy of this issue for $10.00.

PRODUCT SHOWCASE Largest high-definition ’scopes in their class The new 4-Series MSO and 3-Series MDO oscilloscopes from Tektronix offer more display, more signals, more resolution and advanced capabilities. Both have the largest capacitive touch screens in their class. The 200MHz-1.5GHz 4-Series Mixed Signal Oscilloscope has a 33.75cm HD (1920 x 1080) capacitive touch display with up to six analog and digital FlexChannel inputs with 12-bit vertical resolution; up to 16 bits in Hi Res models. There is support for more than 20 serial bus protocols and the 4-Series also offers an optional inbuilt function generator. The 100MHz-1GHz 3-Series Mixed Domain Oscilloscopes have a 29.5cm HD (1920 x 1080) capacitive touch screen, either two or four channels, a built-in spectrum analyser (on the 1GHz and 3GHz models) and an optional built-in function generator. They support a wide range of serial bus decoding and triggering options. For more information on the 4-Series and 3-Series ’scopes from Tektronix, visit the Vicom Australia website. Contact: Vicom Australia Pty Ltd 1064 Centre Rd, Oakleigh Sth, Vic 3167 Tel: 1300 360251 Web: www.vicom.com.au Integrated Passive Components simplify signal conditioning in package that is 20% the size Integrated Passive Components (IPCs) are attracting increasing interest due to the miniaturisation of wireless devices, as well as the need to increase reliability of signal conditioning in RF circuits such as filtering, impedance matching, differential to single ended conversion and coupling. IPCs are essentially electronic sub-systems that combine multiple discrete passive components into a single surface mounted device. Low Temperature Cofired Ceramic (LTCC) technology allows the passive components to be layered “3-dimensionally.” IPCs deliver the same functionality as 10-40 individual components. With this approach, the entire front-end between the RF chipset and the antenna can be manufactured in a single, ultra-low profile (0.35-1.0mm total thickness) package that is less than 20% the total size of the same circuit comprised of discrete components. Microchip’s new ECE1200: the first commercial eSPI-to-LPC Bridge Microchip Technology has introduced the industry’s first commercially available eSPI to LPC bridge. The ECE1200 bridge enables developers to implement the eSPI standard in boards with legacy LPC connectors and peripherals, substantially minimising development costs and risk. The ECE1200 eSPI to LPC bridge allows developers to maintain long lifecycles while supporting the eSPI bus technology that is required for new computing applications. To reduce risk for developers, the eSPI bus technology went through intensive validation for industrial computing applications and has been validated with leading processor companies. Designed for today’s eSPI requirements, Contact: the ECE1200 detects Microchip Technology Inc and supports Modern U32, 41 Rawson St, Epping NSW 2121 Standby mode with Tel: (02) 9868 6733 low standby current. Web: www.microchip.com siliconchip.com.au Using this manufacturing process, Johanson Technology has developed a line of small, highly reliable IPCs for RF systems. These components operate over several bands from 300MHz to 10GHz covering Cellular, DECT, WLAN, Bluetooth, 802.11 (a, b and g) and GPS applications. IPCs are available for almost any type of passive circuit, including low and high-pass filters, diplexers, triplexers, impedance matched baluns, balun- Contact: filters, band pass filters, Johanson Technology couplers and other cus- 4001 Calle Tecate, Camarillo, CA 93012, tom signal conditioning USA. Tel: (0011) 1 805 389 1166 Web: www.johansontechnology.com circuits. ElectroneX ’19 returns to Melbourne with new venue ElectroneX – The Electronics Design & Assembly Expo and Conference – returns to Melbourne this year on 11-12 September. However, the venue has changed: it will be in the Melbourne Conference and Exhibition Centre (MCEC). The show is on track for a sellout with more exhibitors and products than ever before. First held in 2010, ElectroneX has grown to become the preeminent exhibition for companies using electronics in design, manufacturing and assembly in Australia The SMCBA Surface Mount Conference is also held concurrently with the Expo, with a range of workshops Contact: for engineers, design- Aust. Exhibitions & Events Pty Ltd ers and manufactur- PO Box 5269, Sth Melbourne Vic 3205 ers. A comprehensive Tel: (03) 9646 9533 Design Workshop will Web: www.electronex.com.au also be held. Australia’s electronics magazine August 2019  61